CSD87330Q3D
- Half-Bridge Power Block
- Up to 27-V VIN
- 90% System Efficiency at 15 A
- Up to 20-A Operation
- High-Frequency Operation (Up to 1.5 MHz)
- High-Density SON 3.3-mm × 3.3-mm Footprint
- Optimized for 5-V Gate Drive
- Low-Switching Losses
- Ultra-Low Inductance Package
- RoHS Compliant
- Halogen Free
- Lead-Free Terminal Plating
The CSD87330Q3D NexFET™ power block is an optimized design for synchronous buck applications offering high-current, high-efficiency, and high-frequency capability in a small 3.3-mm × 3.3-mm outline. Optimized for 5-V gate drive applications, this product offers a flexible solution capable of offering a high-density power supply when paired with any 5-V gate drive from an external controller/driver.
관심 가지실만한 유사 제품
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CSD87330Q3D Synchronous Buck NexFET™ Power Block datasheet (Rev. D) | PDF | HTML | 2016/12/06 |
Application note | MOSFET Support and Training Tools (Rev. F) | PDF | HTML | 2024/06/14 | |
Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 2024/03/25 | |
Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 2023/12/06 | |
Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | 2022/05/31 | |
Selection guide | Power Management Guide 2018 (Rev. R) | 2018/06/25 | ||
Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | 2011/11/16 | ||
Application note | PowerStack™ Packaging Technology Overview | 2011/07/18 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
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SYNC-BOOST-FET-LOSS-CALC — Power Loss Calculation Tool for Synchronous Boost Converter
MOSFET power loss calculator for synchronous boost converter applications.
지원되는 제품 및 하드웨어
제품
MOSFET
SYNC-BUCK-FET-LOSS-CALC — Power Loss Calculation Tool for Synchronous Buck Converter
지원되는 제품 및 하드웨어
제품
MOSFET
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VSON-CLIP (DPB) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.