30V, N ch NexFET MOSFET™, single SON2x2, 32mOhm
Product details
Parameters
Features
- Optimized for 5-V Gate Drive
- Ultra-Low Qg and Qgd
- Low Thermal Resistance
- Pb-Free
- RoHS Compliant
- Halogen-Free
- SON 2-mm × 2-mm Plastic Package
- APPLICATIONS
- DC-DC Converters
- Battery and Load Management Applications
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Description
This 30-V, 24-mΩ, 2-mm × 2-mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion applications and optimized for 5-V gate drive applications. The 2-mm × 2-mm SON offers excellent thermal performance for the size of the package.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | CSD17313Q2 30-V N-Channel NexFET™ Power MOSFET datasheet (Rev. E) | Sep. 30, 2015 |
| Technical articles | Understanding the benefits of “lead-free” power MOSFETs | Feb. 07, 2019 | |
| Application note | QFN and SON PCB Attachment (Rev. B) | Aug. 24, 2018 | |
| Selection guide | Power Management Guide 2018 (Rev. R) | Jun. 25, 2018 | |
| Technical articles | When to use load switches in place of discrete MOSFETs | Feb. 03, 2016 | |
| Technical articles | 48V systems: Driving power MOSFETs efficiently and robustly | Oct. 08, 2015 | |
| Technical articles | Power Tips - DDR memory is everywhere! | Mar. 01, 2014 | |
| Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | Nov. 16, 2011 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
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Features
- TMDSCSK388: 60-mm x 44-mm DM388 processor board
- TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
- Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
- IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
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Features
- TMDSCSK8127: 60-mm x 44-mm TMS320DM8127 processor board
- TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
- Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
- IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
Software development
Design tools & simulation
Features
- Vary power supply conditions and observe TI’s most efficient solutions for any set of input parameters
- Select from a pre-established list of TI controllers or enter your own custom IC
- Rank solutions by effective power loss and compare by relative 1k price, device package, and total PCB footprint
- (...)
Features
- Calculates power loss for TI MOSFETs
Reference designs
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| (DQK) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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