Condition monitoring module

Products and reference designs

Condition monitoring module

Block diagram

Overview

Our integrated circuits and reference designs enable you to build condition monitoring module applications with a high-speed signal chain, powerful processing and different wired and wireless interfaces to connect to the external world.

Design requirements:

Condition monitoring module designs often require:

  • High-resolution, high-speed conversion with low-power vibration front end.
  • Efficient scalable FFT processing to predict potential machine failures.
  • Edge processing to reduce system power and lower network bandwidth.

Explore applications similar in function and design

Block diagram

Find products and reference designs for your system.

Technical documentation

View all 3
No results found. Please clear your search and try again.
Type Title Date
Analog Design Journal High-side current sources for industrial applications 02 Apr 2019
Analog Design Journal Designing a front-end interface for vibration sensors that monitor machine healt 13 Jul 2018
White paper Making factories smarter, more productive through predictive maintenance 02 Nov 2016

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support.

Videos