SLVAFT4C May 2024 – June 2025 ADC08D1520QML-SP , ADC10D1000QML-SP , ADC128S102QML-SP , ADC12D1600QML-SP , ADC12D1620QML-SP , ADC12DJ3200QML-SP , ADC12DJ5200-SP , ADC12QJ1600-SP , ADC14155QML-SP , ADS1278-SP , ADS1282-SP , ADS5400-SP , ADS5424-SP , ADS5444-SP , ADS5463-SP , ADS5474-SP , AM26LS33A-SP , CDCLVP111-SP , CDCM7005-SP , DAC121S101QML-SP , DAC5670-SP , DAC5675A-SP , DP83561-SP , DS16F95QML-SP , DS26F31MQML-SP , DS26F32MQML-SP , DS90C031QML-SP , DS90C032QML-SP , DS90LV031AQML-SP , DS90LV032AQML-SP , DS96F174MQML-SP , DS96F175MQML-SP , INA901-SP , LF198JAN-SP , LF198QML-SP , LF411QML-SP , LM111QML-SP , LM117HVQML-SP , LM117QML-SP , LM119QML-SP , LM124-SP , LM124AQML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM139-SP , LM139AQML-SP , LM148JAN-SP , LM158QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM193QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM6172QML-SP , LM7171QML-SP , LM723JAN-SP , LM98640QML-SP , LMH5401-SP , LMH5485-SP , LMH6628QML-SP , LMH6702QML-SP , LMH6715QML-SP , LMK04832-SP , LMP2012QML-SP , LMP7704-SP , LMX1906-SP , LMX2615-SP , LP2953QML-SP , MSP430FR5969-SP , OPA4277-SP , SE555-SP , SMJ320C6701-SP , SMV320C6727B-SP , SN54AC00-SP , SN54AC02-SP , SN54AC14-SP , SN54AC244-SP , SN54AC245-SP , SN54AC373-SP , SN54AC74-SP , SN54ACT04-SP , SN54ACT244-SP , SN54ACT245-SP , SN54ACT373-SP , SN54ACT374-SP , SN54AHC244-SP , SN54AHC245-SP , SN54AHCT08-SP , SN54AHCT14-SP , SN54ALS244C-SP , SN54HC00-SP , SN54HC02-SP , SN54HC04-SP , SN54HC08-SP , SN54HC10-SP , SN54HC109-SP , SN54HC11-SP , SN54HC132-SP , SN54HC138-SP , SN54HC139-SP , SN54HC14-SP , SN54HC153-SP , SN54HC157-SP , SN54HC161-SP , SN54HC164-SP , SN54HC166-SP , SN54HC20-SP , SN54HC244-SP , SN54HC245-SP , SN54HC273-SP , SN54HC32-SP , SN54HC373-SP , SN54HC374-SP , SN54HC573A-SP , SN54HC595-SP , SN54HC74-SP , SN54HCT04-SP , SN54HCT244-SP , SN54HCT245-SP , SN54HCT373-SP , SN54LS00-SP , SN54LS02-SP , SN54LS04-SP , SN54LS08-SP , SN54LS10-SP , SN54LS123-SP , SN54LS138-SP , SN54LS139A-SP , SN54LS14-SP , SN54LS145-SP , SN54LS161A-SP , SN54LS164-SP , SN54LS165A-SP , SN54LS193-SP , SN54LS240-SP , SN54LS244-SP , SN54LS245-SP , SN54LS26-SP , SN54LS273-SP , SN54LS32-SP , SN54LS373-SP , SN54LS393-SP , SN54LS74A-SP , SN54LVC00A-SP , SN54LVC138A-SP , SN54LVC14A-SP , SN54LVC646A-SP , SN54LVC74A-SP , SN54LVCH244A-SP , SN54LVCH245A-SP , SN54LVTH162244-SP , SN54LVTH162245-SP , SN54LVTH162373-SP , SN54LVTH162374-SP , SN54LVTH16244A-SP , SN54LVTH16245A-SP , SN54LVTH244A-SP , SN54LVTH245A-SP , SN54LVTH574-SP , SN55182-SP , SN55183-SP , SN55HVD233-SP , SN55LVCP22-SP , SN55LVCP22A-SP , SN55LVDS31-SP , SN55LVDS32-SP , SN55LVDS33-SP , THS4304-SP , THS4511-SP , THS4513-SP , TL1431-SP , TLC2201-SP , TLK2711-SP , TMP461-SP , TMP9R00-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101A-SP , TPS7H1111-SP , TPS7H1121-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3014-SP , TPS7H3301-SP , TPS7H3302-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4011-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , TPS7H6003-SP , TPS7H6005-SP , TPS7H6013-SP , TPS7H6015-SP , TPS7H6023-SP , TPS7H6025-SP , TRF0206-SP , UC1525B-SP , UC1611-SP , UC1625-SP , UC1637-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP
The MIL-PRF-38535 is a military specification standard for hermetic and non-hermetic integrated circuits. This specification covers manufacturing general, quality, and reliability requirements for aerospace and defense applications. The goal is to establish a process flow baseline for quality and performance in these high reliability scenarios. Texas Instruments developed specifications and requirements for QML products to meet a level of quality that are defined in accordance with MIL-PRF-38535. The TI supplied and DLA agreed on optimizations for QML are listed in Table 1.
Class N – Items which have been subjected to and passed all applicable requirements of MIL-PRF-38535 including TI defined qualification testing, screening testing, and Technology Conformance Inspection and Quality Conformance Inspection (TCI/QCI), and are encapsulated in plastic (TI supplied).
Class V – Products which have been subjected to and passed all applicable requirements of MIL-PRF-38535 including qualification testing, screening testing, and TCI/QCI inspections, and have been subjected to, and passed all applicable requirements of MIL-PRF-38535 in Table 1 (TI supplied).
Class P – A non-hermetic Plastic Encapsulated Microcircuit (PEM), which meets all applicable requirements of MIL-PRF-38535 including qualification, screening and TCI/QCI inspections, and all applicable requirements in Table 1 (TI supplied).
Class Y – A microcircuit employing a non-hermetic package, which meets all applicable requirements of MIL-PRF-38535 including qualification, screening and TCI/QCI inspections, and all applicable requirements in Table 1 (TI supplied).
Class Q – Items which have been subjected to and passed all applicable requirements of MIL-PRF-38535 including qualification testing, screening testing, and TCI/QCI inspections (TI supplied).
| Manufacturer | Specification | Test Optimized | Date |
|---|---|---|---|
| Texas Instruments | MIL-PRF-38535 | D-8, lid torque eliminated (all cerdip, cerflat glass sealed packages all classes) | Oct-93 |
| Texas Instruments | MIL-PRF-38535 | 100%
burn-in eliminated (all TTL, LS, STTL products line. All package
configurations.) Level B/Q only |
Jun-94 |
| Texas Instruments | MIL-PRF-38535 | Constant
acceleration eliminated (all products in the 8, 14, 16, 20, pin
DIP) Level B/Q only |
Jun-94 |
| Texas Instruments | MIL-PRF-38535 | Temperature cycles eliminated (all products in the 8, 14, 16, 20 pin DIP) | Jun-94 |
| Texas Instruments | MIL-PRF-38535 | 100%
high magnification inspection eliminated (TTL, LS, STTL, ALS HCMOS,
F, AS, and 55 series products lines. All packages configurations)
Level B/Q only |
Jun-94 |
| Texas Instruments | MIL-PRF-38535 | 100%
burn-in on certain linear product eliminated (contact TI or DLA Land
and Maritime for specific linear products) Level B/Q only |
Sep-94 |
| Texas Instruments | MIL-PRF-38535 | Group A sample testing of alpha V10, alpha I10 and various noise tests on certain linear products eliminated (contact TI or DLA Land and Maritime for specific linear products) | Sep-94 |
| Texas Instruments | MIL-PRF-38535 | Final
electrical, 25°C (ALS, AS, FAST, 54ABT32316 parent device types
eliminated) Level B/Q only |
Nov-95 |
| Texas Instruments | MIL-PRF-38535 | 100%
burn-in (HCMOS, all packages) eliminated Level B/Q only |
Feb-95 |
| Texas Instruments | MIL-PRF-38535 | 100%
burn-in (ALS, AS, FAST) eliminated Level B/Q only |
Aug-95 |
| Texas Instruments | MIL-PRF-38535 | 100%
temperature cycle (all CPAK) eliminated Level B/Q only |
Aug-95 |
| Texas Instruments | MIL-PRF-38535 | 100%
constant acceleration (all CPAK) eliminated Level B/Q only |
Aug-95 |
| Texas Instruments | MIL-PRF-38535 | 100%
-55°C screening and group A (HC and HCT) eliminated Level B/Q only |
Mar-95 |
| Texas Instruments | MIL-PRF-38535 | 100%
-55°C screening (ABT, AC, ACT, BCT) eliminated Level B/Q only |
Aug-96 |
| Texas Instruments |
MIL-PRF-38535 |
Burn-in
reduction on 4 Meg DRAM Level B/Q only |
Aug-96 |
| Texas Instruments |
MIL-PRF-38535 |
Physical dimensions (D1), moisture resistance (D3), insulation resistance (D3) (for all ceramic packages in Taiwan and Singapore facilities) eliminated | Oct-96 |
| Texas Instruments |
MIL-PRF-38535 |
Class V,
P, Y Eliminated read and record data |
May-00 |
| Texas Instruments |
MIL-PRF-38535 |
Class V
X-ray (monitor only, for glass-frit seal) |
May-00 |
| Texas Instruments |
MIL-PRF-38535 |
Class V
Eliminated Non-Destructive Bond Pull |
May-00 |
| Texas Instruments |
MIL-PRF-38535 |
Class V
Eliminated PIND and Centrifuge on all flip chip mounted die |
May-00 |
| Texas Instruments |
MIL-PRF-38535 |
100%
burn-in (selected DSP/MCU) eliminated Level B/Q only |
Jun-96 |
| Texas Instruments |
MIL-PRF-38535 |
100%
-55°C screening (selected DSP/MCU) eliminated Level B/Q only |
Jun-98 |
| Texas Instruments |
MIL-PRF-38535 |
100% X-ray eliminated on welded lid parts | Oct-07 |
| Texas Instruments |
MIL-PRF-38535 |
QCI
Group B Subgroup 1 Class V Physical Dimensions and Internal Water Vapor Performed as part of Generic Group D QCI by package family within 36 week window |
Aug-00 |
| Texas Instruments |
MIL-PRF-38535 |
QCI
Group B Subgroup 2 Class V Resistance to Solvents, Bond Strength and Die shear are done as part of Generic group B QCI by package family by week of seal. Main body 38535 group B. Internal visual and mechanical is covered by 100% pre-cap inspection. |
Aug-00 |
| Texas Instruments |
MIL-PRF-38535 |
QCI
Group B Subgroup 3 Class V Solder-ability performed as part of Generic Group B QCI by package family per week of seal. |
Aug-00 |
| Texas Instruments |
MIL-PRF-38535 |
QCI
Group B Subgroup 4 Class V Lead Integrity, Seal are performed as part of generic group D CQI by package family within 36-week window. Lid torque testing eliminated for all package families |
Aug-00 |
| Texas Instruments |
MIL-PRF-38535 |
QCI
Group B Subgroup 5 Class V End point electrical, Steady State Life and End point electrical performed as part of Wafer Lot acceptance by wafer lot |
Aug-00 |
| Texas Instruments | MIL-PRF-38535 | QCI
Group B Subgroup 6 Class V End-point electrical, temp cycle, constant acceleration, seal and endpoint electrical parameters performed as part of generic Group D QCI by package family within 36 week window |
Aug-00 |
| Legacy (National Semiconductor) | MIL-PRF-38535 | DS16F95
DS26F31 and 32 DS96F172 through 175 Level S/V only Minimum percentage of the metallization cross sectional area required over the passivation steps in Method 2018, SEM Inspection, reduced from 50% to 30% for Method 5007, Wafer Lot Acceptance |
Jun-97 |
| Legacy (National Semiconductor) | MIL-PRF-38535 | All part
numbers for Level S/V only Method 5007, parts a. and c., Thermal Stability test (C-V plot) reduced from each wafer lot to pre-designated maintenance events of the sputter metal deposition system (for example, venting, and so on.) |
Oct-99 |
| Legacy (National Semiconductor) | MIL-PRF-38535 | Metal can packages (TO-3, 5, 39, 46) | Jun-96 |
| Level B/Q only | |||
| M2001, Constant Acceleration eliminated for screen | |||
| Legacy (National Semiconductor) | MIL-PRF-38535 | Specific part numbers for Level S/V only | Nov-06 |
| Ultrasonic inspection per Method 2030 is being performed instead of Radiography on ceramic package with a copper-tungsten heat slug | |||
| Legacy (National Semiconductor) | MIL-PRF-38535 | DS26LS31 for Level B/Q only | Jul-00 |
| Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. | |||
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM124
LM139 |
Aug-00 Jan-01 |
| Level
B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM124, LM124A | Oct-02 |
| Level
B/Q only Screen for A-2, A-3 final electricals moved prior to burn-in |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | JL111, LM111 | Jun-02 |
| Level
B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM158 | Nov-02 |
| Level
B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | DS96F173 and 175 | Aug-02 |
| Level
B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | JL148,
LM148 Level B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
Nov-02 |
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM139,
LM139A Level B/Q only Screen for A-2, A-3 final electricals moved prior to burn-in |
Jan-03 |
| Legacy (National Semiconductor) | MIL-PRF-38535 |
LM741 Level B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
Jun-03 |
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM136A
Level B/Q only Screen for A-2, A-3 final electricals moved prior to burn-in LM136 Screen for 25°C, -55°C, +125°C and temperature coefficient testing can be performed prior to burn-in. LM148 Screen for -55°C, 125°C moved prior to burn-in |
Oct-05 May-06 Jun-06 |
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM723 | Nov-03 |
| Level
B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | DS26LS31 | Dec-05 |
| Level
B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
|||
| Legacy (National Semiconductor) | MIL-PRF-38535 | LM117, JL117 | May-08 |
| LM119 | |||
| Level B/Q only Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts. |
| Manufacturer | Specification | Test Optimized | Date |
|---|---|---|---|
| Texas Instruments | MIL-PRF-38535 | TI systems do not support Marking as described in Section 3.1 (p.13-14): Marking for plastic packages. Follow TI Standard Marking/Symbolization. Actual product symbolization can be documented in the SMD. | Aug-23 |
| Texas Instruments | MIL-PRF-38535 Table IA: Screening procedure (p. 20) |
Allow 1X Reflow in lieu of temp cycle in Table IA.TM1010, Condition B, -55/125C, 15cy – nonstandard flow. When TC is performed, it can be in accordance with JESD22-A104. | Aug-23 |
| Texas Instruments | MIL-PRF-38535 Table V: Group D (p 37-43) D3 / TM1010 | Perform TC with accordance to JESD22- A104 to align with Appendix H and standard factory specifications. | Aug-23 |
| Texas Instruments | MIL-PRF-38535 Table V: Group D (p 37-43) D3 / Clarification |
Clarification: Perform UHAST per one of the following conditions: 130C, 85%RH – 96 Hours 110C, 85%RH – 264 Hours. Allowed per Note 18. |
Aug-23 |
| TI can perform UHAST, not BHAST for QCI. Allowed per MIL-PRF-38535. | |||
| Texas Instruments | MIL-PRF-38535 Table V: Group D (p 37-43) D3 / Clarification |
Clarification: TI can use separate units for UHAST and TC. Allowed option per Note 17. |
Aug-23 |
| Texas Instruments | MIL-PRF-38535 Table V: Group D (p 37-43) D3 / Moisture resistance condition |
Moisture resistance per JESD22-A118 Unbiased HAST condition A or B. | Aug-23 |
| Texas Instruments | MIL-PRF-38535 Table V: Group D (p 37-43) D7 / Adhesion of lead finish |
TI uses internal procedure (QSS 009- 109). | Aug-23 |
| Texas Instruments | MIL-PRF-38535 Table A-III (p 80) Coating Thickness |
Clarified NiPdAu thickness. TI devices meet NiPdAu thickness indicated below. | Aug-23 |
| Over
plating thickness (microinch/micrometer): Min 20/0.51 Max NS |
|||
| Texas Instruments | MIL-PRF-38535 Table H-I. Assembly process technology testing for flip chip packages containing Pb free bump [p196] |
Flip Chip containing PB free bumps: | Aug-23 |
| Biased
Humidity option to run JESD22- A101 (THB) or A110 (Biased HAST) Conditions:
|
|||
| Thermal Shock is not applicable to organic substrates. | |||
| Texas Instruments |
MIL-PRF-38535 A.3.5.5.2 Internal Wire size and material |
Clarification: |
Oct-24 |
| QML P devices may use 0.96mil (0.00096 inch) wire | |||
| Texas Instruments | MIL-PRF-38535 A.3.5.1 |
Plastic packages inherently use organic or polymeric materials (adhesives, mold compounds, underfill, organic substrates, etc). |
Apr-25 |
| Hermetic packages may use organic materials (ex: die/lid attach, and polyimide). | |||
| Materials may not be specified in the device specification. However, materials have been shared with the Qualifying Activity. | |||
| Texas Instruments | MIL-PRF-38535 A.3.5.5.2 |
Plastic packages internal lead wire metals are dissimilar from the die metallization metal. Internal lead wire metal is Au and the die metallization metal may be different (for example, Al, BOAC or METDCU). | Apr-25 |
| Manufacturer | Specification | Test Optimized | Date |
|---|---|---|---|
| Texas Instruments | MIL-PRF-38535 Table H-IA. Assembly process technology testing for hermetic (classes Q, V) and non-hermetic packages (class Y). [197-198] |
Class Q, V, Y (flip chip): | Aug-23 |
| Final
Package testing High temperature Storage TM 1008 (1,000 hours at +150°C) or JESD 22 A103 (1,000 hours at +150°C or equivalent). |
|||
| Texas Instruments | MIL-PRF-38535 Table H-IIA. Technology characterization testing for hermetic (classes Q, V) and non-hermetic packages (class Y) [200-202] |
Class Q, V, Y (flip chip): | Aug-23 |
| Group 2:
a. Thermal shocks N/A b. Temperature cycles TM 1010, condition C, 100 cycles or JESD22-A104 c. HAST(Biased) JESD22-A110 or THB JESD22-A101 d. Visual inspection TM 1010 and TM 1004 visual criteria e. Not applicable |
|||
| Texas Instruments | MIL-PRF-38535 Table H-IB. Assembly process technology testing for plastic packages (classes N, P) |
Class N, P: | Aug-23 |
| Group #3 Temperature Cycling per one of the following: | |||
| - 55/125C, 700 cycle (product release), 1000 cycle (technology release) or- 65/150C, 500 cycle (product release), 1000 cycle (technology release). | |||
| Group #5
High Temp Storage performed per JESD 22 A103 Bake 150C, 1000 Hours or equivalent. |
|||
| Texas Instruments | MIL-PRF-38535 Table H-IIB. Technology characterization testing for plastic packages (classes N, P) |
Class N, P: |
Aug-23 |
|
Group#2 Moisture sensitivity level per manufacturer’s specification or JEDEC JSTD- 020/ JESD 22-A113 |
|||
| Group #3
b. Biased HAST (130C/85%RH/96, 192hr) or (110C/85% RH/264, 528hr) or (85C/85%RH/1000, 2000hr) per JESD22-A110/JESD22-A101 |
|||
| Group #6 Lead Integrity - For plastic packages, TI uses internal test method, QSS 009-134. TM is not applicable for plastic packages. For trim and form leaded packages this is N/A per Test Method 2004 section 3.2 | |||
| Group #7 - Can perform MSL testing per J-STD-020/JESD 22-A113 instead of this test. | |||
| Group #9 - Does not perform Fungus testing. | |||
| Group #12 – Thermal characteristics based on Modeling. |
| Manufacturer | Specification | Test Optimized | Date |
|---|---|---|---|
| Texas Instruments | MIL-STD-883 TM 5007 |
Approved alternate inline methods to record readings
for Wafer Lot Acceptance requirements: Sheet resistance inline measurements (#2 Metallization Thickness) Oxide/Nitride inline measurements (#5 Glassivation/Passivation (PO) thickness) |
Dec 23 |
| TABLE I. Wafer lot acceptance tests (2. Metallization Thickness and 5. Glassivation thickness) |