SLUA271C June   2002  – December 2023 ADS1013 , ADS1014 , ADS1015 , ADS1018 , ADS1112 , ADS1113 , ADS1114 , ADS1115 , ADS1118 , ADS1120 , ADS1148 , ADS114S06 , ADS114S06B , ADS114S08 , ADS114S08B , ADS1158 , ADS1191 , ADS1192 , ADS1203 , ADS1204 , ADS1205 , ADS1220 , ADS1225 , ADS1226 , ADS124S06 , ADS124S08 , ADS1257 , ADS1258 , ADS1261 , ADS1283 , ADS1287 , ADS1287D , ADS1291 , ADS1292 , ADS1292R , ADS1293 , ADS6222 , ADS6224 , ADS6242 , ADS6243 , ADS6244 , ADS6245 , ADS6422 , ADS6423 , ADS6424 , ADS6425 , ADS6442 , ADS6443 , ADS6444 , BQ24010 , BQ24012 , BQ24013 , BQ24020 , BQ24022 , BQ24023 , CC2560 , CC2564C , CSD13202Q2 , CSD15571Q2 , CSD16301Q2 , CSD16321Q5 , CSD16322Q5 , CSD16323Q3 , CSD16325Q5 , CSD16327Q3 , CSD16340Q3 , CSD16342Q5A , CSD16401Q5 , CSD16403Q5A , CSD16404Q5A , CSD16406Q3 , CSD16407Q5 , CSD16408Q5 , CSD16409Q3 , CSD16410Q5A , CSD16411Q3 , CSD16412Q5A , CSD16413Q5A , CSD16414Q5 , CSD16415Q5 , CSD16556Q5B , CSD16570Q5B , CSD17301Q5A , CSD17302Q5A , CSD17303Q5 , CSD17304Q3 , CSD17305Q5A , CSD17306Q5A , CSD17307Q5A , CSD17308Q3 , CSD17309Q3 , CSD17310Q5A , CSD17311Q5 , CSD17312Q5 , CSD17313Q2 , CSD17318Q2 , CSD17322Q5A , CSD17327Q5A , CSD17501Q5A , CSD17505Q5A , CSD17506Q5A , CSD17507Q5A , CSD17510Q5A , CSD17522Q5A , CSD17527Q5A , CSD17551Q3A , CSD17551Q5A , CSD17552Q3A , CSD17552Q5A , CSD17553Q5A , CSD17555Q5A , CSD17556Q5B , CSD17559Q5 , CSD17570Q5B , CSD17571Q2 , CSD17573Q5B , CSD17575Q3 , CSD17576Q5B , CSD17577Q3A , CSD17577Q5A , CSD17578Q3A , CSD17578Q5A , CSD17579Q3A , CSD17579Q5A , CSD17581Q3A , CSD17581Q5A , CSD18501Q5A , CSD18502Q5B , CSD18503Q5A , CSD18504Q5A , CSD18509Q5B , CSD18510Q5B , CSD18511Q5A , CSD18512Q5B , CSD18513Q5A , CSD18514Q5A , CSD18531Q5A , CSD18532NQ5B , CSD18532Q5B , CSD18533Q5A , CSD18534Q5A , CSD18537NQ5A , CSD18540Q5B , CSD18543Q3A , CSD18563Q5A , CSD19502Q5B , CSD19531Q5A , CSD19532Q5B , CSD19533Q5A , CSD19534Q5A , CSD19537Q3 , CSD19538Q2 , CSD19538Q3A , CSD25310Q2 , CSD25402Q3A , CSD25404Q3 , CSD85301Q2 , CSD85312Q3E , CSD86330Q3D , CSD86336Q3D , CSD86350Q5D , CSD86356Q5D , CSD86360Q5D , CSD87312Q3E , CSD87313DMS , CSD87330Q3D , CSD87331Q3D , CSD87333Q3D , CSD87334Q3D , CSD87335Q3D , CSD87350Q5D , CSD87351Q5D , CSD87351ZQ5D , CSD87352Q5D , CSD87353Q5D , CSD87355Q5D , CSD87502Q2 , CSD87503Q3E , CSD88584Q5DC , CSD88599Q5DC , DAC3482 , DAC3484 , LMR10510 , LMR10515 , LMR10520 , LMR10530 , MSC1202Y2 , MSC1202Y3 , MSP430F1122 , MSP430F1132 , MSP430F122 , MSP430F1222 , MSP430F123 , MSP430F1232 , MSP430F2001 , MSP430F2002 , MSP430F2003 , MSP430F2011 , MSP430F2012 , MSP430F2013 , MSP430F2013-EP , MSP430F2112 , MSP430F2122 , MSP430F2132 , MSP430FR5969 , MSP430G2001 , MSP430G2101 , MSP430G2102 , MSP430G2111 , MSP430G2112 , MSP430G2121 , MSP430G2131 , MSP430G2132 , MSP430G2152 , MSP430G2201 , MSP430G2201-Q1 , MSP430G2211 , MSP430G2212 , MSP430G2221 , MSP430G2231 , MSP430G2231-Q1 , MSP430G2232 , MSP430G2252 , MSP430G2302 , MSP430G2312 , MSP430G2332 , MSP430G2352 , MSP430G2402 , MSP430G2432 , MSP430G2452 , TLA2021 , TLA2022 , TLA2024 , TLV62065 , TLV62080 , TLV62085 , TLV62090 , TLV62130 , TLV62130A , TLV62150 , TLV62150A , TPS60150 , TPS60151 , TPS61020 , TPS61021A , TPS61024 , TPS61025 , TPS61026 , TPS61027 , TPS61028 , TPS61029 , TPS61029-Q1 , TPS61030 , TPS61031 , TPS61032 , TPS61042 , TPS61045 , TPS61086 , TPS61087 , TPS61087-Q1 , TPS61088 , TPS61089 , TPS61090 , TPS61091 , TPS61092 , TPS61093 , TPS61093-Q1 , TPS61100 , TPS61107 , TPS61120 , TPS61170 , TPS61170-Q1 , TPS61200 , TPS61201 , TPS61202 , TPS61240 , TPS61240-Q1 , TPS61251 , TPS61252 , TPS61260 , TPS61261 , TPS61291 , TPS62020 , TPS62021 , TPS62026 , TPS62040 , TPS62042 , TPS62043 , TPS62044 , TPS62046 , TPS62060 , TPS62061 , TPS62063 , TPS62065 , TPS62067 , TPS62080 , TPS62080A , TPS62081 , TPS62082 , TPS62085 , TPS62086 , TPS62087 , TPS62090 , TPS62090-Q1 , TPS62091 , TPS62092 , TPS62093 , TPS62095 , TPS62097 , TPS62097-Q1 , TPS62110 , TPS62110-EP , TPS62110-Q1 , TPS62111 , TPS62111-EP , TPS62112 , TPS62112-EP , TPS62113 , TPS62122 , TPS62125 , TPS62130 , TPS62130A , TPS62131 , TPS62132 , TPS62133 , TPS62134A , TPS62134B , TPS62134C , TPS62134D , TPS62135 , TPS62136 , TPS62140 , TPS62141 , TPS62142 , TPS62143 , TPS62150 , TPS62150A , TPS62151 , TPS62152 , TPS62153 , TPS62160 , TPS62161 , TPS62162 , TPS62163 , TPS62170 , TPS62171 , TPS62172 , TPS62173 , TPS62175 , TPS62177 , TPS62230 , TPS62231-Q1 , TPS622314-Q1 , TPS62240 , TPS62242 , TPS62243 , TPS62250 , TPS62260 , TPS62260-Q1 , TPS62261 , TPS62261-Q1 , TPS62262 , TPS62262-Q1 , TPS62263 , TPS62263-Q1 , TPS62270 , TPS62272 , TPS62273 , TPS62290 , TPS62290-Q1 , TPS62291 , TPS62293 , TPS62293-Q1 , TPS62300 , TPS62301 , TPS62302 , TPS62303 , TPS62304 , TPS62305 , TPS62320 , TPS62321 , TPS62352 , TPS62355 , TPS62400 , TPS62400-Q1 , TPS62401 , TPS62402 , TPS62403 , TPS62404 , TPS62404-Q1 , TPS62406-Q1 , TPS62407-Q1 , TPS62410 , TPS62410-Q1 , TPS62420 , TPS62420-Q1 , TPS62421 , TPS62422-Q1 , TPS62423-Q1 , TPS62424-Q1 , TPS62510 , TPS62560 , TPS62562 , TPS62590 , TPS62590-Q1 , TPS62730 , TPS62732 , TPS62733 , TPS62740 , TPS62750 , TPS62751 , TPS62821 , TPS62822 , TPS62823 , TPS62825 , TPS62826 , TPS62840 , TPS62870 , TPS62870-Q1 , TPS62871 , TPS62871-Q1 , TPS62872 , TPS62872-Q1 , TPS62873 , TPS62873-Q1 , TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1 , TPS63000 , TPS63000-Q1 , TPS63001 , TPS63002 , TPS63020 , TPS63021 , TPS63030 , TPS63031 , TPS63050 , TPS63051 , TPS63060 , TPS63061 , TPS63070 , TPS63700 , TPS63710 , TPS84620 , TPSM82810 , TPSM82813 , TPSM82816 , TPSM82821 , TPSM82822 , TPSM82864A , TPSM82866A , TPSM8287A06 , TPSM8287A12 , TPSM8287A15 , TUSB7320 , TUSB7340 , TUSB8040A , TUSB8040A1

 

  1.   1
  2.   QFN and SON PCB Attachment
  3.   Trademarks
  4. 1Texas Instruments Quad Flatpack No Leads and Small-Outline No Leads
    1. 1.1 Introduction
  5. 2Manufacturing Considerations
    1. 2.1 SMT Process
  6. 3Printed Circuit Board (PCB) Design Guidelines
    1. 3.1 Land Pad Styles
    2. 3.2 Land Pad Design
    3. 3.3 Lead Finger Pad PCB Design
    4. 3.4 Exposed Pad PCB Design
      1. 3.4.1 Thermal Pad Via Design
    5. 3.5 Solder Mask
    6. 3.6 Surface Finishes
    7. 3.7 Board Layout Considerations
  7. 4Solder Paste Screen Printing Process
    1. 4.1 Solder Paste
    2. 4.2 Solder Stencils
    3. 4.3 Lead Finger Stencil Design
    4. 4.4 Exposed-Pad Stencil Design
  8. 5Package to Board Assembly Process
    1. 5.1 Placement and Alignment
    2. 5.2 Solder Reflow
    3. 5.3 PCB Cleaning
    4. 5.4 Inspection
  9. 6Rework Guidelines (Hot Gas Convection and Manual)
    1. 6.1 Compound Removal
    2. 6.2 Site Redress
    3. 6.3 Component Replacement and Reflow
    4. 6.4 Manual Rework Considerations
  10. 7Revision History

Compound Removal

It is highly recommended to bake out the board before rework to reduce the risk of delaminating either the board or part. Removing the component is by far the easiest part of the rework process. After the thermal profile is optimized, the process parameters are used to remove the device.

The gas nozzle used during this process surrounds the device and seals against the board. The QFN or SON is heated from the top side with hot gas, while residual heat is exhausted up and away from adjacent components. The anti-crushing feature in the nozzle prevents excessive top-side force from being applied to the QFN and SON. The entire assembly is also heated from the bottom side with an under-board heater to help prevent warpage. Preheating the board to a fixed temperature before the component is heated also helps to ensure process repeatability. When the reflow process is complete, the nozzle vacuum cup is automatically activated and the component is slowly lifted off the pads. The vacuum cup in the nozzle is designed to disengage if the component has not fully reflowed for any reason. This prevents the potential for lifting pads. The application of flux is recommended for QFN and SON removal.

Table 6-1 lists generic guidelines to remove QFN packages assembled on a 0.056-in FR4 board. It is recommended to modify heating profiles for different board thicknesses and equipment used. Parts must not exceed the peak temperature as listed on the MSL label. Parts and boards must be baked out before rework to reduce the risk of delamination.

Table 6-1 Pb-Free Solder Component Removal
1.Apply flux paste to component.
2.Align nozzle over part to be removed.
3.Maintain nozzle 0.050-in over device. Take care to prevent overtravel of the vacuum tip, which can damage the part or vacuum tip when measuring this distance.
4.Preheat board to 90°C, nozzle warming up 20% air flow, 125°C
5.Soak stage: 20% air flow, 225°C, 90 s
6.Ramp stage: 20% air flow, 335°C, 30 s
7.Reflow stage: 25% air flow, 370°C, 65 s
8.Enable vacuum at the end of the reflow cycle, lower vacuum nozzle, and remove part.
9.Cool down stage: 40% air flow, 25°C, 50 s
10.Turn off the vacuum and remove part from nozzle.
11.Using any metal tweezers or rough handling can damage the part and render it unanalyzable.
12.Do not reuse the part after it is removed.