計算工具
DLPA2000
- High Efficiency RGB LED/Lamp Driver with Buck-Boost DC-to-DC Converter, DMD Supplies, DPP Core Supply, 1.8-V Load Switch, and Measurement System in a Small Chip-Scale Package
- Three Low-Impedance (30 mΩ Typical at 27°C) MOSFET Switches for Channel Selection
- Independent, 10-Bit Current Control per Channel
- 750-mA Max LED Current for DLPA2000 Embedded Applications
- On-Chip Motor Driver
- DMD Regulators
- Requires Only a Single Inductor
- VOFS: 10 V
- VBIAS: 18 V
- VRST: –14 V
- Passive Discharge to GND When Disabled
- DPP 1.1-V Core Supply
- Synchronous Step-Down Converter with Integrated Switching FETs
- Supports up to 600-mA Output Current
- VLED Buck Boost Converter
- Power Save Mode at Light Load Current
- Low-Impedance Load Switch
- VIN Range from 1.8 V to 3.6 V
- Supports up to 200 mA of Current
- Passive Discharge to GND When Disabled
- DMD Reset Signal Generation and Power Supply Sequencing
- 33-MHz Serial Peripheral Interface (SPI)
- Multiplexer for Measuring Analog Signals
- Battery Voltage
- LED Voltage, LED Current
- Light Sensor (for White Point Correction)
- Internal Reference Voltage
- External (Thermistor) Temperature Sensor
- Monitoring and Protection Circuits
- Hot Die Warning and Thermal
- Low-Battery Warning
- Programmable Battery Undervoltage Lockout (UVLO)
- Load Switch UVLO
- Overcurrent and Undervoltage Protection
- DLPA2000 DSBGA Package
- 56-Ball 0.4-mm Pitch
- Die Size: 3.280 mm × 3.484 mm ± 0.03 mm
The DLPA2000 is a dedicated PMIC/RGB LED/lamp driver for the DLP2010 and DLP2010NIR digital micromirror devices (DMD) when used with a DLPC3430, DLPC3435, or DLPC150 digital controller. For reliable operation of these chipsets, it is mandatory to use the DLPA2000.
技術文件
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檢視所有 10 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DLPA2000 Power Management and LED/Lamp Driver IC datasheet (Rev. B) | PDF | HTML | 2018年 2月 21日 |
| Application note | 開始使用 TI DLP® 顯示技術 (Rev. G) | PDF | HTML | 2023年 6月 1日 | |
| Application note | DLP System Design: Brightness Requirements and Tradeoffs (Rev. C) | PDF | HTML | 2022年 5月 5日 | |
| Technical article | Design ultra-portable 1080p displays thanks to the industry’s smallest full HD mic | PDF | HTML | 2019年 4月 29日 | |
| White paper | TI DLP® Pico™ Technology for smart home applications (Rev. B) | 2019年 2月 8日 | ||
| Application note | DLPC34xx General System Design Guide Application Note (Rev. A) | 2019年 2月 4日 | ||
| Technical article | Designing smaller mobile projection and display applications with DLP Pico product | PDF | HTML | 2018年 10月 9日 | |
| Application note | DLP Technology for Near Eye Display (NED) (Rev. A) | 2017年 8月 4日 | ||
| Application note | PCB Design Requirements for TI DLP Pico TRP Digital Micromirror Devices | 2016年 8月 19日 | ||
| Application note | TI DLP® IntelliBright™ Algorithms for the DLPC343x Controller | 2014年 12月 8日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
光學模組
DLP-OMM-SEARCH — DLP® 產品第三方搜尋工具
To best meet your design needs and accelerate your time-to-market, DLP® Products works with a variety of third parties to help with everything from optical modules and hardware design to specialty software and other production services. Download one or both search tools listed below to quickly (...)
韌體
DLP-PICO-FW-SEL — DLP® Pico™ 韌體選擇器
Firmware selector for various DLPC34xx controllers and configurations.
參考設計
TIDA-00722 — 適用於 TI DLP® Pico™ 投影機且採用 MSP430 的即時色彩管理參考設計
This reference design enables real-time color management for TI DLP® Pico projection display systems. The reference design enables automatic color correction in the field for products incorporating TI DLP Pico technology displays using LEDs. Automatic color correction allows (...)
參考設計
TIDA-00325 — 使用 DLP® 技術的超行動、超低功耗顯示參考設計
This display reference design featuring TI's DLP2010 (.2 WVGA) DMD chipset, was designed to enable ultra-low power and ultra-mobile display applications either embedded inside a system (e.g. smartphone, tablets etc.) or as a standalone accessory module. The chipset used in the design comprises of (...)
| 封裝 | 引腳 | 下載 |
|---|---|---|
| DSBGA (YFF) | 56 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。