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Microcontroladores (MCU) y procesadores
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SoC de redes industriales y multimedia

TDA4VM

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SoC con Dual Arm® Cortex®-A72, 8 TOPS de IA, C7xDSP y GPU para percepción visual y análisis

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TDA4VM

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Detalles del producto

CPU 2 Arm Cortex-A72 Frequency (MHz) 2000 Coprocessors 6 Arm Cortex-R5F Graphics acceleration 1 3D Display type 1 DSI, 1 EDP, 2 DPI Protocols Ethernet PCIe 4 PCIe Gen 3 switch Hardware accelerators Deep learning accelerator, Depth and motion processing accelerator, Video decode accelerator, Video encode accelerator, Vision processing accelerator Features Vision Analytics Operating system FreeRTOS, INTEGRITY, Linux, QNX, SafeRTOS, VxWorks, u-velOSity Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Catalog Power supply solution LP8764-Q1, TPS6594-Q1 Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
CPU 2 Arm Cortex-A72 Frequency (MHz) 2000 Coprocessors 6 Arm Cortex-R5F Graphics acceleration 1 3D Display type 1 DSI, 1 EDP, 2 DPI Protocols Ethernet PCIe 4 PCIe Gen 3 switch Hardware accelerators Deep learning accelerator, Depth and motion processing accelerator, Video decode accelerator, Video encode accelerator, Vision processing accelerator Features Vision Analytics Operating system FreeRTOS, INTEGRITY, Linux, QNX, SafeRTOS, VxWorks, u-velOSity Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Catalog Power supply solution LP8764-Q1, TPS6594-Q1 Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
FCBGA (ALF) 827 576 mm² 24 x 24

Processor cores:

  • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS
  • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz
  • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0GHz
    • 1MB shared L2 cache per dual-core Cortex-A72 cluster
    • 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 core
  • Six Arm Cortex-R5F MCUs at up to 1.0GHz
    • 16K I-Cache, 16K D-Cache, 64K L2 TCM
    • Two Arm Cortex-R5F MCUs in isolated MCU subsystem
    • Four Arm Cortex-R5F MCUs in general compute partition
  • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS
  • 3D GPU PowerVR Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec
  • Custom-designed interconnect fabric supporting near max processing entitlement

    Memory subsystem:

  • Up to 8MB of on-chip L3 RAM with ECC and coherency
    • ECC error protection
    • Shared coherent cache
    • Supports internal DMA engine
  • External Memory Interface (EMIF) module with ECC
    • Supports LPDDR4 memory types
    • Supports speeds up to 4266MT/s
    • 32-bit data bus with inline ECC
  • General-Purpose Memory Controller (GPMC)
  • 512KB on-chip SRAM in MAIN domain, protected by ECC

    Functional Safety:

  • Functional Safety-Compliant targeted (on select part numbers)
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262/IEC 61508 functional safety system design up to ASIL-D/SIL-3 targeted
    • Systematic capability up to ASIL-D/SC-3 targeted
    • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
    • Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
    • Safety-related certifications
      • ISO 26262 certification up to ASIL-D by TÜV SÜD planned
      • IEC 61508 certification up to SIL-3 by TÜV SÜD planned
  • AEC-Q100 qualified on part number variants ending in Q1

    Device security (on select part numbers):

  • Secure boot with secure run-time support
  • Customer programmable root key, up to RSA-4K or ECC-512
  • Embedded hardware security module
  • Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

    High speed serial interfaces:

  • Integrated Ethernet switch supporting up to 8 external ports
    • All ports support 2.5Gb SGMII
    • All ports support 1Gb SGMII/RGMII
    • All ports support 100Mb RMII
    • Any two ports support QSGMII (using 4 internal ports per QSGMII)
  • Up to four PCI-Express (PCIe) Gen3 controllers
    • Up to two lanes per controller
    • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
  • Two USB 3.0 dual-role device (DRD) subsystem
    • Two enhanced SuperSpeed Gen1 Ports
    • Each port supports Type-C switching
    • Each port independently configurable as USB host, USB peripheral, or USB DRD

    Automotive interfaces:

  • Sixteen Modular Controller Area Network (MCAN) modules with full CAN-FD support
  • Two CSI2.0 4L RX plus One CSI2.0 4L TX
    • 2.5Gbps RX throughput per lane (20Gbps total)

    Display subsystem:

  • One eDP/DP interface with Multi-Display Support (MST)
    • HDCP1.4/HDCP2.2 high-bandwidth digital content protection
  • One DSI TX (up to 2.5K)
  • Up to two DPI

    Audio interfaces:

  • Twelve Multichannel Audio Serial Port (MCASP) modules

    Video acceleration:

  • Ultra-HD video, one (3840 × 2160p, 60 fps), or two (3840 × 2160p, 30 fps) H.264/H.265 decode
  • Full-HD video, four (1920 × 1080p, 60 fps), or eight (1920 × 1080p, 30 fps) H.264/H.265 decode
  • Full-HD video, one (1920 × 1080p, 60 fps), or up to three (1920 × 1080p, 30 fps) H.264 encode

    Flash memory interfaces:

  • Embedded MultiMediaCard Interface ( eMMC™ 5.1)
  • Universal Flash Storage (UFS 2.1) interface with two lanes
  • Two Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
  • Two simultaneous flash interfaces configured as
    • One OSPI and one QSPI flash interfaces
    • or one HyperBus™ and one QSPI flash interface

    System-on-Chip (SoC) architecture:

  • 16-nm FinFET technology
  • 24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA (ALF), enables IPC class 3 PCB routing

    TPS6594-Q1 Companion Power Management ICs (PMIC):

  • Functional Safety support up to ASIL-D
  • Flexible mapping to support different use cases

Processor cores:

  • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS
  • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz
  • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0GHz
    • 1MB shared L2 cache per dual-core Cortex-A72 cluster
    • 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 core
  • Six Arm Cortex-R5F MCUs at up to 1.0GHz
    • 16K I-Cache, 16K D-Cache, 64K L2 TCM
    • Two Arm Cortex-R5F MCUs in isolated MCU subsystem
    • Four Arm Cortex-R5F MCUs in general compute partition
  • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS
  • 3D GPU PowerVR Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec
  • Custom-designed interconnect fabric supporting near max processing entitlement

    Memory subsystem:

  • Up to 8MB of on-chip L3 RAM with ECC and coherency
    • ECC error protection
    • Shared coherent cache
    • Supports internal DMA engine
  • External Memory Interface (EMIF) module with ECC
    • Supports LPDDR4 memory types
    • Supports speeds up to 4266MT/s
    • 32-bit data bus with inline ECC
  • General-Purpose Memory Controller (GPMC)
  • 512KB on-chip SRAM in MAIN domain, protected by ECC

    Functional Safety:

  • Functional Safety-Compliant targeted (on select part numbers)
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262/IEC 61508 functional safety system design up to ASIL-D/SIL-3 targeted
    • Systematic capability up to ASIL-D/SC-3 targeted
    • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
    • Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
    • Safety-related certifications
      • ISO 26262 certification up to ASIL-D by TÜV SÜD planned
      • IEC 61508 certification up to SIL-3 by TÜV SÜD planned
  • AEC-Q100 qualified on part number variants ending in Q1

    Device security (on select part numbers):

  • Secure boot with secure run-time support
  • Customer programmable root key, up to RSA-4K or ECC-512
  • Embedded hardware security module
  • Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

    High speed serial interfaces:

  • Integrated Ethernet switch supporting up to 8 external ports
    • All ports support 2.5Gb SGMII
    • All ports support 1Gb SGMII/RGMII
    • All ports support 100Mb RMII
    • Any two ports support QSGMII (using 4 internal ports per QSGMII)
  • Up to four PCI-Express (PCIe) Gen3 controllers
    • Up to two lanes per controller
    • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
  • Two USB 3.0 dual-role device (DRD) subsystem
    • Two enhanced SuperSpeed Gen1 Ports
    • Each port supports Type-C switching
    • Each port independently configurable as USB host, USB peripheral, or USB DRD

    Automotive interfaces:

  • Sixteen Modular Controller Area Network (MCAN) modules with full CAN-FD support
  • Two CSI2.0 4L RX plus One CSI2.0 4L TX
    • 2.5Gbps RX throughput per lane (20Gbps total)

    Display subsystem:

  • One eDP/DP interface with Multi-Display Support (MST)
    • HDCP1.4/HDCP2.2 high-bandwidth digital content protection
  • One DSI TX (up to 2.5K)
  • Up to two DPI

    Audio interfaces:

  • Twelve Multichannel Audio Serial Port (MCASP) modules

    Video acceleration:

  • Ultra-HD video, one (3840 × 2160p, 60 fps), or two (3840 × 2160p, 30 fps) H.264/H.265 decode
  • Full-HD video, four (1920 × 1080p, 60 fps), or eight (1920 × 1080p, 30 fps) H.264/H.265 decode
  • Full-HD video, one (1920 × 1080p, 60 fps), or up to three (1920 × 1080p, 30 fps) H.264 encode

    Flash memory interfaces:

  • Embedded MultiMediaCard Interface ( eMMC™ 5.1)
  • Universal Flash Storage (UFS 2.1) interface with two lanes
  • Two Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
  • Two simultaneous flash interfaces configured as
    • One OSPI and one QSPI flash interfaces
    • or one HyperBus™ and one QSPI flash interface

    System-on-Chip (SoC) architecture:

  • 16-nm FinFET technology
  • 24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA (ALF), enables IPC class 3 PCB routing

    TPS6594-Q1 Companion Power Management ICs (PMIC):

  • Functional Safety support up to ASIL-D
  • Flexible mapping to support different use cases

The TDA4VM processor family targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal and image processing in a functional safety compliant targeted architecture make the TDA4VM devices a great fit for several industrial applications, such as: Robotics, Machine Vision, Radar, and so on. The TDA4VM provides high performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in centralized ECUs or stand-alone sensors. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by automotive grade safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. The new “MMA” deep learning accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide vision pre-processing plus distance and motion processing with no impact on system performance.

General Compute Cores and Integration Overview

Separate dual core cluster configuration of Arm Cortex-A72 facilitates multi-OS applications with minimal need for a software hypervisor. Up to six Arm Cortex-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm Cortex-A72’s unencumbered for applications. The integrated “8XE GE8430” GPU offers up to 100 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the TDA4VM family also includes an MCU island eliminating the need for an external system microcontroller.

The TDA4VM processor family targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal and image processing in a functional safety compliant targeted architecture make the TDA4VM devices a great fit for several industrial applications, such as: Robotics, Machine Vision, Radar, and so on. The TDA4VM provides high performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in centralized ECUs or stand-alone sensors. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by automotive grade safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. The new “MMA” deep learning accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide vision pre-processing plus distance and motion processing with no impact on system performance.

General Compute Cores and Integration Overview

Separate dual core cluster configuration of Arm Cortex-A72 facilitates multi-OS applications with minimal need for a software hypervisor. Up to six Arm Cortex-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm Cortex-A72’s unencumbered for applications. The integrated “8XE GE8430” GPU offers up to 100 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the TDA4VM family also includes an MCU island eliminating the need for an external system microcontroller.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet TDA4VM Processors datasheet (Rev. K) PDF | HTML 22 abr 2024
* Errata J721E DRA829/TDA4VM Processors Silicon Revision 2.0/1.1/1.0 (Rev. F) PDF | HTML 26 feb 2025
* User guide J721E DRA829/TDA4VM Processors Silicon Revision 2.0, 1.1 Technical Reference Manual (Rev. D) PDF | HTML 16 ene 2025
Application note Boot Flow Options on TDA4 Devices PDF | HTML 05 ene 2026
Application note Memory allocation for TIDL usage PDF | HTML 10 nov 2025
Application note Optimizing TI Deep Learning Performance on C7xMMA Processors via Memory and DDR Bandwidth Reduction PDF | HTML 06 nov 2025
Application note Thermal Management of TDA4x and AM6x PDF | HTML 30 oct 2025
Application note MMA Diagnostic Test PDF | HTML 07 oct 2025
Functional safety information J7200, J721E, J721S2, J722S, J742S2, and J784S4 SDL TÜV SÜD Functional Safety Certificate (Rev. A) 25 sep 2025
Application brief Ethernet Firmware Debug Guide PDF | HTML 29 ago 2025
Functional safety information DRA829/TDA4VM TÜV SÜD Functional Safety Report - Industrial - PG2.0 (Rev. A) 28 ago 2025
Functional safety information DRA829_TDA4VM TÜV SÜD Functional Safety Certificate - Industrial (Rev. A) 28 ago 2025
Functional safety information TÜV SÜD Certificate for Functional Safety Software Development Process (Rev. D) 17 jun 2025
Application note Redundant Boot With Unified Boot Mode Using a Single eMMC on TI TDA4x PDF | HTML 06 jun 2025
White paper Securing Arm-Based Application Processors (Rev. F) PDF | HTML 26 feb 2025
Application note Surround View System ECU PDF | HTML 25 feb 2025
Application note MCAN Debug Guide PDF | HTML 18 feb 2025
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 28 ene 2025
Application brief Custom DDR Memory Mapping for Vision Applications on Jacinto SoCs PDF | HTML 16 dic 2024
Application note Jacinto 7 LPDDR4 Board Design and Layout Guidelines (Rev. F) PDF | HTML 05 ago 2024
Application note Performance Metrics of AM6x Processors as CODESYS EtherCAT Controller PDF | HTML 02 ago 2024
Application note Debugging GPU Driver Issues on TDA4x and AM6x Devices PDF | HTML 20 jun 2024
Application note Jacinto7 AM6x, TDA4x, and DRA8x High-Speed Interface Design Guidelines (Rev. A) PDF | HTML 04 jun 2024
Application note MMC SW Tuning Algorithm (Rev. A) PDF | HTML 14 may 2024
Application note Jacinto7 AM6x/TDA4x/DRA8x Schematic Checklist (Rev. B) PDF | HTML 04 abr 2024
Technical article How highly integrated embedded processors are advancing industrial robotics PDF | HTML 18 mar 2024
Technical article What’s the best type of computer vision for AI applications? PDF | HTML 05 ene 2024
Application note Jacinto7 HS Device Customer Return Process PDF | HTML 16 nov 2023
More literature Jacinto 7 EVM Quick Start Guide for TDA4VM and DRA829V Processors (Rev. A) PDF | HTML 09 ago 2023
Application note Understanding TDA4VM or DRA829 Memory for Optimal Performance PDF | HTML 14 jun 2023
User guide C6000-to-C7000 Migration User's Guide (Rev. E) PDF | HTML 29 mar 2023
White paper Designing an Efficient Edge AI System with Highly Integrated Processors (Rev. A) PDF | HTML 13 mar 2023
Application note Jacinto7 DDRSS Register Configuration Tool (Rev. B) PDF | HTML 30 ene 2023
Application note UART Log Debug System on Jacinto 7 SoC PDF | HTML 09 ene 2023
Application note TI Deep Learning Library Upgrade Solution PDF | HTML 21 dic 2022
Functional safety information Jacinto Functional Safety Enablers (Rev. A) PDF | HTML 12 dic 2022
Product overview Jacinto™ 7 Safety Product Overview PDF | HTML 15 ago 2022
Certificate J721E SDL TUV Certification 08 ago 2022
Application note Proof of Concept Enablement for Jacinto TDA4VM OpenVx Host on R5F MCU2_0 PDF | HTML 25 jul 2022
Application note Dual-TDA4x System Solution PDF | HTML 29 abr 2022
Application note SPI Enablement & Validation on TDA4 Family PDF | HTML 05 abr 2022
Technical article How are sensors and processors creating more intelligent and autonomous robots? PDF | HTML 29 mar 2022
User guide TPS65941213-Q1 and LP876411B4-Q1 PMIC User Guide for J721E, PDN-1A PDF | HTML 02 feb 2022
User guide TPS65941212-Q1 and TPS65941111-Q1 PMIC User Guide for J721E, PDN-0B (Rev. B) PDF | HTML 31 ene 2022
Technical article How to simplify your embedded edge AI application development PDF | HTML 28 ene 2022
User guide Optimized TPS65941213-Q1 and TPS65941111-Q1 PMIC User Guide for J721E, PDN-0C (Rev. A) PDF | HTML 26 ene 2022
Application note Jacinto7 HS Device Development PDF | HTML 13 ene 2022
Application note Enabling MAC2MAC Feature on Jacinto7 Soc 10 ene 2022
More literature Jacinto™ 7 automotive processors 14 dic 2021
Application note Jacinto 7 Display Subsystem Overview PDF | HTML 10 dic 2021
Application note Jacinto 7 Thermal Management Guide - Software Strategies PDF | HTML 10 dic 2021
Application note Jacinto7 HS Device Flashing Solution PDF | HTML 09 dic 2021
Functional safety information Leverage Jacinto 7 Processors Functional Safety Features for Automotive Designs (Rev. A) PDF | HTML 13 oct 2021
Application note Performance and power benchmarking with TDA4 Edge AI processors PDF | HTML 01 sep 2021
Application note TISCI Server Integration in Vector AUTOSAR PDF | HTML 16 jul 2021
Application note TDA4 Flashing Techniques PDF | HTML 08 jul 2021
Application note Jacinto 7 Camera Capture and Imaging Subsystem PDF | HTML 07 jul 2021
Application note J721E DDR Firewall Example PDF | HTML 01 jul 2021
Application note Hardware Accelerated Structure From Motion on TDA4VM PDF | HTML 23 abr 2021
Application note Efficient Visual Localization on TDA4VM (Rev. A) PDF | HTML 19 abr 2021
Functional safety information Build safer, efficient, intelligent and autonomous robots 04 mar 2021
Application note TDA4VMid VPAC ISP Tuning Overview (Rev. A) PDF | HTML 14 ene 2021
White paper Security Enablers on Jacinto™ 7 Processors 04 ene 2021
White paper Enabling Differentiation through MCU Integration on Jacinto™ 7 Processors 22 oct 2020
Application note OSPI Tuning Procedure PDF | HTML 08 jul 2020
Technical article Making ADAS technology more accessible in vehicles PDF | HTML 07 ene 2020
White paper A 360-degree view of surround-view and automated parking systems 10 dic 2019
User guide VCOP Kernel-C to C7000 Migration Tool User's Guide (Rev. C) PDF | HTML 11 ago 2019

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

J721EXCPXEVM — Placa de procesador común para procesadores Jacinto™ 7.

La placa de procesador común J721EXCP01EVM para procesadores Jacinto™ 7 permite evaluar aplicaciones de análisis visual y redes en los mercados automotriz e industrial. La placa de procesador común es compatible con todos los módulos del sistema de los procesadores Jacinto 7 (que se venden por (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

J721EXSOMXEVM — Sistema en módulo (SoM) con zócalo TDA4VM y DRA829V

El módulo de sistema integrado (SoM) J721EXSOMXEVM, combinado con la placa de procesador común J721EXPCP01EVM, se utiliza para evaluar los procesadores TDA4VM y DRA829V en aplicaciones de redes y análisis de visión en los mercados industrial y automotriz. Estos procesadores funcionan (...)

Guía del usuario: PDF | HTML
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Placa de evaluación

J7EXPCXEVM — Tarjeta de expansión de conmutador Gateway/Ethernet

Expand the capabilities of the J721EXCP01EVM common processor board for evaluating Jacinto 7 processors in vision analytics and networking applications in automotive and industrial markets with our Gateway/Ethernet switch expansion card.

Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

J7EXPEXEVM — Tarjeta de expansión de audio y pantalla

Expand the capabilities of the J721EXCP01EVM common processor board for evaluating Jacinto 7 processors in vision analytics and networking applications in automotive and industrial markets with our audio and display expansion card.
Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

SK-TDA4VM — Kit de arranque del procesador TDA4VM para sistemas de visión Edge AI

Haga que las cámaras inteligentes, los robots y las máquinas inteligentes cobren vida con el kit de inicio del procesador TDA4VM. Con un proceso de configuración rápido y una variedad de demostraciones y tutoriales básicos, puede comenzar a crear prototipos de una aplicación basada en visión en (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

BEAGL-BONE-AI-64 — Placa informática integrada BeagleBone® AI-64 basada en el procesador Jacinto™ TDA4VM Arm® Cortex®-7

BeagleBone® AI-64 de la Fundación BeagleBoard.org es un sistema completo para desarrollar soluciones de inteligencia artificial (IA) y aprendizaje automático con la comodidad y la capacidad de ampliación de la plataforma BeagleBone y los periféricos integrados para comenzar a aprender y crear (...)

Desde: BeagleBoard.org Foundation
No disponible en TI.com
Placa de evaluación

CONGA-3P-STDA4 — Sistema en módulo congatec STDA4 SMARC para SoC TDA4VM con DSP Arm Cortex-A72 C7x doble y GPU

El módulo SMARC STDA4 de Congatec se basa en el procesador de aplicaciones TDA4VM y el procesador de red DRA829J.
El módulo está diseñado para aprovechar la arquitectura SoC heterogénea con dos MCU Arm® Cortex®-A72, DSP y aceleradores para aprendizaje profundo (NPU) y multimedia (GPU), MCU Arm® (...)

Desde: congatec GmbH
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Placa de evaluación

FRMS-3P-INDUSTRIAL-VISION — Visión industrial FRAMOS para ajuste de cámaras/ISP, cámaras 3D, soluciones de imagen y visualizació

FRAMOS is passionate about imaging and vision technologies. These technologies play a key role in robotics, automation and IoT-connected factory and are key drivers in cognitive systems and vision based artificial intelligence.

Every embedded vision system has specific requirements that, in most (...)

Desde: Framos
Visitar el sitio del socio
Placa de evaluación

TECHN-3P-SOM-ROVY-4VM — TechNexion ROVY-4VM system-on-module for TDA4VM SoC with dual Arm® Cortex®-A72 C7x DSP GPU

The TechNexion ROVY-4VM is a system-on-module (SOM) developed for mobile robotic, industrial automation and machine vision applications. This SOM is designed for real-time processing in embedded vision applications. The TDA4VM SOC integrates dual ARM®v8 Cortex® A72, 6x 1.0 GHz ARM Cortex (...)

Desde: TechNexion
Visitar el sitio del socio
Sonda de depuración

TMDSEMU110-U — Sonda de depuración XDS110 JTAG

El XDS110 de Texas Instruments es una nueva clase de sonda de depuración (emulador) para procesadores integrados de TI. El XDS110 sustituye a la familia XDS100, al tiempo que es compatible con una mayor variedad de estándares (IEEE1149.1, IEEE1149.7, SWD) en un único pod. Todas las sondas de (...)

Guía del usuario: PDF
No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Sonda de depuración

LB-3P-TRACE32-ARM — Sistema de depuración y seguimiento Lauterbach TRACE32 para microcontroladores y procesadores basado

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of Arm®-based microcontrollers and processors. The globally renowned debug and trace solutions for embedded systems and SoCs are the perfect (...)

Desde: Lauterbach GmbH
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Sonda de depuración

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

Desde: TASKING Germany GmbH
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Kit de desarrollo

D3-3P-RVP-TDA4VX — Kit del desarrollador de DesignCore® D3 Embedded RVP-TDA3x para procesadores TDA3

El RVP-TDA4Vx es una plataforma multicámara que permite la adquisición sincrónica de ocho flujos de captura SerDes FPD-Link™ III, FPD-Link™ IV o GMSL2™ de 2MP con procesamiento y análisis en tiempo real. La salida de video del puerto de pantalla cuenta con tecnología MST y admite hasta 4 pantallas (...)

Desde: D3 Embedded
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Kit de desarrollo

SENST-3P-SG-CAMERA-MODULES — Sensing Technology camera modules for FPD-LINK

SENSING technology camera solutions can be readily integrated with TI processors and provide a complete vision solution for edge AI vision systems, it can provide FPDLink III & FPDLINK IV camera, GMSL camera, MIPI Camera for TDA4x and AM6x solutions.

Desde: Shenzhen SENSING Technology Co., Ltd
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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-J721E — Linux SDK for DRA829 & TDA4VM Jacinto™ Processors

Processor SDK RTOS (PSDK RTOS) can be used together with either Processor SDK Linux (PSDK Linux) or Processor SDK QNX (PSDK QNX) to form a multi-processor software development platform for TDA4VM and DRA829 SoCs within TI’s Jacinto™ platform. The SDK provides a comprehensive (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-RT-J721E — Linux-RT SDK for DRA829 & TDA4VM Jacinto™ Processors

Processor SDK RTOS (PSDK RTOS) can be used together with either Processor SDK Linux (PSDK Linux) or Processor SDK QNX (PSDK QNX) to form a multi-processor software development platform for TDA4VM and DRA829 SoCs within TI’s Jacinto™ platform. The SDK provides a comprehensive (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-SK-TDA4VM — Linux SDK for edge AI applications on TDA4VM Jacinto™ processors

Processor SDK RTOS (PSDK RTOS) can be used together with either Processor SDK Linux (PSDK Linux) or Processor SDK QNX (PSDK QNX) to form a multi-processor software development platform for TDA4VM and DRA829 SoCs within TI’s Jacinto™ platform. The SDK provides a comprehensive (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-QNX-J721E — QNX SDK for DRA829 & TDA4VM Jacinto™ Processors

Processor SDK RTOS (PSDK RTOS) can be used together with either Processor SDK Linux (PSDK Linux) or Processor SDK QNX (PSDK QNX) to form a multi-processor software development platform for TDA4VM and DRA829 SoCs within TI’s Jacinto™ platform. The SDK provides a comprehensive (...)

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Opciones de descarga
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-J721E — RTOS SDK for DRA829 & TDA4VM Jacinto™ Processors

Processor SDK RTOS (PSDK RTOS) can be used together with either Processor SDK Linux (PSDK Linux) or Processor SDK QNX (PSDK QNX) to form a multi-processor software development platform for TDA4VM and DRA829 SoCs within TI’s Jacinto™ platform. The SDK provides a comprehensive (...)

Productos y hardware compatibles

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Software de aplicación y estructura

EB-3P-TRESOS — Software Elektrobit EB tresos Classic AUTOSAR

Con décadas de experiencia en el campo del software básico, la línea de productos EB Tresos de Elektrobit y las soluciones personalizadas de AUTOSAR Classic ayudan a satisfacer los requisitos específicos de cada fabricante de automóviles al ofrecer software de última tecnología. Para cada proyecto, (...)
Desde: Elektrobit
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Software de aplicación y estructura

IGNTM-3P-AI-ROBOTICS — Servicios de Ignitarium para IA, fusión de sensores, ingeniería de percepción, robótica y segurid

Ignitarium cuenta con equipos especializados para desarrollar software dirigido a robots autónomos/vehículos autónomos. Este equipo desarrolla capacidades clave de fusión de sensores y algoritmos de planificación de rutas, incluida la detección y prevención dinámica de obstáculos mediante redes de (...)
Desde: Ignitarium
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Software de aplicación y estructura

MIMIK-3P-MICROSERVICES — Mimik micorservices enabled for TI's embedded processors for edge Compute

The edgeEngine Main-Child edition is specially developed for Heterogeneous Compute Platforms (HCP) such as TI-TDA4VM, TI-DRA829V, or TI-DRA821U. Along with other unique capabilities, the edgeEngine Main-Child edition provides a unique ability to dynamically execute microservices on  R5F (...)
Desde: mimik Technology Inc.
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Software de aplicación y estructura

MOMENTA-3P-DL-ALGORITHMS — Algoritmos de aprendizaje profundo de Momenta para aplicaciones de cámara frontal ADAS en procesador

Momenta’s deep learning based algorithms for ADAS applications make full use of the DSP cores and accelerators on TDA4x for neural network processing. Designed to achieve market leading computational and power efficiency, Momenta’s algorithms offer an array of pre- and post-imaging (...)
Desde: Momenta
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Ejemplo de código o demostración

ALDV-3P-INDUSTRIAL-VISION — Kit básico de visión integrada Allied Vision

Allied Vision helps people achieve their goals with industrial and embedded cameras for computer vision.

Allied Vision provides embedded system developers access to high-performance, industrial-grade camera modules and pave the way from PC to embedded systems for computer vision engineers. With the (...)

Desde: Allied Vision
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Ejemplo de código o demostración

AMZN-3P-EDGE-AI — Amazon Services para formación ML, gestión de modelos e IoT

AWS offers a comprehensive platform for machine learning (ML) services and internet of things (IoT) software services which can be leveraged and deployed on TI’s analytics processors like the TDA4x family of processors. Training and optimizing ML models require massive computing resources, so (...)
Desde: Amazon
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Ejemplo de código o demostración

D3-3P-DEV — Soporte D3 Embedded para cámaras IA, hardware, controladores y firmware

D3 Embedded es una empresa radicada en Estados Unidos que se especializa en soluciones de extremo a extremo que integran detección de visión y radar mmWave, conectividad, procesamiento integrado e inteligencia artificial para aplicaciones de alto rendimiento. Con más de 25 años de experiencia de (...)
Desde: D3 Embedded
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Ejemplo de código o demostración

KDN-3P-SLAM — Kudan SLAM para robótica en TI Edge AI

Kudan is a global deep technology company developing commercial artificial perception algorithms based on simultaneous localization and mapping (SLAM) since its founding in 2011. Kudan’s technology currently enables solutions for its partners in automotive, robotics, drone/UAV, mapping and (...)
Desde: Kudan Inc.
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Controlador o biblioteca

WIND-3P-VXWORKS-LINUX-OS — Procesadores Wind River VxWorks y sistemas operativos de Linux

Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)
Desde: Wind River Systems
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Firmware

USIT-3P-SECIC-HSM — Firmware Uni-Sentry SecIC-HSM

El SecIC-HSM está diseñado para cumplir con los requisitos de ciberseguridad necesarios para los chips MCU/SoC. El firmware HSM se puede aplicar en campos como automóviles, nuevas energías, fotovoltaica, robótica, salud y aviación. Las funciones de ciberseguridad proporcionadas disponibles incluyen (...)
Desde: Shanghai Uni-Sentry Intelligent Technology Co., LTD
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Firmware

USIT-3P-SECIC-PQC — Firmware de algoritmos Uni-Sentry SecIC-PQC

Las soluciones de seguridad de Uni-Sentry adoptan algoritmos PQC capaces de resistir las amenazas de descifrado planteadas por los ordenadores cuánticos a los algoritmos criptográficos tradicionales. El firmware del PQC está cooptimizado con el Módulo de Seguridad de Hardware (HSM), aprovechando la (...)
Desde: Shanghai Uni-Sentry Intelligent Technology Co., LTD
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IDE, configuración, compilador o depurador

C7000-CGT — C7000 code generation tools (CGT) - compiler

The TI C7000 C/C++ Compiler Tools support development of applications for TI C7000 Digital Signal Processor cores.

Code Composer Studio is the Integrated Development Environment (IDE) for TI embedded devices.  If you are looking to develop on a TI embedded device it is recommended to start (...)

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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar Opciones de descarga
IDE, configuración, compilador o depurador

DDR-CONFIG-J721E — DDR Configuration Tool

This SysConfig based tool simplifies the process of configuring the DDR Subsystem Controller and PHY to interface to SDRAM devices. Based on the memory device, board design, and topology the tool outputs files to initialize and train the selected memory.
Productos y hardware compatibles

Productos y hardware compatibles
Iniciar
IDE, configuración, compilador o depurador

EDGE-AI-STUDIO — Edge AI Studio

Edge AI Studio is a collection of graphical and command line tools designed to accelerate edge AI development on TI processors, microcontrollers and radar sensors. Whether developing a proof of concept using a model from the TI Model Zoo or leveraging your own model, Edge AI Studio provides the (...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar
IDE, configuración, compilador o depurador

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar Opciones de descarga
Capacitación en línea

BLACKBERRY-QNX-ACADEMY — BlackBerry® QNX® academy

Self-paced training to fast-track software innovation efforts and reduce risk in the development process of safety-critical products like industrial robots and AI vision systems.
Productos y hardware compatibles

Productos y hardware compatibles
Examinar
Capacitación en línea

EDGEAI-ACADEMY — Edge AI academy

Become an AI expert in days with learning modules, hands-on training and demonstrations.
Productos y hardware compatibles

Productos y hardware compatibles
Examinar
Sistema operativo (SO)

GHS-3P-INTEGRITY-RTOS — INTEGRITY RTOS de Green Hills

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
Desde: Green Hills Software
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Sistema operativo (SO)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

The µ-velOSity™ Safety RTOS is the smallest of Green Hills Software's real-time operating systems and was designed especially for microcontrollers. It supports a wide range of TI processor families using the Arm® Cortex-M or Cortex-R cores as a main CPU or as a co-processors (...)
Desde: Green Hills Software
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Sistema operativo (SO)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
Desde: QNX Software Systems
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Sistema operativo (SO)

TRZN-3P-TORIZON-OS — Torizon OS ready-to-use industrial embedded Linux distribution

Torizon OS is a free and open-source Industrial Embedded Linux OS focusing on simplifying the development and maintenance of products requiring high reliability and security. It features, among other essential services, an optimal container runtime and components for secure offline and remote (...)
Desde: Torizon
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Sistema operativo (SO)

WHIS-3P-SAFERTOS — RTOS de seguridad precertificado SAFERTOS de WITTENSTEIN

SAFERTOS® es un sistema operativo único en tiempo real diseñado para procesadores integrados. Está precertificado según las normas IEC 61508 SIL3 e ISO 26262 ASILD por TÜV SÜD. SAFERTOS® se diseñó específicamente para la seguridad por el equipo de expertos de WHIS y se usa globalmente en (...)
Desde: WITTENSTEIN High Integrity Systems
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Soporte de software

RDGRN-3P-SW-SERVICES — Servicios de RidgeRun para Linux, complementos de GStreamer y desarrollo de aplicaciones de IA

RidgeRun helps clients build, integrate, optimize, and maintain embedded software solutions to solve the unique challenges facing their specific industries and sectors. RidgeRun’s areas of expertise include:
  • Embedded Linux: Yocto, customization of BSPs, hardware bring up, camera drivers, ISP (...)
Desde: RidgeRun
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Soporte de software

VCTR-3P-MICROSAR — Software de vector MICROSAR AUTOSAR para microcontroladores y computadoras de alto rendimiento (H

Las familias de productos MICROSAR y DaVinci simplifican el desarrollo de unidades de control electrónico (ECU) con software sofisticados integrados y herramientas de desarrollo poderosas para microcontroladores y HPC. Con el software de infraestructura avanzado, puede crear una base óptima para (...)
Desde: Vector Informatik GmbH
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Soporte de software

VLAB-3P-V-EVM — Herramientas y plataformas de desarrollo virtual ASTC VLAB

VLAB Works es el líder de la industria en tecnología de software para el modelado, la simulación y la creación de prototipos virtuales de sistemas electrónicos integrados. Las tecnologías y soluciones VLAB permiten la aplicación de automatización y procesos ágiles al desarrollo de sistemas (...)
Desde: VLAB Works
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Modelo de simulación

DRA829 and TDA4VM BSDL File

SPRM751.ZIP (14 KB) - BSDL Model
Descargar
Modelo de simulación

DRA829 and TDA4VM IBIS File

SPRM752.ZIP (1983 KB) - IBIS Model
Descargar
Modelo de simulación

DRA829 and TDA4VM Thermal Model

SPRM753.ZIP (1 KB) - Thermal Model
Descargar
Herramienta de cálculo

CLOCKTREETOOL — Herramienta de árbol de reloj para Sitara, automoción, análisis de visión y procesadores de señal di

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
Guía del usuario: PDF
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCBGA (ALF) 827 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
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  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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