SPRACU5E June   2021  – October 2025 AM2431 , AM2432 , AM2434 , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 User's Guide Usage Guidelines
      1. 1.1.1 Custom Board Schematics Design Guidelines - References Used in the User's Guide
      2. 1.1.2 Processor Family (Families) Specific User's Guide
      3. 1.1.3 Schematic Design Guidelines
      4. 1.1.4 Schematic Review Checklist
        1. 1.1.4.1 Common Checklist for Use With All Schematic Design Guidelines and Schematics Review Sections
          1. 1.1.4.1.1 Custom Board Schematic Design Implementation Checklist Sub-Sections Description
      5. 1.1.5 FAQ Reference for User's Guide Usage During Schematic Self-review
    2. 1.2 Processor Family List of Processors
      1. 1.2.1 AM64x [ALV] Processor Family
      2. 1.2.2 AM243x [ALV] Processor Family
    3. 1.3 Updates to Schematics Design Guidelines and Schematics Review Checklist
  5. 2 Related Collateral
    1. 2.1 Links to Commonly Referenced Collaterals During Custom Board Schematic Design
    2. 2.2 Hardware Design Considerations for Custom Board Design User's Guide
  6. 3 Processor-Specific Information
    1. 3.1 Selection of Processor OPN (Orderable Part Number)
    2. 3.2 Processor-specific Data Sheet Use Case and Version Referenced for User's Guide Edits
    3. 3.3 Peripheral Instance Naming Convention - Data Sheet and TRM
    4. 3.4 Processor Peripherals and IOs Connection When Not Used (Unused)
    5. 3.5 Ordering and Quality Information for AM64x and AM243x Processor Families
    6. 3.6 Checklist for Selection of Required Processor GPN (Generic Part Number) and OPN (Ordering Part Number)
  7. 4 Processor Power Architecture
    1. 4.1 Generating Processor-Specific and Peripherals (Attached Device) Supply Rails
      1. 4.1.1 Power Management IC (PMIC) Based Power Architecture
        1. 4.1.1.1 PMIC Based Power Architecture Checklist for TPS65219 or TPS65220
        2. 4.1.1.2 Additional References
      2. 4.1.2 Discrete Power Devices (DC/DC, LDO) Based Power Architecture
        1. 4.1.2.1 Discrete DC/DCs
        2. 4.1.2.2 Discrete LDOs
        3. 4.1.2.3 Discrete Power Devices (DC/DC, LDO) Based Power Architecture Checklist
    2. 4.2 Processor Power Rails Supply Control, Sequencing and Supply Overload Protection
      1. 4.2.1 Load Switch (Processor Supply Rail Power Switching)
        1. 4.2.1.1 Load Switch (Processor Supply Rail Power Switching) Checklist
      2. 4.2.2 eFuse IC (Power Switching and Protection)
  8. 5 General Recommendations
    1. 5.1 Processor Performance Evaluation Module (EVM) or Starter Kit (SK)
      1. 5.1.1 Evaluation Module (Starter Kit) Checklist
    2. 5.2 Processor-Specific EVM or SK Versus Data Sheet
      1. 5.2.1 Notes About Component Selection
        1. 5.2.1.1 Series Resistor
        2. 5.2.1.2 Parallel Pull Resistor
        3. 5.2.1.3 Drive Strength Configuration
        4. 5.2.1.4 Processor-specific Data Sheet Recommendations
        5. 5.2.1.5 Processor IOs Protection - Provision for External ESD Protection Devices
        6. 5.2.1.6 Peripheral Clock Outputs Series Resistor
        7. 5.2.1.7 Peripheral Clock Outputs Pulldown Resistor
        8. 5.2.1.8 Component Selection Checklist
      2. 5.2.2 Additional Information Regarding EVM or SK Design (Schematic, Board) and Reuse
        1. 5.2.2.1 Updated EVM or SK Schematic With Design, Review and CAD Notes Added
        2. 5.2.2.2 EVM or SK Design Files Reuse for Custom Board Design
          1. 5.2.2.2.1 EVM or SK Design Files Reuse for Custom board Design - Checklist
      3. 5.2.3 EVM or SK Schematic Pages Sequencing (Based on Functions, Reuse) and EVM or SK Board Layout
    3. 5.3 Processor-Specific SDK
    4. 5.4 General Design Recommendations (to Know) Before Starting the Custom Board Design
      1. 5.4.1  Processor Documentation
      2. 5.4.2  Processor Pin Attributes (Pinout) Verification
      3. 5.4.3  Device Comparison, IOSET and Voltage Conflict
      4. 5.4.4  RSVD Reserved Pins (Signals)
      5. 5.4.5  Note on PADCONFIG Registers
      6. 5.4.6  Processor IO (Signal) Isolation for Fail-Safe Operation
      7. 5.4.7  Pin Connectivity Requirements and Reference to Processor-Specific EVM or SK
      8. 5.4.8  Custom Board High-Speed Interface Design Guidelines
      9. 5.4.9  Recommendation for LVCMOS (GPIO) Output Current Source or Current Sink
      10. 5.4.10 Connection of Slow Ramp Signal (Input) or Capacitor Load (Output) to Processor IOs
      11. 5.4.11 Processor and Processor Peripherals Design Related Queries During Custom Board Design
      12. 5.4.12 General Design Recommendations (to Know) Before Starting the Custom Board Design Checklist
      13. 5.4.13 Attached Devices Recommendations
  9. 6 Processor-Specific Recommendations for Power, Clock, Reset, Boot and Debug
    1. 6.1 Common (Processor Start-Up) Connections
      1. 6.1.1 Power Supply
        1. 6.1.1.1 Core and Peripherals Supplies
          1. 6.1.1.1.1 Power Supply Ramp (Slew Rate) Requirement and Dynamic Voltage Scaling
          2. 6.1.1.1.2 Additional Information
          3. 6.1.1.1.3 Processor Core and Peripheral Core Power Supply Checklist
          4. 6.1.1.1.4 Peripheral Analog Power Supply Checklist
        2. 6.1.1.2 IO Supply for IO Groups
          1. 6.1.1.2.1 IO Supply for IO Groups Checklist
        3. 6.1.1.3 Supply for VPP (eFuse ROM Programming)
          1. 6.1.1.3.1 Supply for VPP Checklist
        4. 6.1.1.4 Additional Information
      2. 6.1.2 Capacitors for Supply Rails
        1. 6.1.2.1 Additional Information
        2. 6.1.2.2 Capacitors for Supply Rails Checklist
      3. 6.1.3 Processor Clocks (Inputs / Outputs)
        1. 6.1.3.1 Clock Inputs
          1. 6.1.3.1.1 MCU_OSC0 (High Frequency) Clock (Internal Oscillator) or LVCMOS Digital Clock (External Oscillator)
          2. 6.1.3.1.2 EXT_REFCLK1 (External Clock Input to MAIN Domain)
          3. 6.1.3.1.3 Clock Input Checklist - MCU_OSC0
        2. 6.1.3.2 Clock Output
          1. 6.1.3.2.1 Clock Output Checklist
      4. 6.1.4 Processor Reset
        1. 6.1.4.1 External Reset Inputs
        2. 6.1.4.2 Reset Status Outputs
        3. 6.1.4.3 Additional Information
        4. 6.1.4.4 Processor Reset Inputs Checklist
        5. 6.1.4.5 Processor Reset Status Outputs Checklist
      5. 6.1.5 Configuration of Boot Modes (for Processor)
        1. 6.1.5.1 Processor Boot Mode Inputs Isolation Buffers Use Case and Optimization
        2. 6.1.5.2 Boot Mode Configuration
          1. 6.1.5.2.1 Notes for USB Boot Mode
        3. 6.1.5.3 Boot Mode Implementation Approaches
        4. 6.1.5.4 Additional Information
        5. 6.1.5.5 Configuration of Boot Modes (for Processor) Checklist
    2. 6.2 Custom Board Debug Using JTAG and EMU
      1. 6.2.1 JTAG Interface and EMU Signals When Used
      2. 6.2.2 JTAG Interface and EMU Signals When Not Used
      3. 6.2.3 Additional Information
      4. 6.2.4 Custom Board Debug Using JTAG and EMU Checklist
  10. 7 Processor Peripherals Power, Interface and Connections
    1. 7.1 Supported Processor Cores and MCU Cores
    2. 7.2 Supply Connections for IO Supply for IO Groups
      1. 7.2.1 Supply Connections for IO Supply for IO Groups Checklist
    3. 7.3 Memory Interface (DDRSS (DDR4/LPDDR4), MMCSD (eMMC/SD Card/SDIO), OSPI/QSPI and GPMC)
      1. 7.3.1 DDR Subsystem (DDRSS)
        1. 7.3.1.1 DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory)
          1. 7.3.1.1.1 Memory Interface Configuration
          2. 7.3.1.1.2 Routing Topology and Connection of Memory Terminations
          3. 7.3.1.1.3 Resistors for DDRSS Control and Calibration
          4. 7.3.1.1.4 Capacitors for the Power Supply Rails
          5. 7.3.1.1.5 Data Bit or Byte Swapping
          6. 7.3.1.1.6 DDR4 Implementation Checklist
          7. 7.3.1.1.7 DDR4 VTT Termination Implementation Schematic Reference
        2. 7.3.1.2 LPDDR4 SDRAM (Low-Power Double Data Rate 4 Synchronous Dynamic Random-Access Memory)
          1. 7.3.1.2.1 Memory Interface Configuration
          2. 7.3.1.2.2 Routing Topology and Connection of Memory Terminations
          3. 7.3.1.2.3 Resistors for DDRSS Control and Calibration
          4. 7.3.1.2.4 Capacitors for the Power Supply Rails
          5. 7.3.1.2.5 Data Bit or Byte Swapping
          6. 7.3.1.2.6 LPDDR4 Implementation Checklist
      2. 7.3.2 Multi-Media Card and Secure Digital (MMCSD)
        1. 7.3.2.1 MMC0 - eMMC (Embedded Multimedia Card) Interface
          1. 7.3.2.1.1 MMC0 Interface Used
            1. 7.3.2.1.1.1 IO Power Supply
            2. 7.3.2.1.1.2 eMMC Interface Signals Connection
            3. 7.3.2.1.1.3 eMMC (Attached Device) Reset
            4. 7.3.2.1.1.4 Capacitors for the Power Supply Rails
          2. 7.3.2.1.2 MMC0 Interface Not Used
          3. 7.3.2.1.3 MMC0 (eMMC) Checklist
          4. 7.3.2.1.4 Additional Information on eMMC PHY
          5. 7.3.2.1.5 MMC0 – SD (Secure Digital) Card Interface
        2. 7.3.2.2 MMC1 – SD (Secure Digital) Card Interface
          1. 7.3.2.2.1 IO Power Supply
          2. 7.3.2.2.2 Signals Connection
          3. 7.3.2.2.3 SD Card Power Supply Switch EN Reset Logic
          4. 7.3.2.2.4 External ESD Protection for the SD Card Interface Signals
          5. 7.3.2.2.5 Capacitors for the IO Supply for IO Groups Supply Rails
          6. 7.3.2.2.6 SD Card Interface (MMC1) Checklist
        3. 7.3.2.3 Additional Information
      3. 7.3.3 Octal Serial Peripheral Interface (OSPI) or Quad Serial Peripheral Interface (QSPI)
        1. 7.3.3.1 IO Power Supply
        2. 7.3.3.2 Signals Connection
        3. 7.3.3.3 OSPI/QSPI Device Reset
        4. 7.3.3.4 Loopback Clock
        5. 7.3.3.5 Interface to Multiple (Attached) Devices
        6. 7.3.3.6 Capacitors for the Power Supply Rails
        7. 7.3.3.7 OSPI0 or QSPI0 Peripheral Interface Implementation Checklist
      4. 7.3.4 General-Purpose Memory Controller (GPMC)
        1. 7.3.4.1 IO Power Supply
        2. 7.3.4.2 GPMC Interface
        3. 7.3.4.3 Signals Connection
          1. 7.3.4.3.1 GPMC NAND
        4. 7.3.4.4 Memory (Attached Device) Reset
        5. 7.3.4.5 Capacitors for the Power Supply Rails
        6. 7.3.4.6 GPMC Interface Checklist
    4. 7.4 External Communication Interface (Ethernet (CPSW3G0 and PRU_ICSSG), USB2.0, USB3.0 (SERDES0), PCIe (SERDES0), UART and MCAN)
      1. 7.4.1 Ethernet Interface
        1. 7.4.1.1  IO Power Supply
        2. 7.4.1.2  Media Independent Interface (MAC side)
          1. 7.4.1.2.1 Common Platform Ethernet Switch 3-Port Gigabit (CPSW3G0)
          2. 7.4.1.2.2 Programmable Real-Time Unit and Industrial Communication Subsystem - Gigabit (PRU_ICSSG)
          3. 7.4.1.2.3 Additional Information
        3. 7.4.1.3  Usage of SysConfig-PinMux Tool
        4. 7.4.1.4  MAC (Data, Control and Clock) Interface Signals Connection
        5. 7.4.1.5  EPHY Reset
        6. 7.4.1.6  Ethernet PHY (and MAC) Operation and Media Independent Interface (MII) Clock
          1. 7.4.1.6.1 Crystal Used as Clock Source for Processor and EPHYs
          2. 7.4.1.6.2 External Oscillator Used as Clock Source
          3. 7.4.1.6.3 Processor Clock Output (CLKOUT0)
        7. 7.4.1.7  Ethernet PHY Pin Strapping
        8. 7.4.1.8  External Interrupt (EXTINTn)
          1. 7.4.1.8.1 External Interrupt (EXTINTn) Checklist
        9. 7.4.1.9  MAC (Media Access Controller) to MAC Interface
        10. 7.4.1.10 MDIO (Management Data Input/Output) Interface
          1. 7.4.1.10.1 MDIO Interface Mode
        11. 7.4.1.11 Ethernet MDI (Medium Dependent Interface) Including Magnetics
        12. 7.4.1.12 Capacitors for the Power Supply Rails
        13. 7.4.1.13 Ethernet Interface Checklist
      2. 7.4.2 Universal Serial Bus (USB2.0)
        1. 7.4.2.1 USB0 Interface When Used
          1. 7.4.2.1.1 USB Interface Configured as Host
          2. 7.4.2.1.2 USB Interface Configured as Device
          3. 7.4.2.1.3 USB Interface Configured as Dual-Role-Device
          4. 7.4.2.1.4 USB Type-C
        2. 7.4.2.2 USB0 Interface When Not Used
        3. 7.4.2.3 Additional Information
        4. 7.4.2.4 USB Interface Checklist
      3. 7.4.3 Serializer and Deserializer (SERDES0)
        1. 7.4.3.1 SERDES0 Checklist
        2. 7.4.3.2 SERDES0 When Used
          1. 7.4.3.2.1 USB3SS0 - USB3.0 Super Speed Interface Configuration
            1. 7.4.3.2.1.1 Signal Interface
              1. 7.4.3.2.1.1.1 USB3.0 Super Speed Interface
                1. 7.4.3.2.1.1.1.1 USB3.0 Super Speed Interface Operating Mode Configuration
            2. 7.4.3.2.1.2 Unused SERDES0 Clock Connection
            3. 7.4.3.2.1.3 Additional Information
            4. 7.4.3.2.1.4 USB3SS0 - USB3.0 Super Speed Interface Checklist
          2. 7.4.3.2.2 Peripheral Component Interconnect Express (PCIe) Interface Configuration
            1. 7.4.3.2.2.1 Clock Configuration for PCIe Operating Modes
            2. 7.4.3.2.2.2 Signal Interface Termination
            3. 7.4.3.2.2.3 PCIe Clock (REFCLK) Source
            4. 7.4.3.2.2.4 Hardware Reset (Cold or Fundamental Reset)
            5. 7.4.3.2.2.5 PCIe Clock Request (PCIE0_CLKREQn) Signal
            6. 7.4.3.2.2.6 Connecting PCIe Interface Signals
            7. 7.4.3.2.2.7 PCIe Interface Checklist
        3. 7.4.3.3 SERDES0 Not Used
      4. 7.4.4 Universal Asynchronous Receiver/Transmitter (UART)
        1. 7.4.4.1 UART Interface When Not Used
        2. 7.4.4.2 Universal Asynchronous Receiver/Transmitter (UART) Checklist
      5. 7.4.5 Modular Controller Area Network (MCAN) with Full CAN-FD Support
        1. 7.4.5.1 Modular Controller Area Network Checklist
    5. 7.5 On-Board Synchronous Communication Interface (MCSPI, FSI and I2C)
      1. 7.5.1 Multichannel Serial Peripheral Interface (MCSPI)
        1. 7.5.1.1 Connection of MCSPI Interface Signals
        2. 7.5.1.2 MCSPI Interface Checklist
      2. 7.5.2 FSI (Fast Serial Interface)
        1. 7.5.2.1 FSI0 Checklist
      3. 7.5.3 Inter-Integrated Circuit (I2C)
        1. 7.5.3.1 I2C Interface Signals Connection
        2. 7.5.3.2 I2C (Open-drain Output Type IO Buffer) Interface Checklist
        3. 7.5.3.3 I2C (Emulated Open-drain Output Type IO) Interface Checklist
    6. 7.6 Analog to Digital Converter (ADC)
      1. 7.6.1 ADC0 When Used
      2. 7.6.2 ADC0 When Not Used
      3. 7.6.3 ADC0 Configured as Inputs ADC0_DIG_TEST[0-7]
      4. 7.6.4 ADC0 Checklist
    7. 7.7 GPIO and Hardware Diagnostics
      1. 7.7.1 General Purpose Input/Output (GPIO)
        1. 7.7.1.1 GPIO Connection and Addition of External Buffer
        2. 7.7.1.2 GPIO Multiplexed With MMC Interface
        3. 7.7.1.3 Additional Information
        4. 7.7.1.4 GPIO Checklist
      2. 7.7.2 On-Board Hardware Diagnostics
        1. 7.7.2.1 Monitoring of On-board Supply Voltages Using Processor Voltage Monitors
          1. 7.7.2.1.1 Voltage Monitor Inputs Connection When Used
            1. 7.7.2.1.1.1 Voltage Monitor Checklist
          2. 7.7.2.1.2 Voltage Monitor Inputs Connection When Not Used
        2. 7.7.2.2 Internal Temperature Monitoring
          1. 7.7.2.2.1 Internal Temperature Monitoring Checklist
        3. 7.7.2.3 Connection of Error Signal Output (MCU_SAFETY_ERRORn)
        4. 7.7.2.4 High Frequency Oscillator (MCU_OSC0) Clock Loss Detection
          1. 7.7.2.4.1 Crystal or External Oscillator Mal-function
    8. 7.8 EVM or SK Specific Circuit Implementation (Reuse)
    9. 7.9 Performing Board Level Testing During Custom Board Bring-up
      1. 7.9.1 Processor Pin Configuration Using Pinmux Tool
      2. 7.9.2 Schematics Configurations
      3. 7.9.3 Connection of Supply Rails to External Pullups
      4. 7.9.4 Peripheral (Subsystem) Clock Outputs
      5. 7.9.5 General Board Bring-up and Debug
        1. 7.9.5.1 Clock Output for Board Bring-Up, Test or Debug
        2. 7.9.5.2 Additional Information
        3. 7.9.5.3 General Board Bring-up and Debug Checklist
  11. 8 Self-Review of Custom Board Schematic Design
  12. 9 Custom Board Layout Notes (Added Near to the Schematic Sections) and General Guidelines
    1. 9.1 Layout Considerations
  13. 10Custom Board Design Simulation
    1. 10.1 DDR-MARGIN-FW
  14. 11Additional References
    1. 11.1 FAQ Covering AM64x, AM243x, AM62x, AM62Ax, AM62D-Q1, AM62Px, AM62Lx Processor Families
    2. 11.2 FAQs - Processor Product Family Wise and Sitara Processor Families
    3. 11.3 Schematics Review (Self) and Schematic Review Request (Suppliers)
    4. 11.4 Processor Attached Devices Checklist
  15. 12User's Guide Content and Usage Summary
  16. 13References
    1. 13.1 AM64x
    2. 13.2 AM243x
    3. 13.3 Common References
    4. 13.4 Master List of Available FAQs - Processor Family Wise
    5. 13.5 Master List of Available FAQs - Sitara Processor Families
    6. 13.6 FAQs Including Software Related
    7. 13.7 FAQs for Attached Devices
  17.   A Terminology
  18.   Revision History

7.5.1.2 MCSPI Interface Checklist

General

Review and verify the following for the custom schematic design:

  1. Reviewed above "Common checklist for all sections" section of the user's guide
  2. Interface configuration and connections
  3. Series resistor provision for clock output and placement
  4. Series resistors provision for the interface signals near to the source
  5. Connection of parallel pulls for clock, data and chip select
  6. External SPI Chip Selects connection
  7. Connection of IO supply for IO group and attached device IO supply.
  8. Interface performance and signal integrity
  9. Configuration of SPI data signals
  10. Fail-safe operation of interface signals

Schematic Review

Follow the below list for the custom schematic design:

  1. Interface configuration and recommended connections (including IOSET).
  2. Series resistor 22Ω added to the clock output signal near to processor clock output pin (used for retiming).
  3. Provision for series resistors added (optional) for the interface signals (to isolate for testing or to control possible signal reflections).
  4. Pullup referenced to (powered by) the processor VDDSHVx for corresponding MCSPI instance and signals.
  5. Processor VDDSHVx and the attached device IO supply are sourced from the same supply.
  6. Supply rails connected to the IO supply for IO group VDDSHVx referenced to (powered by) MCSPI peripherals and attached devices IO supply follow the ROC.
  7. Pulldown (10kΩ) provision for MCSPI clock (close to attached device clock input pin) to hold the attached device in low state (there are cases where the clock is stopped or paused in a low logic state and the pulldown option is consistent with this logic state) for all IOs configured for MCSPI interfaces.
  8. Provide provision for external pullups for SPI Chip Select SPI0..4_CS0..3 (MCSPI 0..4) and MCU_SPI0..1_CS0..3 (MCU MCSPI 0..1) (close to attached device). The recommendation is to add pulls to the processor and the attached device signals (data interface - data in, data out) that can float (to prevent the attached device inputs from floating until driven by the host). Pullup values used (10kΩ or 47kΩ).
  9. Configuration of processor SPIx data bits D0 and D1 bits (data direction) matches the attached device and required pulls are added for signals that can float.
  10. Parallel pull added for the processor or attached IOs that can float.
  11. Interface performance (speed, data throughput, communication errors) and signal integrity related concerns have been analyzed (simulated) when connecting to multiple attached devices.
  12. MCSPI interface signals are not fail-safe. The recommendation is to apply the inputs only after the processor supply ramps.

Additional

  1. The recommendation is to verify fail-safe operation when processor IOs are directly connected to external interface signals or connector (through carrier board or add-on board). Applying an external input signal to the processor MCSPI inputs before processor supply ramps can cause voltage feed and can affect the custom board functions.
  2. External ESD protection when the interface signals are connected directly to external inputs.