Product details
Parameters
Package | Pins | Size
Features
- Dual Arm® Cortex®-A15 microprocessor subsystem
- Up to 2 C66x floating-point VLIW DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
- Up to 2.5MB of on-chip L3 RAM
- Two DDR3/DDR3L memory interface (EMIF) modules
- Supports up to DDR3-1066
- Up to 2GB supported per EMIF
- 2x dual Arm® Cortex®-M4 co-processors (IPU1 and IPU2)
- Up to four Embedded Vision Engines (EVEs)
- IVA-HD subsystem
- 4K @ 15fps encode and decode support for H.264 CODEC
- Other CODECs are up to 1080p60
- Display subsystem
- Full-HD video (1920 × 1080p, 60 fps)
- Multiple video input and video output
- 2D and 3D graphics
- Display controller with DMA engine and up to three pipelines
- HDMI® encoder: HDMI 1.4a and DVI 1.0 compliant
- 2x dual-core Programmable Real-Time Unit and Industrial Communication SubSystem (PRU-ICSS)
- 2D-graphics accelerator (BB2D) subsystem
- Vivante® GC320 core
- Video Processing Engine (VPE)
- Dual-core PowerVR® SGX544™ 3D GPU
- Crypto hardware accelerators
- AES, SHA, RNG, DES and 3DES
- Three video Input Port (VIP) modules
- General-Purpose Memory Controller (GPMC)
- Enhanced Direct Memory Access (EDMA) controller
- 2-port gigabit ethernet (GMAC)
- Sixteen 32-bit general-purpose timers
- 32-bit MPU watchdog timer
- Five Inter-Integrated Circuit (I2C™) ports
- HDQ™/1-Wire® interface
- Ten configurable UART/IrDA/CIR modules
- Four Multichannel Serial Peripheral Interfaces (McSPI)
- Quad SPI interface (QSPI)
- SATA gen2 interface
- Eight Multichannel Audio Serial Port (McASP) modules
- SuperSpeed USB 3.0 dual-role device
- High-speed USB 2.0 dual-role device
- Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
- PCI-Express® 3.0 subsystems with two 5-Gbps lanes
- One 2-lane gen2-compliant port
- or two 1-lane gen2-compliant ports
- Dual Controller Area Network (DCAN) modules
- CAN 2.0B protocol
- Up to 247 General-Purpose I/O (GPIO) pins
- Power, Reset, and Clock Management (PRCM)
- On-chip debug with CTools technology
- 28-nm CMOS technology
- 23 mm × 23 mm, 0.8-mm pitch, 760-pin BGA (ABC)
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Description
AM572x Sitara™ processors are Arm applications processors built to meet the intense processing needs of modern embedded products.
AM572x devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set. Cryptographic acceleration is available in every AM572x device.
Programmability is provided by dual-core Arm® Cortex®-A15 RISC CPUs with Arm® Neon™ extension, and two TI C66x VLIW floating-point DSP core, and Vision AccelerationPac (with 4x EVEs). The Arm allows developers to keep control functions separate from other algorithms programmed on the DSPs and coprocessors, thus reducing the complexity of the system software.
Additionally, TI provides a complete set of development tools for the Arm and C66x DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The AM5729 Industrial Development Kit (IDK) is a development platform for evaluating the industrial communication and control capabilities of Sitara AM572x processors for applications in factory automation, drives, robotics, grid infrastructure, machine learning and more. This platform is (...)
Features
- 4x Embedded Vision Engines (EVE) co-processors for machine learning inference acceleration
- 2GB DDR3 (dual channels)
- 16GB On-board eMMC
- Profibus connection, EtherCAT and RS485 Headers
- 1L PCIe Gen2, 1x USB3, and HDMI connectors
- USB JTAG compatible with Code Composer Studio
Description
The AM57x industrial development kit (IDK) LCD screen can be used with AM57x IDKs to add touch and display functions for the evaluation of HMI, Panel PC, and other use cases requiring high resolution displays. The AM57x IDK LCD Screen is a 10.1" display with 1080p resolution (1920x1200) and supports (...)
Features
Hardware
- 10.1" LCD screen (1920 x 1200)
Software
- Linux RT
Description
Built on the proven BeagleBoard.org® open source Linux approach, BeagleBone® AI fills the gap between small SBCs and more powerful industrial computers. Based on the Texas Instruments, Sitara™ AM5729 processor, developers have access to a highly integrated and (...)
Description
Description
The phyCORE®-AM57x SOM supports the Texas Instruments Sitara™ AM57x single- and dual-core, pin compatible, Arm® Cortex™-A15 based solutions. Best-in-class CPU performance is complemented by high performance 2D/3D graphics, advanced video accelerator supporting 1080p decode, and a (...)
Features
- 2x 1/100/1000 Mbit/s ethernet + PRU-ICSS
- Up to 4 GB DDR3 + optional ECC
- Up to 2 GB NAND or 32 GB eMMC
- PCIe, USB 2.0, USB 3.0, SATA, CAN, UART, SPI, I2C
- Android, TI-RTOS and Linux BSP
Description
PHYTEC is an industry-leading provider and integrator of System on Modules (SOMs), embedded middleware and design services that enable customers to bring complex products quickly and easily to market. They guide customers from design to production utilizing deep domain expertise; high-quality (...)
Software development
Features
Linux features
- Open Linux support
- Linux kernel and Bootloaders
- File system
- Qt/Webkit application framework
- 3D graphics support
- Integrated WLAN and Bluetooth® support
- GUI-based application launcher
- Example applications, including:
- ARM benchmarks: Dhrystone, Linpack, Whetstone
- Webkit web browser
- Soft Wifi access (...)
Design tools & simulation
- Visualize the device clock tree
- Interact with clock tree elements (...)
Features
- Supports many TI processors including Sitara and Jacinto Processors and DSPs
- Search by type of product, TI devices supported, or country
- Links and contacts for quick engagement
- Third-party companies located around the world
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| FCBGA (ABC) | 760 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
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