Inicio Microcontroladores (MCU) y procesadores Microprocesadores y DSP Sistemas automotrices SoC de asistencia al conductor
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Microcontroladores (MCU) y procesadores
Microprocesadores y DSP
Sistemas automotrices SoC de asistencia al conductor

TDA3MV

ACTIVO

SoC con procesamiento completo de baja potencia, aceleración de imágenes y visión para apps ADAS

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TDA3MV

ACTIVO
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Detalles del producto

Coprocessors 2 Arm Cortex-M4 Display type 1 PARALLEL OUT, 1 TV OUT Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE), 1 Image Subsystem Processor Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
Coprocessors 2 Arm Cortex-M4 Display type 1 PARALLEL OUT, 1 TV OUT Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE), 1 Image Subsystem Processor Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) PDF | HTML 04 feb 2020
* Errata TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) 01 oct 2019
User guide Single LP8733-Q1 User's Guide to Power DRA78x and TDA3 (Rev. A) PDF | HTML 31 mar 2021
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 24 jul 2020
User guide TDA3x Technical Reference Manual (Rev. D) 29 jul 2019
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 10 jun 2019
Application note TDA3xx Tester On Chip (TESOC) (Rev. A) 19 oct 2018
Application note ECC/EDC on TDAxx (Rev. B) 13 jun 2018
Application note TMS320C66x XMC Memory Protection 31 ene 2018
Application note DSS Bit Exact Output (Rev. A) 12 ene 2018
Application note Flashing Utility - mflash 09 ene 2018
White paper Embedded low-power deep learning with TIDL 08 dic 2017
Application note Dynamic Backup Lines PDF | HTML 14 nov 2017
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 07 nov 2017
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 03 nov 2017
Application note DSS BT656 Workaround for TDA2x (Rev. A) 03 nov 2017
Functional safety information Safety Features on VisionSDK 26 oct 2017
Application note IISS Image Pipe for Alternate CFA Formats 16 ago 2017
Functional safety information Safety Manual for TDA3x Automotive Vision Safety Critical Applications Processor 18 jul 2017
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 15 dic 2016
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 23 ago 2016
Application note ADC as Voltage Monitoring in TDA3x 20 jun 2016
Application note TDA3xx ISS Tuning and Debug Infrastructure 02 jun 2016
Application note ADAS Power Management 07 mar 2016
White paper Multicore SoCs stay a step ahead of SoC FPGAs 23 feb 2016
Application note TDA3x Error Signaling Module (ESM) 26 ene 2016
White paper Surround view camera systems for ADAS (Rev. A) 20 oct 2015
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 13 ago 2014
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 14 abr 2014
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 16 oct 2013
White paper Empowering Automotive Vision with TI’s Vision AccelerationPac 13 oct 2013

Diseño y desarrollo

Soluciones de alimentación

Busque las soluciones de alimentación disponibles para el TDA3MV. TI ofrece soluciones de alimentación para sistemas en chip (SoC), procesadores, microcontroladores, sensores y matrices de compuertas programables de campo (FPGA), sean o no de TI.

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Placa de evaluación

D3-3P-RVP-TDA3X — Kit del desarrollador RVP-TDA3x de D3 Embedded para procesadores TDA3

La RVP-TDA3x es una plataforma multicámara para sistemas avanzados de asistencia al conductor (ADAS) de bajo costo. Incluye el Pac de aceleración de visión (EVE) y cuenta con un ISP (procesador de señal de imagen) integrado. No incluye un núcleo ARM ni un CÓDEC. El kit de desarrollo admite cuatro (...)

Desde: D3 Embedded
Visitar el sitio del socio
Placa de evaluación

TDA3XEVM — TDA3X Módulo de evaluación

The TDA3x evaluation module (EVM) is an evaluation platform designed to speed up development efforts and reduce time-to-market for ADAS applications. The EVM is based on the TDA3x SoC, which incorporates a heterogeneous, scalable architecture that includes a mixture of the following:

  • TI’s (...)
Desde: SVTRONICS INC
Guía del usuario: PDF
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Sonda de depuración

LB-3P-TRACE32-DSP — Sistema de depuración y seguimiento Lauterbach TRACE32 para procesadores de señales digitales (DSP)

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)

Desde: Lauterbach GmbH
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Kit de desarrollo

D3-3P-TDA3X-SK — Kit de inicio de automoción DesignCore® D3 Embedded TDA3x para procesadores TDA3

Este kit de inicio de sobremesa le permite evaluar la tecnología integrada de los sistemas avanzados de asistencia al conductor (ADAS) en una plataforma electrónica que se diseñó teniendo en cuenta la producción. Basado en el procesador de visión avanzada TDA3x de Texas Instruments, este kit (...)

Desde: D3 Embedded
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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

Productos y hardware compatibles

Productos y hardware compatibles
Opciones de descarga
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

Productos y hardware compatibles

Productos y hardware compatibles
Opciones de descarga
IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar Opciones de descarga
IDE, configuración, compilador o depurador

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar Opciones de descarga
Sistema operativo (SO)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
Desde: QNX Software Systems
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Soporte de software

VCTR-3P-MICROSAR — Software de vector MICROSAR AUTOSAR para microcontroladores y computadoras de alto rendimiento (H

Las familias de productos MICROSAR y DaVinci simplifican el desarrollo de unidades de control electrónico (ECU) con software sofisticados integrados y herramientas de desarrollo poderosas para microcontroladores y HPC. Con el software de infraestructura avanzado, puede crear una base óptima para (...)
Desde: Vector Informatik GmbH
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Modelo de simulación

TDA3x BSDL Model

SPRM714.ZIP (9 KB) - BSDL Model
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Modelo de simulación

TDA3x IBIS Model

SPRM702.ZIP (10940 KB) - IBIS Model
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Modelo de simulación

TDA3x Thermal Model

SPRM701.ZIP (1 KB) - Thermal Model
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Herramienta de cálculo

CLOCKTREETOOL — Herramienta de árbol de reloj para Sitara, automoción, análisis de visión y procesadores de señal di

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
Guía del usuario: PDF
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCBGA (ABF) 367 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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