Home Power management MOSFETs

CSD16570Q5B

ACTIVE

25-V, N channel NexFET™ power MOSFET, single SON 5 mm x 6 mm, 0.82 mOhm

Product details

VDS (V) 25 VGS (V) 20 Type N-channel Configuration Single Rds(on) at VGS=10 V (max) (mΩ) 0.59 Rds(on) at VGS=4.5 V (max) (mΩ) 0.82 VGSTH typ (typ) (V) 1.5 QG (typ) (nC) 95 QGD (typ) (nC) 31 QGS (typ) (nC) 29 ID - silicon limited at TC=25°C (A) 456 ID - package limited (A) 100 Logic level Yes Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 25 VGS (V) 20 Type N-channel Configuration Single Rds(on) at VGS=10 V (max) (mΩ) 0.59 Rds(on) at VGS=4.5 V (max) (mΩ) 0.82 VGSTH typ (typ) (V) 1.5 QG (typ) (nC) 95 QGD (typ) (nC) 31 QGS (typ) (nC) 29 ID - silicon limited at TC=25°C (A) 456 ID - package limited (A) 100 Logic level Yes Rating Catalog Operating temperature range (°C) -55 to 150
VSON-CLIP (DNK) 8 30 mm² 6 x 5
  • Extremely Low Resistance
  • Low Qg and Qgd
  • Low Thermal Resistance
  • Avalanche Rated
  • Pb Free Terminal Plating
  • RoHS Compliant
  • Halogen Free
  • SON 5-mm × 6-mm Plastic Package
  • Extremely Low Resistance
  • Low Qg and Qgd
  • Low Thermal Resistance
  • Avalanche Rated
  • Pb Free Terminal Plating
  • RoHS Compliant
  • Halogen Free
  • SON 5-mm × 6-mm Plastic Package

This 25 V, 0.49 mΩ, SON 5 × 6 mm NexFET™ power MOSFET is designed to minimize resistance for ORing and hot swap applications and is not designed for switching applications.

This 25 V, 0.49 mΩ, SON 5 × 6 mm NexFET™ power MOSFET is designed to minimize resistance for ORing and hot swap applications and is not designed for switching applications.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 9
Top documentation Type Title Format options Date
* Data sheet CSD16570Q5B 25-V N-Channel NexFET Power MOSFET datasheet (Rev. A) PDF | HTML 19 May 2017
Application brief Estimating Leakage Currents of Power MOSFETs PDF | HTML 31 Oct 2025
Application note MOSFET Support and Training Tools (Rev. G) PDF | HTML 27 Oct 2025
Application note Semiconductor and IC Package Thermal Metrics (Rev. D) PDF | HTML 25 Mar 2024
Application note Using MOSFET Transient Thermal Impedance Curves In Your Design PDF | HTML 18 Dec 2023
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 Dec 2023
Application note Using MOSFET Safe Operating Area Curves in Your Design PDF | HTML 13 Mar 2023
Application brief Tips for Successfully Paralleling Power MOSFETs PDF | HTML 31 May 2022
Application note Ringing Reduction Techniques for NexFET High Performance MOSFETs 16 Nov 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Support software

LOAD-SWITCH-FET-LOSS-CALC Power Loss Calculation Tool for Load Switch

Quickly trade off size, cost and performance to select the optimal MOSFET based on application conditions.
Supported products & hardware

Supported products & hardware

Support software

NONSYNC-BOOST-FET-LOSS-CALC NONSYNC BOOST FET LOSS Calculator

MOSFET power loss calculator for non-synchronous boost converter
Supported products & hardware

Supported products & hardware

Simulation model

CSD16570Q5B TINA-TI Spice Model

SLPM200.ZIP (4 KB) - TINA-TI Spice Model
Simulation model

CSD16570Q5B Unencrypted PSpice Model (Rev. B)

SLPM132B.ZIP (3 KB) - PSpice Model
Calculation tool

FET-SOA-CALC-SELECT MOSFET SOA calculation and selection tool

Excel based FET SOA calculation and selection tool
Supported products & hardware

Supported products & hardware

Calculation tool

SYNC-BUCK-FET-LOSS-CALC Power Loss Calculation Tool for Synchronous Buck Converter

Quickly trade off size, cost and performance to select the optimal MOSFET based on application conditions.
Supported products & hardware

Supported products & hardware

Reference designs

PMP23126 — 3-kW phase-shifted full bridge with active clamp reference design with > 270-W/in3 power density

This reference design is a GaN-based 3-kW phase-shifted full bridge (PSFB) targeting maximum power density. The design has an active clamp to minimize voltage stress on the secondary synchronous rectifier MOSFETs enabling use of lower voltage-rating MOSFETs with better figure-of-merit (FoM). (...)
Test report: PDF
Reference designs

PMP41081 — 1-kW, 12-V HHC LLC reference design using C2000™ real-time microcontroller

This reference design is a 1-kW, 400-V to 12-V half-bridge resonant DC/DC platform used to evaluate the load transient performance of hybrid-hysteretic control (HHC) with an F280039C microcontroller. HHC is a method which combines direct frequency control (DFC) and charge control, and is charge (...)
Test report: PDF
Reference designs

PMP40586 — 1-kW digital-controlled current mode LLC reference design

This reference design is an industry-first digital hybrid hysteretic control (HHC) solution, targeting server PSU applications with 12-V to 54-V output. This reference design shows the HHC control advantages by UCD3138, in a 400-V to 12-V 1-kW LLC power stage. This design achieves 8-kHz peak loop (...)
Test report: PDF
Reference designs

TIDA-010087 — 100-A Dual-phase digital control battery tester reference design

This reference design illustrates a method to precisely control the current and voltage of a bidirectional interleaved buck-converter power stage using a C2000™ microcontroller (MCU) and a precision ADC ADS131M08. This design achieves less than ±20-mA current regulation error, and (...)
Design guide: PDF
Reference designs

PMP40182 — Bi-Directional Battery Initialization System Power Board Reference Design

This reference design is a battery initialization reference design solution for automotive and battery applications. The module enables a high efficiency single stage conversion for charging and discharging the battery. This design features a 0.1% accurate current control loop using the high (...)
Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
VSON-CLIP (DNK) 8 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos