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CSD16340Q3

ACTIVE

25-V, N channel NexFET™ power MOSFET, single SON 3 mm x 3 mm, 5.5 mOhm

A newer version of this product is available

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Pin-for-pin with same functionality to the compared device
CSD17577Q3A ACTIVE 30-V, N channel NexFET™ power MOSFET, single SON 3 mm x 3 mm, 6.4 mOhm This product has similar resistance and a lower price.

Product details

VDS (V) 25 VGS (V) 10 Type N-channel Configuration Single Rds(on) at VGS=4.5 V (max) (mΩ) 5.5 Rds(on) at VGS=2.5 V (max) (mΩ) 7.8 VGSTH typ (typ) (V) 0.85 QG (typ) (nC) 6.5 QGD (typ) (nC) 1.2 QGS (typ) (nC) 2.1 ID - silicon limited at TC=25°C (A) 21 ID - package limited (A) 60 Logic level Yes Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 25 VGS (V) 10 Type N-channel Configuration Single Rds(on) at VGS=4.5 V (max) (mΩ) 5.5 Rds(on) at VGS=2.5 V (max) (mΩ) 7.8 VGSTH typ (typ) (V) 0.85 QG (typ) (nC) 6.5 QGD (typ) (nC) 1.2 QGS (typ) (nC) 2.1 ID - silicon limited at TC=25°C (A) 21 ID - package limited (A) 60 Logic level Yes Rating Catalog Operating temperature range (°C) -55 to 150
VSON-CLIP (DQG) 8 10.89 mm² 3.3 x 3.3
  • Optimized for 5 V Gate Drive
  • Resistance Rated at VGS =2.5 V
  • Ultra-Low Qg and Qgd
  • Low Thermal Resistance
  • Avalanche Rated
  • Pb Free Terminal Plating
  • RoHS Compliant
  • Halogen Free
  • SON 3.3-mm × 3.3-mm Plastic
    Package
  • APPLICATIONS
    • Point of Load Synchronous
      Buck Converter for Applications
      in Networking, Telecom, and
      Computing Systems
    • Optimized for Control
      or Synchronous FET
      Applications

  • Optimized for 5 V Gate Drive
  • Resistance Rated at VGS =2.5 V
  • Ultra-Low Qg and Qgd
  • Low Thermal Resistance
  • Avalanche Rated
  • Pb Free Terminal Plating
  • RoHS Compliant
  • Halogen Free
  • SON 3.3-mm × 3.3-mm Plastic
    Package
  • APPLICATIONS
    • Point of Load Synchronous
      Buck Converter for Applications
      in Networking, Telecom, and
      Computing Systems
    • Optimized for Control
      or Synchronous FET
      Applications

This 25 V, 3.8 mΩ, 3.3 × 3.3 mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion and optimized for 5 V gate drive applications.

This 25 V, 3.8 mΩ, 3.3 × 3.3 mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion and optimized for 5 V gate drive applications.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet CSD16340Q3 25-V N-Channel NexFET Power MOSFET datasheet (Rev. E) PDF | HTML 04 Sep 2014
Application brief Estimating Leakage Currents of Power MOSFETs PDF | HTML 31 Oct 2025
Application note MOSFET Support and Training Tools (Rev. G) PDF | HTML 27 Oct 2025
Application note Avoid Common Mistakes When Selecting And Designing With Power MOSFETs PDF | HTML 06 Nov 2024
Application note Semiconductor and IC Package Thermal Metrics (Rev. D) PDF | HTML 25 Mar 2024
Application note Using MOSFET Transient Thermal Impedance Curves In Your Design PDF | HTML 18 Dec 2023
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 Dec 2023
Application note Using MOSFET Safe Operating Area Curves in Your Design PDF | HTML 13 Mar 2023
Application brief Tips for Successfully Paralleling Power MOSFETs PDF | HTML 31 May 2022
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018
Application note Ringing Reduction Techniques for NexFET High Performance MOSFETs 16 Nov 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Support software

LOAD-SWITCH-FET-LOSS-CALC Power Loss Calculation Tool for Load Switch

Quickly trade off size, cost and performance to select the optimal MOSFET based on application conditions.
Supported products & hardware

Supported products & hardware

Support software

NONSYNC-BOOST-FET-LOSS-CALC NONSYNC BOOST FET LOSS Calculator

MOSFET power loss calculator for non-synchronous boost converter
Supported products & hardware

Supported products & hardware

Simulation model

CSD16340Q3 TINA-TI Spice Model

SLIM145.TSM (7 KB) - TINA-TI Spice Model
Simulation model

CSD16340Q3 Unencrypted PSpice Model (Rev. B)

SLLM127B.ZIP (8 KB) - PSpice Model
Calculation tool

FET-SOA-CALC-SELECT MOSFET SOA calculation and selection tool

Excel based FET SOA calculation and selection tool
Supported products & hardware

Supported products & hardware

Calculation tool

MOTOR-DRIVE-FET-LOSS-CALC Power Loss Calculation Tool for BLDC Motor Drive

This is an Excel-based MOSFET power loss calculator for brushless DC motor drive applications.
Supported products & hardware

Supported products & hardware

Calculation tool

SLPR053 Power Loss Calculation Tool for Synchronous Inverting Buck Boost Converter

MOSFET power loss calculation and selection tool for synchronous inverting buck boost converter
Supported products & hardware

Supported products & hardware

Calculation tool

SYNC-BOOST-FET-LOSS-CALC Power Loss Calculation Tool for Synchronous Boost Converter

MOSFET power loss calculator for synchronous boost converter applications.

Supported products & hardware

Supported products & hardware

Calculation tool

SYNC-BUCK-FET-LOSS-CALC Power Loss Calculation Tool for Synchronous Buck Converter

Quickly trade off size, cost and performance to select the optimal MOSFET based on application conditions.
Supported products & hardware

Supported products & hardware

Calculation tool

SYNC-RECT-FET-LOSS-CALC — Power loss calculation tool for synchronous rectifier

MOSFET power loss calculator for synchronous rectifier applications
Reference designs

TIDA-01413 — ADAS 8-Channel Sensor Fusion Hub Reference Design with Two 4-Gbps Quad Deserializers

This sensor fusion hub reference design allows the connection of up to four 2-megapixel cameras and up to four radar modules over coaxial cable. This design utilizes these coaxial cables to provide power, backchannel communication, and clock synchronization to the sensors. The two 4 Gbps FPD-Link (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
VSON-CLIP (DQG) 8 Ultra Librarian

Ordering & quality

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  • REACH
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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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