Low-power, robust gigabit Ethernet PHY transceiver in a small QFN package
Product details
Parameters
Package | Pins | Size
Features
- Ultra low RGMII latency TX < 90ns, RX < 290ns
- Time Sensitive Network (TSN) compliant
- Low power consumption 457 mW
- Exceeds 8000 V IEC 61000-4-2 ESD protection
- Meets EN55011 class B emission standards
- 16 programmable RGMII delay modes on RX/TX
- Integrated MDI termination resistors
- Programmable MII/GMII/RGMII termination impedance
- WoL (Wake-on-LAN) packet detection
- 25-MHz or 125-MHz synchronized clock output
- IEEE 1588 time stamp support
- RJ45 mirror mode
- Fully compatible to IEEE 802.3 10BASE-Te, 100BASE-TX, and 1000BASE-T Specification
- Cable diagnostics
- MII, GMII and RGMII MAC interface options
- Configurable I/O voltage (3.3 V, 2.5 V, 1.8 V)
- Fast link drop mode
- JTAG support
All trademarks are the property of their respective owners.
Description
The DP83867 device is a robust, low power, fully featured Physical Layer transceiver with integrated PMD sublayers to support 10BASE-Te, 100BASE-TX and 1000BASE-T Ethernet protocols. Optimized for ESD protection, the DP83867 exceeds 8-kV IEC 61000-4-2 (direct contact).
The DP83867 is designed for easy implementation of 10/100/1000 Mbps Ethernet LANs. It interfaces directly to twisted pair media via an external transformer. This device interfaces directly to the MAC layer through the IEEE 802.3 Standard Media Independent Interface (MII), the IEEE 802.3 Gigabit Media Independent Interface (GMII) or Reduced GMII (RGMII). The QFP package supports MII/GMII/RGMII whereas the QFN package supports RGMII.
The DP83867 provides precision clock synchronization, including a synchronous Ethernet clock output. It has low latency and provides IEEE 1588 Start of Frame Detection.
The DP83867 consumes only 490mW (PAP) and 457mW (RGZ) under full operating power. Wake on LAN can be used to lower system power consumption.
Same functionality and pinout but is not an equivalent to the compared device:
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The DP83867ERGZ-R-EVM supports 1000/100/10BASE and is compliant with the IEEE 802.3 standard. This reference design supports the RGMII MAC interface.
The DP83867ERGZ-R-EVM evaluation module (EVM) for the DP83867 device includes 3 on-board status LEDs and 5-V connectors with onboard (...)
Features
- 1000BASE-Tx IEEE 802.3 compliant
- Meets EN55011 3m Class B emissions and immunity requirements
- SFD IEEE 1588 timestamp
- Wake-on LAN
- Low power modes: Active sleep, passive sleep, IEEE power down and deep power down
Software development
Features
- MDIO bus controller
- IEEE 802.3 clause 22
- IEEE 802.3ah clause 22 access to clause 45 registers
The USB-2-MDIO software lets you directly access the registers during debug and prototyping. (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
The hardware design consists of DDR3L SDRAM (2x512MB), 64MB Serial NOR Flash, 8GB eMMC 5.0 iNAND, SD Card interface v3.0, 50 pin LCD Connector for external TFT display (...)
Design files
-
download TIDA-050034 BOM.pdf (515KB) -
download TIDA-050034 Assembly Files.zip (547KB) -
download TIDA-050034 Layer Plots.zip (540KB) -
download TIDA-050034 CAD Files.zip (8958KB) -
download TIDA-050034 Gerber.zip (2330KB)
Design files
-
download TIDEP-01008 BOM.pdf (254KB) -
download TIDEP-01008 Assembly Files.zip (2027KB) -
download TIDEP-01008 Layer Plots.zip (2151KB) -
download TIDEP-01008 CAD Files.zip (19327KB) -
download TIDEP-01008 Gerber.zip (9248KB)
Design files
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
VQFN (RGZ) | 48 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.