DRA718

Name: DRA718
Brand: TI
SKU: DRA718

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SoC-Prozessor Arm Cortex-A15, 1 GHz, mit Grafik & DSP für Infotainment & Kombiinstrument

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Datenblatt

document-pdfAcrobat DRA71x Infotainment Applications Processor datasheet (Rev. G) (Englisch) PDF | HTML

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DRA72x and DRA71x SoC for Automotive Infortainment Silicon Errata (Rev. F) (Englisch)

DRA718

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Datenblatt

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Produktdetails

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Architecture designed for infotainment applications
Video, image, and graphics processing support
- Full-HD video (1920 × 1080p, 60 fps)
- Multiple video input and video output
- 2D and 3D graphics
Arm^® Cortex^®-A15 microprocessor subsystem
C66x floating-point VLIW DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
Up to 512KB of on-chip L3 RAM
Level 3 (L3) and Level 4 (L4) interconnects
DDR3/DDR3L Memory Interface (EMIF) module
- Supports up to DDR-1333 (667 MHz)
- Up to 2GB across single chip select
Dual Arm® Cortex®-M4 Image Processing Units (IPU)
IVA-HD subsystem
Display subsystem
- Display controller With DMA engine and up to three pipelines
- HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
2D-graphics accelerator (BB2D) subsystem
- Vivante^® GC320 core
Video Processing Engine (VPE)
Single-core PowerVR™ SGX544 3D GPU
One Video Input Port (VIP) module
- Support for up to four multiplexed input ports
General-Purpose Memory Controller (GPMC)
Enhanced Direct Memory Access (EDMA) controller
2-port gigabit ethernet (GMAC)
- Up to two external ports
Sixteen 32-bit general-purpose timers
32-Bit MPU watchdog timer
Six high-speed inter-integrated circuit (I²C) ports
HDQ™/1-Wire^® interface
Ten configurable UART/IrDA/CIR modules
Four Multichannel Serial Peripheral Interfaces (McSPI)
Quad SPI Interface (QSPI)
Media Local Bus Subsystem (MLBSS)
Eight Multichannel Audio Serial Port (McASP) modules
SuperSpeed USB 3.0 dual-role device
High-speed USB 2.0 dual-role device
High-speed USB 2.0 on-the-go
Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD^®/SDIO)
PCI Express^® 3.0 subsystems with two 5-Gbps lanes
- One 2-lane Gen2-compliant port
- or two 1-lane Gen2-compliant ports
Dual Controller Area Network (DCAN) modules
- CAN 2.0B protocol
MIPI^® CSI-2 camera serial interface
Up to 186 General-Purpose I/O (GPIO) pins
Device security features
- Hardware crypto accelerators and DMA
- Firewalls
- JTAG lock
- Secure keys
- Secure ROM and boot
- Customer programmable keys
Power, reset, and clock management
On-chip debug with CTools technology
28-nm CMOS technology
17 mm × 17 mm, 0.65-mm pitch, 538-pin BGA (CBD)

Architecture designed for infotainment applications
Video, image, and graphics processing support
- Full-HD video (1920 × 1080p, 60 fps)
- Multiple video input and video output
- 2D and 3D graphics
Arm^® Cortex^®-A15 microprocessor subsystem
C66x floating-point VLIW DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
Up to 512KB of on-chip L3 RAM
Level 3 (L3) and Level 4 (L4) interconnects
DDR3/DDR3L Memory Interface (EMIF) module
- Supports up to DDR-1333 (667 MHz)
- Up to 2GB across single chip select
Dual Arm® Cortex®-M4 Image Processing Units (IPU)
IVA-HD subsystem
Display subsystem
- Display controller With DMA engine and up to three pipelines
- HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
2D-graphics accelerator (BB2D) subsystem
- Vivante^® GC320 core
Video Processing Engine (VPE)
Single-core PowerVR™ SGX544 3D GPU
One Video Input Port (VIP) module
- Support for up to four multiplexed input ports
General-Purpose Memory Controller (GPMC)
Enhanced Direct Memory Access (EDMA) controller
2-port gigabit ethernet (GMAC)
- Up to two external ports
Sixteen 32-bit general-purpose timers
32-Bit MPU watchdog timer
Six high-speed inter-integrated circuit (I²C) ports
HDQ™/1-Wire^® interface
Ten configurable UART/IrDA/CIR modules
Four Multichannel Serial Peripheral Interfaces (McSPI)
Quad SPI Interface (QSPI)
Media Local Bus Subsystem (MLBSS)
Eight Multichannel Audio Serial Port (McASP) modules
SuperSpeed USB 3.0 dual-role device
High-speed USB 2.0 dual-role device
High-speed USB 2.0 on-the-go
Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD^®/SDIO)
PCI Express^® 3.0 subsystems with two 5-Gbps lanes
- One 2-lane Gen2-compliant port
- or two 1-lane Gen2-compliant ports
Dual Controller Area Network (DCAN) modules
- CAN 2.0B protocol
MIPI^® CSI-2 camera serial interface
Up to 186 General-Purpose I/O (GPIO) pins
Device security features
- Hardware crypto accelerators and DMA
- Firewalls
- JTAG lock
- Secure keys
- Secure ROM and boot
- Customer programmable keys
Power, reset, and clock management
On-chip debug with CTools technology
28-nm CMOS technology
17 mm × 17 mm, 0.65-mm pitch, 538-pin BGA (CBD)

The DRA71x processor is offered in a 538-ball, 17×17-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (BGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6" and DRA72x "Jacinto 6 Eco" family of infotainment processors, including graphics, voice, HMI, multimedia and smartphone projection mode capabilities.

Programmability is provided by a single-core Arm Cortex-A15 RISC CPU with Arm Neon™ extensions and a TI C66x VLIW floating-point DSP core. The Arm processor lets developers keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The DRA71x Jacinto 6 Entry processor family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA71x processor is offered in a 538-ball, 17×17-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (BGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6" and DRA72x "Jacinto 6 Eco" family of infotainment processors, including graphics, voice, HMI, multimedia and smartphone projection mode capabilities.

Programmability is provided by a single-core Arm Cortex-A15 RISC CPU with Neon extensions and a TI C66x VLIW floating-point DSP core. The Arm processor lets developers keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The DRA71x Jacinto 6 Entry processor family is qualified according to the AEC-Q100 standard.

The device features are simplified power supply rail mapping which enables lower cost PMIC solutions.