CC1312PSIP

ACTIVO

Módulo de sistema en encapsulado (SIP) Sub-1 GHz con amplificador de potencia integrado

Detalles del producto

Protocols 6LoWPAN, IEEE 802.15.4, MIOTY, Wi-SUN, Wi-SUN NWP, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, OOK Frequency bands 861-1054 Type Wireless module TX power (max) (dBm) 14, 20 RAM (kByte) 88 Flash memory (kByte) 352 CPU Arm Cortex-M4F Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 8-bit DAC, I2C, I2S, Real-time clock (RTC) Number of GPIOs 30 RX current (lowest) (mA) 5.8 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled No
Protocols 6LoWPAN, IEEE 802.15.4, MIOTY, Wi-SUN, Wi-SUN NWP, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, OOK Frequency bands 861-1054 Type Wireless module TX power (max) (dBm) 14, 20 RAM (kByte) 88 Flash memory (kByte) 352 CPU Arm Cortex-M4F Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 8-bit DAC, I2C, I2S, Real-time clock (RTC) Number of GPIOs 30 RX current (lowest) (mA) 5.8 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled No
QFM (MOT) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.9 mA active mode, CoreMark
    • 60 µA/MHz running CoreMark®
    • 0.9 µA standby mode, RTC, 80KB SRAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 5.8 mA RX at 868 MHz
    • 28.7 mA TX at +14 dBm at 868 MHz
    • 62 mA TX at +19 dBm at 915 MHz
    • 86 mA TX at +20 dBm at 915 MHz

Wireless protocol support

High-performance radio

  • –119 dBm for 2.5 kbps long-range mode
  • –108 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +20 dBm with temperature and voltage compensation

Regulatory compliance

  • Certified module for:
    • FCC CFR47 Part 15
    • ISED Certified (Canada)

  • Suitable for systems targeting compliance with:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to 30 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC, two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • 1.8 V to 3.8 V single supply voltage
  • –40 to +105°C (+14 dBm PA)
  • –40 to +95°C (+20 dBm PA)

All necessary components integrated

  • 48-MHz crystal: RF accuracy ±10 ppm initial and over temperature
  • 32-kHz crystal: RTC accuracy ±50 ppm initial and over temperature
  • DC/DC converter components and decoupling
  • Single-RF pin for RX/TX with 50 Ohm impedance.

Package

  • 7-mm × 7-mm MOT (30 GPIOs)
  • Pin-to-pin compatible with CC2652RSIP and CC2652PSIP
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.9 mA active mode, CoreMark
    • 60 µA/MHz running CoreMark®
    • 0.9 µA standby mode, RTC, 80KB SRAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 5.8 mA RX at 868 MHz
    • 28.7 mA TX at +14 dBm at 868 MHz
    • 62 mA TX at +19 dBm at 915 MHz
    • 86 mA TX at +20 dBm at 915 MHz

Wireless protocol support

High-performance radio

  • –119 dBm for 2.5 kbps long-range mode
  • –108 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +20 dBm with temperature and voltage compensation

Regulatory compliance

  • Certified module for:
    • FCC CFR47 Part 15
    • ISED Certified (Canada)

  • Suitable for systems targeting compliance with:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to 30 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC, two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • 1.8 V to 3.8 V single supply voltage
  • –40 to +105°C (+14 dBm PA)
  • –40 to +95°C (+20 dBm PA)

All necessary components integrated

  • 48-MHz crystal: RF accuracy ±10 ppm initial and over temperature
  • 32-kHz crystal: RTC accuracy ±50 ppm initial and over temperature
  • DC/DC converter components and decoupling
  • Single-RF pin for RX/TX with 50 Ohm impedance.

Package

  • 7-mm × 7-mm MOT (30 GPIOs)
  • Pin-to-pin compatible with CC2652RSIP and CC2652PSIP
  • RoHS-compliant package

The SimpleLink™CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless module supporting Wi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm Cortex M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation and medical applications.

The CC1312PSIP has a low sleep current of 0.9 µA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-µA system current.

The CC1312PSIP has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP.

The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product to multiple communication standards. The common SimpleLink Low Power F2 SDK and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless module supporting Wi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm Cortex M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation and medical applications.

The CC1312PSIP has a low sleep current of 0.9 µA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-µA system current.

The CC1312PSIP has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP.

The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product to multiple communication standards. The common SimpleLink Low Power F2 SDK and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC1312PSIP SimpleLink™ Sub-1-GHz Wireless System-in-Package datasheet PDF | HTML 29 nov 2023
* Errata CC1312PSIP SimpleLink™ Wireless MCU Device PDF | HTML 07 jun 2023
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 27 jun 2024
Product overview TI Wi-SUN® FAN Stack - Software Overview (Rev. B) PDF | HTML 09 jun 2025
Application note Design Considerations for CC1312PSIP FCC and IC Certified RF Module PDF | HTML 11 sep 2024
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 ago 2024
Certificate LP-EM-CC1312PSIP EU Declaration of Conformity (DoC) 01 dic 2023
Application note TI 15.4-Stack Software PDF | HTML 17 oct 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 mar 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 dic 2021
More literature Webinar: Wireless mesh networking 04 mar 2021
Application note Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 14 sep 2020
Application note CC13xx IQ Samples (Rev. B) PDF | HTML 24 ago 2020
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28 ene 2020
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27 ene 2020
Application note Debugging Communication Range (Rev. A) PDF | HTML 23 may 2019
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 15 abr 2019
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10 ene 2019
Product overview Meet the SimpleLink™ Sensor Controller 04 ene 2019
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 05 nov 2018
Application note Low-Power ADC Solution for CC13x2 and CC26x2 02 mar 2018
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs 27 feb 2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 27 feb 2018
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05 mar 2017
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 feb 2017
Application note AN058 -- Antenna Selection Guide (Rev. B) 06 oct 2010

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

LP-EM-CC1312PSIP — Kit de desarrollo LaunchPad™ CC1312PSIP para MCU inalámbrico sub-1 GHz SimpleLink™

Este kit de desarrollo LaunchPad™ es para el módulo de sistema en encapsulado (SIP) RF CC1312PSIP. El módulo de RF tiene un amplificador de potencia integrado para funcionamiento por debajo de 1 GHz hasta +20 dBm. Los protocolos admitidos incluyen mioty, Wi-SUN®, TI 15.4 stack y protocolos RF (...)
Kit de desarrollo

LP-XDS110ET — Kit de desarrollo XDS110ET LaunchPad™ depurador con software EnergyTrace™

El depurador del kit de desarrollo LaunchPad LP-XDS110ET es una herramienta para programar y depurar microcontroladores, microprocesadores y dispositivos DSP compatibles con XDS de Texas Instruments (TI). El LP-XDS110ET puede conectarse directamente a kits de desarrollo Split Launchpad a través del (...)

Kit de desarrollo de software (SDK)

SIMPLELINK-LOWPOWER-F2-SDK SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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Kit de desarrollo de software (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

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Primeros pasos

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE, configuración, compilador o depurador

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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Capacitación en línea

SIMPLELINK-ACADEMY-CC13XX-CC26XX SimpleLink™ CC13xx and CC26xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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Herramienta de cálculo

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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Archivo Gerber

CC1312PSIP LaunchPad Development Kit

SWRR186.ZIP (4451 KB)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
QFM (MOT) 48 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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