CC2652RB

ACTIVO

MCU inalámbrico multiprotocolo de 32 bits SimpleLink™ Arm Cortex-M4F de 2,4 GHz con resonador BAW si

Detalles del producto

CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Cryptographic accelerators RNG Edge AI enabled No
CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Cryptographic accelerators RNG Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC2652RB SimpleLink™ Crystal-less BAW Multiprotocol 2.4 GHz Wireless MCU datasheet (Rev. D) PDF | HTML 16 feb 2021
* Errata CC2652RB SimpleLink™ Multiprotocol 2.4-GHz MCU Device Revision E Silicon Errata (Rev. A) 04 dic 2019
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 27 jun 2024
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18 nov 2025
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 ago 2024
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02 may 2024
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 mar 2022
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 feb 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 feb 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 dic 2021
More literature Bluetooth® Low Energy connectivity solutions for automotive applications 15 dic 2021
Application note Hardware Migration From CC26x0 to CC26x2R (Rev. D) 23 ago 2021
Technical article How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic PDF | HTML 23 jul 2021
Application brief Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A) PDF | HTML 13 may 2021
White paper Dynamic Multi-Protocol (DMM) Performance 21 abr 2021
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 abr 2021
Technical article Back to basics: Exploring the benefits of affordable Bluetooth® Low Energy PDF | HTML 20 ago 2020
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17 jul 2020
Cybersecurity advisory Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 05 jun 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 may 2020
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 31 mar 2020
Application note Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 05 feb 2020
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28 ene 2020
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27 ene 2020
Application note Minimizing Frequency Error Due to Soldering Process on CC2652RB Crystal-Less MCU 15 ene 2020
Technical article Testing TI BAW resonator technology in mechanical shock and vibration environments PDF | HTML 09 ene 2020
Technical article Going crystal-less is easy with the world's first crystal-less, wireless SimpleLin PDF | HTML 02 ene 2020
White paper Exploring IoT wireless connectivity in mechanical shock and vibration environme 07 nov 2019
Technical article VIDEO: TI Bulk Acoustic Wave (BAW) resonator technology with Bluetooth 5 PDF | HTML 26 sep 2019
Application note Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 23 sep 2019
Application brief What's New in Zigbee 3.0 (Rev. A) PDF | HTML 06 jun 2019
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 29 may 2019
Application note Debugging Communication Range (Rev. A) PDF | HTML 23 may 2019
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 15 abr 2019
Technical article Top 5 things to know about TI BAW resonator technology PDF | HTML 27 feb 2019
Application note Getting Started With CC2652RB for Crystal-less BAW Operation 20 feb 2019
White paper SimpleLink Crystal-Less Wireless MCU based on TI BAW technology 18 feb 2019
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10 ene 2019
Application note RF PCB Simulation Cookbook 09 ene 2019
User guide LP-CC2652RB quick start guide 21 dic 2018
Application note Low-Power ADC Solution for CC13x2 and CC26x2 02 mar 2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 27 feb 2018
Application note Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 27 feb 2018
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05 mar 2017
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 feb 2017

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Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Herramienta de cálculo

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

Productos y hardware compatibles

Productos y hardware compatibles

Opciones de descarga
Herramienta de cálculo

ZIGBEE-POWER-CALC — Herramienta de cálculo de potencia de Z-Stack™

Esta herramienta se utiliza para permitir a los usuarios del programa SimpleLink™ Z-Stack™ analizar el perfil de alimentación del sistema para un dispositivo final inactivo dentro de una aplicación Zigbee. Esta calculadora permite al usuario evaluar la vida útil potencial de la batería del sistema (...)
Herramienta de diseño

SIMPLELINK-2-4GHZ-DESIGN-REVIEW Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

Productos y hardware compatibles

Productos y hardware compatibles

Herramienta de diseño

SIMPLELINK-2-4GHZ-DESIGN-REVIEWS — Revisiones de diseño de hardware para dispositivos SimpleLink™ CC2xxx

El proceso de revisión del diseño de hardware de SimpleLink le ofrece la posibilidad de ponerse en contacto, de forma personalizada, con un experto en la materia que puede ayudarlo a revisar su diseño y proporcionarle valiosos comentarios. Aquí encontrará un sencillo proceso de 3 pasos para (...)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RGZ) 48 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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