LMG3410R050
- TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles
- Enables high density power conversion designs
- Superior system performance over cascode or stand-alone GaN FETs
- Low inductance 8 mm x 8 mm QFN package for ease of design, and layout
- Adjustable drive strength for switching performance and EMI control
- Digital fault status output signal
- Only +12 V unregulated supply needed
- Integrated gate driver
- Zero common source inductance
- 20 ns Propagation delay for MHz operation
- Trimmed gate bias voltage to compensate for threshold variations ensures reliable switching
- 25 to 100V/ns User adjustable slew rate
- Robust protection
- Requires no external protection components
- Overcurrent protection with less than 100 ns response
- Greater than 150 V/ns Slew rate immunity
- Transient overvoltage immunity
- Overtemperature protection
- Under voltage lock out (UVLO) Protection on all supply rails
- Robust protection
- LMG3410R050: Latched overcurrent protection
- LMG3411R050: Cycle-by-cycle overcurrent protection
The LMG341xR050 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.
The LMG341xR050 provides a smart alternative to traditional cascode GaN and standalone GaN FETs by integrating a unique set of features to simplify design, maximize reliability and optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with near zero Vds ringing, less than 100 ns current limiting response self-protects against unintended shoot-through events, overtemperature shutdown prevents thermal runaway, and system interface signals provide self-monitoring capability.
![](/product-folders/content/dam/ticom/images/icons/illustrative-icons/resources/information-icon.png)
Request more information
Get started with your GaN design today with the LMG3410R050 development kit:
- LMG3410R050 daughtercard Buy from TI
- LMG34xx GaN system-level evaluation motherboard Buy from TI
Similar products you might be interested in
Pin-for-pin with same functionality to the compared device
Same functionality with different pin-out to the compared device
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
LMG34XX-BB-EVM — LMG34xx GaN system-level evaluation motherboard for LMG341x Family
The LMG34XX-BB-EVM is an easy to use breakout board to configure any LMG341x half bridge board, such as the LMG3410-HB-EVM, as a synchronous buck converter. By providing a power stage, bias power and logic circuitry this EVM allows for quick measurements of the GaN device switching. This EVM is (...)
LMG3410EVM-018 — LMG3410R050 600-V 50-mΩ GaN half-bridge daughter card
SNOR029 — GaN CCM Boost PFC Power Loss Calculation Excel Sheet
Supported products & hardware
Products
Gallium nitride (GaN) power stages
SNOR030 — GaN CCM Totem Pole PFC Power Loss Calculation Excel Sheet
Supported products & hardware
Products
Gallium nitride (GaN) power stages
PMP40690 — 4-kW interleaved CCM totem pole bridgeless PFC reference design using C2000™ MCU and GaN
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
VQFN (RWH) | 32 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.