SLUA271C June   2002  – December 2023 ADS1013 , ADS1014 , ADS1015 , ADS1018 , ADS1112 , ADS1113 , ADS1114 , ADS1115 , ADS1118 , ADS1120 , ADS1148 , ADS114S06 , ADS114S06B , ADS114S08 , ADS114S08B , ADS1158 , ADS1191 , ADS1192 , ADS1203 , ADS1204 , ADS1205 , ADS1220 , ADS1225 , ADS1226 , ADS124S06 , ADS124S08 , ADS1257 , ADS1258 , ADS1261 , ADS1283 , ADS1287 , ADS1287D , ADS1291 , ADS1292 , ADS1292R , ADS1293 , ADS6222 , ADS6224 , ADS6242 , ADS6243 , ADS6244 , ADS6245 , ADS6422 , ADS6423 , ADS6424 , ADS6425 , ADS6442 , ADS6443 , ADS6444 , BQ24010 , BQ24012 , BQ24013 , BQ24020 , BQ24022 , BQ24023 , CC2560 , CC2564C , CSD13202Q2 , CSD15571Q2 , CSD16301Q2 , CSD16321Q5 , CSD16322Q5 , CSD16323Q3 , CSD16325Q5 , CSD16327Q3 , CSD16340Q3 , CSD16342Q5A , CSD16401Q5 , CSD16403Q5A , CSD16404Q5A , CSD16406Q3 , CSD16407Q5 , CSD16408Q5 , CSD16409Q3 , CSD16410Q5A , CSD16411Q3 , CSD16412Q5A , CSD16413Q5A , CSD16414Q5 , CSD16415Q5 , CSD16556Q5B , CSD16570Q5B , CSD17301Q5A , CSD17302Q5A , CSD17303Q5 , CSD17304Q3 , CSD17305Q5A , CSD17306Q5A , CSD17307Q5A , CSD17308Q3 , CSD17309Q3 , CSD17310Q5A , CSD17311Q5 , CSD17312Q5 , CSD17313Q2 , CSD17318Q2 , CSD17322Q5A , CSD17327Q5A , CSD17501Q5A , CSD17505Q5A , CSD17506Q5A , CSD17507Q5A , CSD17510Q5A , CSD17522Q5A , CSD17527Q5A , CSD17551Q3A , CSD17551Q5A , CSD17552Q3A , CSD17552Q5A , CSD17553Q5A , CSD17555Q5A , CSD17556Q5B , CSD17559Q5 , CSD17570Q5B , CSD17571Q2 , CSD17573Q5B , CSD17575Q3 , CSD17576Q5B , CSD17577Q3A , CSD17577Q5A , CSD17578Q3A , CSD17578Q5A , CSD17579Q3A , CSD17579Q5A , CSD17581Q3A , CSD17581Q5A , CSD18501Q5A , CSD18502Q5B , CSD18503Q5A , CSD18504Q5A , CSD18509Q5B , CSD18510Q5B , CSD18511Q5A , CSD18512Q5B , CSD18513Q5A , CSD18514Q5A , CSD18531Q5A , CSD18532NQ5B , CSD18532Q5B , CSD18533Q5A , CSD18534Q5A , CSD18537NQ5A , CSD18540Q5B , CSD18543Q3A , CSD18563Q5A , CSD19502Q5B , CSD19531Q5A , CSD19532Q5B , CSD19533Q5A , CSD19534Q5A , CSD19537Q3 , CSD19538Q2 , CSD19538Q3A , CSD25310Q2 , CSD25402Q3A , CSD25404Q3 , CSD85301Q2 , CSD85312Q3E , CSD86330Q3D , CSD86336Q3D , CSD86350Q5D , CSD86356Q5D , CSD86360Q5D , CSD87312Q3E , CSD87313DMS , CSD87330Q3D , CSD87331Q3D , CSD87333Q3D , CSD87334Q3D , CSD87335Q3D , CSD87350Q5D , CSD87351Q5D , CSD87351ZQ5D , CSD87352Q5D , CSD87353Q5D , CSD87355Q5D , CSD87502Q2 , CSD87503Q3E , CSD88584Q5DC , CSD88599Q5DC , DAC3482 , DAC3484 , LMR10510 , LMR10515 , LMR10520 , LMR10530 , MSC1202Y2 , MSC1202Y3 , MSP430F1122 , MSP430F1132 , MSP430F122 , MSP430F1222 , MSP430F123 , MSP430F1232 , MSP430F2001 , MSP430F2002 , MSP430F2003 , MSP430F2011 , MSP430F2012 , MSP430F2013 , MSP430F2013-EP , MSP430F2112 , MSP430F2122 , MSP430F2132 , MSP430FR5969 , MSP430G2001 , MSP430G2101 , MSP430G2102 , MSP430G2111 , MSP430G2112 , MSP430G2121 , MSP430G2131 , MSP430G2132 , MSP430G2152 , MSP430G2201 , MSP430G2201-Q1 , MSP430G2211 , MSP430G2212 , MSP430G2221 , MSP430G2231 , MSP430G2231-Q1 , MSP430G2232 , MSP430G2252 , MSP430G2302 , MSP430G2312 , MSP430G2332 , MSP430G2352 , MSP430G2402 , MSP430G2432 , MSP430G2452 , TLA2021 , TLA2022 , TLA2024 , TLV62065 , TLV62080 , TLV62085 , TLV62090 , TLV62130 , TLV62130A , TLV62150 , TLV62150A , TPS60150 , TPS60151 , TPS61020 , TPS61021A , TPS61024 , TPS61025 , TPS61026 , TPS61027 , TPS61028 , TPS61029 , TPS61029-Q1 , TPS61030 , TPS61031 , TPS61032 , TPS61042 , TPS61045 , TPS61086 , TPS61087 , TPS61087-Q1 , TPS61088 , TPS61089 , TPS61090 , TPS61091 , TPS61092 , TPS61093 , TPS61093-Q1 , TPS61100 , TPS61107 , TPS61120 , TPS61170 , TPS61170-Q1 , TPS61200 , TPS61201 , TPS61202 , TPS61240 , TPS61240-Q1 , TPS61251 , TPS61252 , TPS61260 , TPS61261 , TPS61291 , TPS62020 , TPS62021 , TPS62026 , TPS62040 , TPS62042 , TPS62043 , TPS62044 , TPS62046 , TPS62060 , TPS62061 , TPS62063 , TPS62065 , TPS62067 , TPS62080 , TPS62080A , TPS62081 , TPS62082 , TPS62085 , TPS62086 , TPS62087 , TPS62090 , TPS62090-Q1 , TPS62091 , TPS62092 , TPS62093 , TPS62095 , TPS62097 , TPS62097-Q1 , TPS62110 , TPS62110-EP , TPS62110-Q1 , TPS62111 , TPS62111-EP , TPS62112 , TPS62112-EP , TPS62113 , TPS62122 , TPS62125 , TPS62130 , TPS62130A , TPS62131 , TPS62132 , TPS62133 , TPS62134A , TPS62134B , TPS62134C , TPS62134D , TPS62135 , TPS62136 , TPS62140 , TPS62141 , TPS62142 , TPS62143 , TPS62150 , TPS62150A , TPS62151 , TPS62152 , TPS62153 , TPS62160 , TPS62161 , TPS62162 , TPS62163 , TPS62170 , TPS62171 , TPS62172 , TPS62173 , TPS62175 , TPS62177 , TPS62230 , TPS62231-Q1 , TPS622314-Q1 , TPS62240 , TPS62242 , TPS62243 , TPS62250 , TPS62260 , TPS62260-Q1 , TPS62261 , TPS62261-Q1 , TPS62262 , TPS62262-Q1 , TPS62263 , TPS62263-Q1 , TPS62270 , TPS62272 , TPS62273 , TPS62290 , TPS62290-Q1 , TPS62291 , TPS62293 , TPS62293-Q1 , TPS62300 , TPS62301 , TPS62302 , TPS62303 , TPS62304 , TPS62305 , TPS62320 , TPS62321 , TPS62352 , TPS62355 , TPS62400 , TPS62400-Q1 , TPS62401 , TPS62402 , TPS62403 , TPS62404 , TPS62404-Q1 , TPS62406-Q1 , TPS62407-Q1 , TPS62410 , TPS62410-Q1 , TPS62420 , TPS62420-Q1 , TPS62421 , TPS62422-Q1 , TPS62423-Q1 , TPS62424-Q1 , TPS62510 , TPS62560 , TPS62562 , TPS62590 , TPS62590-Q1 , TPS62730 , TPS62732 , TPS62733 , TPS62740 , TPS62750 , TPS62751 , TPS62821 , TPS62822 , TPS62823 , TPS62825 , TPS62826 , TPS62840 , TPS62870 , TPS62870-Q1 , TPS62871 , TPS62871-Q1 , TPS62872 , TPS62872-Q1 , TPS62873 , TPS62873-Q1 , TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1 , TPS63000 , TPS63000-Q1 , TPS63001 , TPS63002 , TPS63020 , TPS63021 , TPS63030 , TPS63031 , TPS63050 , TPS63051 , TPS63060 , TPS63061 , TPS63070 , TPS63700 , TPS63710 , TPS84620 , TPSM82810 , TPSM82813 , TPSM82816 , TPSM82821 , TPSM82822 , TPSM82864A , TPSM82866A , TPSM8287A06 , TPSM8287A12 , TPSM8287A15 , TUSB7320 , TUSB7340 , TUSB8040A , TUSB8040A1

 

  1.   1
  2.   QFN and SON PCB Attachment
  3.   Trademarks
  4. 1Texas Instruments Quad Flatpack No Leads and Small-Outline No Leads
    1. 1.1 Introduction
  5. 2Manufacturing Considerations
    1. 2.1 SMT Process
  6. 3Printed Circuit Board (PCB) Design Guidelines
    1. 3.1 Land Pad Styles
    2. 3.2 Land Pad Design
    3. 3.3 Lead Finger Pad PCB Design
    4. 3.4 Exposed Pad PCB Design
      1. 3.4.1 Thermal Pad Via Design
    5. 3.5 Solder Mask
    6. 3.6 Surface Finishes
    7. 3.7 Board Layout Considerations
  7. 4Solder Paste Screen Printing Process
    1. 4.1 Solder Paste
    2. 4.2 Solder Stencils
    3. 4.3 Lead Finger Stencil Design
    4. 4.4 Exposed-Pad Stencil Design
  8. 5Package to Board Assembly Process
    1. 5.1 Placement and Alignment
    2. 5.2 Solder Reflow
    3. 5.3 PCB Cleaning
    4. 5.4 Inspection
  9. 6Rework Guidelines (Hot Gas Convection and Manual)
    1. 6.1 Compound Removal
    2. 6.2 Site Redress
    3. 6.3 Component Replacement and Reflow
    4. 6.4 Manual Rework Considerations
  10. 7Revision History

5.1 Placement and Alignment

The pick and place accuracy governs the package placement and rotational (theta) alignment. This accuracy is equipment and process dependent. Slightly misaligned parts (less than 50% off the pad center) automatically self align during reflow (see Figure 5-1).

Grossly misaligned packages (greater than 50% off pad center) must be removed before reflow, as they can develop electrical shorts resulting from solder bridges if they are subjected to reflow. There are two popular methods for package alignment using machine vision:

  • Package silhouette, also called "back lighting". The vision system locates the package outline.
  • Lead-frame recognition, also called "front lighting". Some vision systems can directly locate the lead-frame pattern.

Both methods are acceptable for QFN and SON placement. The front lighting recognition type alignment tends to be more accurate, but is also slower because more complex vision processing is required on the pick and place machine.

The package silhouette method allows the pick and place system to run faster, but it is generally less accurate. Both methods are acceptable and have been successfully demonstrated by major pick and place equipment vendors and contract assembly houses.

A starting placement force of 1.5N is recommended and should be minimized where possible. After a placement force is selected, inspect all four sides of the QFN package to make sure that each side is seated in the solder paste. Excessive pressure can cause shorting due to solder squeeze out from under the part and, in extreme cases, can potentially crack the package. Location of the thinner QFN packages should be carefully considered. Excessive bending of the substrate can also lead to package damage and should be avoided in the assembly flow.