Product details

Sample rate (Max) (MSPS) 250 Resolution (Bits) 13 Number of input channels 1 Interface type Parallel LVDS Analog input BW (MHz) 500 Features High Performance Rating Space Input range (Vp-p) 2.2 Power consumption (Typ) (mW) 2250 Architecture Pipeline SNR (dB) 69.1 ENOB (Bits) 11.3 SFDR (dB) 84 Operating temperature range (C) -55 to 125, 25 to 25 Input buffer Yes
Sample rate (Max) (MSPS) 250 Resolution (Bits) 13 Number of input channels 1 Interface type Parallel LVDS Analog input BW (MHz) 500 Features High Performance Rating Space Input range (Vp-p) 2.2 Power consumption (Typ) (mW) 2250 Architecture Pipeline SNR (dB) 69.1 ENOB (Bits) 11.3 SFDR (dB) 84 Operating temperature range (C) -55 to 125, 25 to 25 Input buffer Yes
CFP (HFG) 84 363 mm² 16.5 x 16.5
  • 13 Bit Resolution
  • 250 MSPS Sample Rate
  • SNR = 67.6 dBc at 230 MHz IF and 250 MSPS
  • SFDR = 74.0 dBc at 230 MHz IF and 250 MSPS
  • 2.2 VPP Differential Input Voltage
  • Fully Buffered Analog Inputs
  • 5 V Analog Supply Voltage
  • LVDS Compatible Outputs
  • Total Power Dissipation: 2 W
  • Offset Binary Output Format
  • Pin Compatible With the ADS5440
  • Military Temperature Range
    (–55°C to 125°C Tcase)
  • 13 Bit Resolution
  • 250 MSPS Sample Rate
  • SNR = 67.6 dBc at 230 MHz IF and 250 MSPS
  • SFDR = 74.0 dBc at 230 MHz IF and 250 MSPS
  • 2.2 VPP Differential Input Voltage
  • Fully Buffered Analog Inputs
  • 5 V Analog Supply Voltage
  • LVDS Compatible Outputs
  • Total Power Dissipation: 2 W
  • Offset Binary Output Format
  • Pin Compatible With the ADS5440
  • Military Temperature Range
    (–55°C to 125°C Tcase)

The ADS5444 is a 13 bit 250 MSPS analog-to-digital converter (ADC) that operates from a 5 V supply, while providing LVDS-compatible digital outputs from a 3.3 V supply. The ADS5444 input buffer isolates the internal switching of the onboard track and hold (T&H) from disturbing the signal source. An internal reference generator is also provided to further simplify the system design. The ADS5444 has outstanding low noise and linearity over input frequency.

The ADS5444 is available in a 84 pin ceramic nonconductive tie-bar package (HFG). The ADS5444 is built on a state-of-the-art Texas Instruments complementary bipolar process (BiCom3X) and is specified over the full military temperature range (–55°C to 125°C Tcase).

This CQFP package has built in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI typically recommends an 11,9-mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential.

The ADS5444 is a 13 bit 250 MSPS analog-to-digital converter (ADC) that operates from a 5 V supply, while providing LVDS-compatible digital outputs from a 3.3 V supply. The ADS5444 input buffer isolates the internal switching of the onboard track and hold (T&H) from disturbing the signal source. An internal reference generator is also provided to further simplify the system design. The ADS5444 has outstanding low noise and linearity over input frequency.

The ADS5444 is available in a 84 pin ceramic nonconductive tie-bar package (HFG). The ADS5444 is built on a state-of-the-art Texas Instruments complementary bipolar process (BiCom3X) and is specified over the full military temperature range (–55°C to 125°C Tcase).

This CQFP package has built in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI typically recommends an 11,9-mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential.

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Technical documentation

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Type Title Date
* Data sheet Class V 13-Bit 250-MSPS Analog-to-Digital Converter datasheet (Rev. C) 02 Jan 2014
* SMD ADS5444-SP SMD 5962-07207 08 Jul 2016
* Radiation & reliability report ADS5444MHFG-V SEE Report 26 Mar 2015
Selection guide TI Space Products (Rev. I) 03 Mar 2022
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations 18 May 2020
Application note Single-Event Effects Confidence Interval Calculations 14 Jan 2020
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing 17 Jun 2019
EVM User's guide ADS5444/63/74-SP EVM User's Guide (Rev. A) 05 Sep 2013
Application note High-Speed, Analog-to-Digital Converter Basics 11 Jan 2012
Application note Driving High-Speed ADCs: Circuit Topologies and System-Level Parameters (Rev. A) 10 Sep 2010
Application note Smart Selection of ADC/DAC Enables Better Design of Software-Defined Radio 28 Apr 2009
Application note CDCE72010 as a Clocking Solution for High-Speed Analog-to-Digital Converters 08 Jun 2008
Application note Phase Noise Performance and Jitter Cleaning Ability of CDCE72010 02 Jun 2008

Design & development

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Evaluation board

ADS5444EVM-CVAL — ADS5444-SP 13-bit 250-MSPS analog-to-digital converter (ADC) evaluation module

This EVM provides a platform for evaluating the ADS5444HFG/EM under various signal, reference, and supply conditions. Two analog inputs to the ADC are provided via external SMA connectors. One input path uses a pair of THS9001 amplifiers, while the other input is AC coupled. In both cases, the user (...)

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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CFP (HFG) 84 View options

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