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AM2752-Q1

Name: AM2752-Q1
Brand: TI
SKU: AM2752-Q1
Price: 19.8 USD

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Procesador DSP de 32 GFLOPS para audio automotriz con doble núcleo ARM® Cortex-R5F y 7.125 MB de SRA

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Hoja de datos

document-pdfAcrobat AM275x Signal Processing Microcontrollers datasheet (Rev. A) (Inglés) PDF | HTML

Guías de usuario

document-pdfAcrobat
AM275x Technical Reference Manual (Rev. A) (Inglés)

Errata

document-pdfAcrobat
AM275x Errata (Rev. A) (Inglés)

AM2752-Q1

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Detalles del producto

CPU

Arm-Cortex - R5F

Features

Hardware ASRC, Multichannel audio serial ports (McASP)

Operating system

RTOS

Security

Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage

Rating

Automotive

Operating temperature range (°C)

CPU

Arm-Cortex - R5F

Features

Hardware ASRC, Multichannel audio serial ports (McASP)

Operating system

RTOS

Security

Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage

Rating

Automotive

Operating temperature range (°C)

FCCSP (ANJ)

361

249.64 mm² 15.8 x 15.8

Dual or Quad-core Arm Cortex R5F CPU with each core running up to 1GHz
- 32KB I-Cache with 64-bit ECC per CPU core
  - 4x8KB association
  - Single Error Correction, Double Error Detection ECC protected per 64 bits
- 32KB D-cache with 64-bit ECC per CPU core
  - 4x8KB association
  - Single Error Correction, Double Error Detection ECC protected per 64 bits
- 64KB Tightly Coupled Memory (TCM) per core, with 32-bit ECC
  - Single Error Correction, Double Error Detection ECC protected per 64 bits
  - Two Banks, A and B, 32KB each
    - Bank B split into B0 and B1, 16KB each
  - 128KB TCM for CPU0 in lockstep mode
- Up to 128KB Remote L2 Cache
  - 32B cache line
  - Up to 128KB L2 cache covering up to 16MB cacheable space
  - Read only, 8-way cache
  - Fast Local Copy (FLC) support
- For each cluster, lockstep or independent dual core operation supported
Single or Dual C7x DSP core with each core running up to 1GHz
- L1 memory architecture
  - 32KB I-Cache per core
  - 64KB D-Cache per core
- L2 memory architecture
  - 2.25MB with ECC protection on L2 SRAM
    - 2MB "Main" segment
    - 256KB "Auxiliary" segment
- Matrix Multiply Accelerator Version 2f (MMA2F) on DSP0
2x Asynchronous Audio Sample Rate Converter (ASRC)
- 140dB Signal-to-Noise ratio (SNR)
- Up to 8 pairs of input and output streams (up to 16 channels total) per ASRC
- Input and output sample rates from 8KHz to 216KHz
- 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

Up to 6MB of On-Chip Shared SRAM
Remote Low latency L2 cache (RL2), software programmable, allocated from SRAM
432KB of On-Chip SRAM in SMS Subsystem
- 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
- 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware

2 × Flash Sub Systems (FSS) that support Octal Serial Peripheral Interface (OSPI) at up to 166MHz SDR and 166MHz DDR at 1.8V and 3.3V with full XIP (eXecute In Place) which can be used for
- 1x FSS supporting OSPI OptiFlash memory technology, Firmware Over-The-Air upgrades (FOTA), and On The Fly Advanced Encryption Standard (OTFA)
- 1x FSS supporting OSPI or HyperRAM
- RAM expansion
1 × 8-bit Multi-Media Card/Secure Digital (eMMC/SD) interface

5 × Multichannel Audio Serial Ports (McASP)
- Transmit and Receive Clocks up to 50MHz
- Up to 26 Serial Data Pins across 5x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S) and Similar Formats
- Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive (256 Bytes)
- Support for audio reference output clock
8 × Universal Asynchronous RX-TX (UART) modules
5 × Serial Peripheral Interface (SPI) controllers
8 × Inter-Integrated Circuit (I2C) ports
5 × Modular Controller Area Network (MCAN) modules with CAN-FD support
3 × Enhanced Pulse Width Modulation (ePWM) modules
6 × Enhanced Capture (ECAP) modules
1 × 12-bit Analog to Digital Converters (ADC) with 4MSPS maximum sampling rate
Up to 167 General Purpose I/O (GPIO)

Integrated Ethernet Switch supporting (total 2 external ports)
- RMII (10/100) or RGMII (10/100/1000)
- IEEE 1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
- Supports 802.1Qav (eAVB)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine with 512 classifiers
- Priority flow control
- Four CPU hardware interrupt pacing
- IP/ UDP/ TCP checksum offload in hardware
USB 2.0
- Port configurable as USB host, USB device, or USB Dual-Role device
- Integrated USB VBUS detection

Hardware Security Module (HSM)
- Dedicated dual-core ARM Cortex-M4F Security co-processor with dedicated interconnect for security
- Dedicated security DMA and IPC subsystem for isolated processing
Secure boot support
- Hardware-enforced Root-of-Trust (RoT)
- Support to switch RoT via backup key
- Support for takeover protection, IP protection, and anti-roll back protection
Cryptographic acceleration supported
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
- Supports cryptographic cores
  - AES - 128/192/256-bit key sizes
  - SHA2 - 224/256/384/512-bit support
  - DRBG with true random number generator
  - PKA (Public Key Accelerator) to Assist in RSA/ECC processing: RSA-4096 bits, ECDSA, SM2DSA, Curve25519/448
  - Supports Chinese crypto algorithms: SM3 and SM4
- DMA support
Debugging security
- Secure software controlled debug access
- Security aware debugging
Trusted Execution Environment (TEE) supported
- Arm TrustZone based TEE
- Extensive firewall support for isolation
- Secure watchdog/timer/IPC
Secure storage support
On-the-Fly encryption and support for OSPI interface in XIP mode

Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety applications
- Documentation to be made available to aid ISO 26262 functional safety system design
- Systematic capability up to ASIL-D targeted
- Hardware integrity up to ASIL-B targeted
- Safety-related certification
  - ISO 26262 planned

Power modes supported by Device Manager:
- Active
- Standby
- IO Retention

UART
I2C EEPROM
OSPI NOR/NAND Flash
SD Card
eMMC
USB (host) Mass Storage
USB (device) boot from external host (DFU mode)
Ethernet

AEC-Q100 qualified for automotive applications
16-nm FinFET technology
15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP

Dual or Quad-core Arm Cortex R5F CPU with each core running up to 1GHz
- 32KB I-Cache with 64-bit ECC per CPU core
  - 4x8KB association
  - Single Error Correction, Double Error Detection ECC protected per 64 bits
- 32KB D-cache with 64-bit ECC per CPU core
  - 4x8KB association
  - Single Error Correction, Double Error Detection ECC protected per 64 bits
- 64KB Tightly Coupled Memory (TCM) per core, with 32-bit ECC
  - Single Error Correction, Double Error Detection ECC protected per 64 bits
  - Two Banks, A and B, 32KB each
    - Bank B split into B0 and B1, 16KB each
  - 128KB TCM for CPU0 in lockstep mode
- Up to 128KB Remote L2 Cache
  - 32B cache line
  - Up to 128KB L2 cache covering up to 16MB cacheable space
  - Read only, 8-way cache
  - Fast Local Copy (FLC) support
- For each cluster, lockstep or independent dual core operation supported
Single or Dual C7x DSP core with each core running up to 1GHz
- L1 memory architecture
  - 32KB I-Cache per core
  - 64KB D-Cache per core
- L2 memory architecture
  - 2.25MB with ECC protection on L2 SRAM
    - 2MB "Main" segment
    - 256KB "Auxiliary" segment
- Matrix Multiply Accelerator Version 2f (MMA2F) on DSP0
2x Asynchronous Audio Sample Rate Converter (ASRC)
- 140dB Signal-to-Noise ratio (SNR)
- Up to 8 pairs of input and output streams (up to 16 channels total) per ASRC
- Input and output sample rates from 8KHz to 216KHz
- 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

Up to 6MB of On-Chip Shared SRAM
Remote Low latency L2 cache (RL2), software programmable, allocated from SRAM
432KB of On-Chip SRAM in SMS Subsystem
- 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
- 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware

2 × Flash Sub Systems (FSS) that support Octal Serial Peripheral Interface (OSPI) at up to 166MHz SDR and 166MHz DDR at 1.8V and 3.3V with full XIP (eXecute In Place) which can be used for
- 1x FSS supporting OSPI OptiFlash memory technology, Firmware Over-The-Air upgrades (FOTA), and On The Fly Advanced Encryption Standard (OTFA)
- 1x FSS supporting OSPI or HyperRAM
- RAM expansion
1 × 8-bit Multi-Media Card/Secure Digital (eMMC/SD) interface

5 × Multichannel Audio Serial Ports (McASP)
- Transmit and Receive Clocks up to 50MHz
- Up to 26 Serial Data Pins across 5x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S) and Similar Formats
- Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive (256 Bytes)
- Support for audio reference output clock
8 × Universal Asynchronous RX-TX (UART) modules
5 × Serial Peripheral Interface (SPI) controllers
8 × Inter-Integrated Circuit (I2C) ports
5 × Modular Controller Area Network (MCAN) modules with CAN-FD support
3 × Enhanced Pulse Width Modulation (ePWM) modules
6 × Enhanced Capture (ECAP) modules
1 × 12-bit Analog to Digital Converters (ADC) with 4MSPS maximum sampling rate
Up to 167 General Purpose I/O (GPIO)

Integrated Ethernet Switch supporting (total 2 external ports)
- RMII (10/100) or RGMII (10/100/1000)
- IEEE 1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
- Supports 802.1Qav (eAVB)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine with 512 classifiers
- Priority flow control
- Four CPU hardware interrupt pacing
- IP/ UDP/ TCP checksum offload in hardware
USB 2.0
- Port configurable as USB host, USB device, or USB Dual-Role device
- Integrated USB VBUS detection

Hardware Security Module (HSM)
- Dedicated dual-core ARM Cortex-M4F Security co-processor with dedicated interconnect for security
- Dedicated security DMA and IPC subsystem for isolated processing
Secure boot support
- Hardware-enforced Root-of-Trust (RoT)
- Support to switch RoT via backup key
- Support for takeover protection, IP protection, and anti-roll back protection
Cryptographic acceleration supported
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
- Supports cryptographic cores
  - AES - 128/192/256-bit key sizes
  - SHA2 - 224/256/384/512-bit support
  - DRBG with true random number generator
  - PKA (Public Key Accelerator) to Assist in RSA/ECC processing: RSA-4096 bits, ECDSA, SM2DSA, Curve25519/448
  - Supports Chinese crypto algorithms: SM3 and SM4
- DMA support
Debugging security
- Secure software controlled debug access
- Security aware debugging
Trusted Execution Environment (TEE) supported
- Arm TrustZone based TEE
- Extensive firewall support for isolation
- Secure watchdog/timer/IPC
Secure storage support
On-the-Fly encryption and support for OSPI interface in XIP mode

Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety applications
- Documentation to be made available to aid ISO 26262 functional safety system design
- Systematic capability up to ASIL-D targeted
- Hardware integrity up to ASIL-B targeted
- Safety-related certification
  - ISO 26262 planned

Power modes supported by Device Manager:
- Active
- Standby
- IO Retention

UART
I2C EEPROM
OSPI NOR/NAND Flash
SD Card
eMMC
USB (host) Mass Storage
USB (device) boot from external host (DFU mode)
Ethernet

AEC-Q100 qualified for automotive applications
16-nm FinFET technology
15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP

The AM275x family of highly-integrated, high-performance microcontrollers is based on the Arm Cortex R5F and C7x floating point DSP cores. The microcontrollers enable original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support and rich user interfaces. The device offers the maximum flexibility of a fully integrated, mixed processor design

Key features and benefits:

Extensive audio interfacing with 5x McASP peripherals
Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD, UARTs, SPI and GPIOs.
Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.

Key features and benefits:

Extensive audio interfacing with 5x McASP peripherals
Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD, UARTs, SPI and GPIOs.
Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.

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Documentación técnica

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=Principal documentación para este producto seleccionada por TI

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Documentación principal	Tipo	Título	Opciones de formato	Fecha
*	Data sheet	AM275x Signal Processing Microcontrollers datasheet (Rev. A)	PDF \| HTML	27 jul 2025
*	Errata	AM275x Errata (Rev. A)	PDF \| HTML	29 jul 2025
*	User guide	AM275x Technical Reference Manual (Rev. A)	PDF \| HTML	19 ago 2025
	Application note	AM275x Audio Design Guide	PDF \| HTML	20 nov 2025

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

AUDIO-AM275-EVM — Módulo de evaluación de audio AM275x

El módulo de evaluación (EVM) AM275x es una plataforma de prueba, desarrollo y evaluación independiente que permite a los desarrolladores evaluar la funcionalidad del AM275x y desarrollar prototipos para diversas aplicaciones de audio multicanal. El módulo de evaluación (EVM) AM275x está equipado (...)

Guía del usuario: PDF | HTML

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Placa de evaluación

DP83867-EVM-AM — Módulo de evaluación AM2x y AM6x para placa complementaria de PHY Ethernet para automoción

El DP83867-EVM-AM es una placa complementaria para PHY Ethernet industrial para usarse con los módulos de evaluación de los microcontroladores de alto rendimiento basados en Arm. Esta placa complementaria Es una excelente opción para la evaluación inicial de Ethernet y la creación de prototipos con (...)

Guía del usuario: PDF | HTML

No disponible en TI.com

Placa de evaluación

TAS67CD-AEC — Tarjeta de expansión de audio del amplificador de clase D TAS67CD-AEC

La tarjeta complementaria TAS67CD-AEC implementa dos circuitos integrados de amplificador de audio TAS67x de clase D de 4 canales y es compatible con los DSP EVM de audio de TI a través del conector de factor de forma de tarjeta de expansión de audio (AEC). Cada tarjeta complementaria proporciona (...)

Guía del usuario: PDF | HTML

No disponible en TI.com

Kit de desarrollo de software (SDK)

AM275-AWE-SDK — Audio Weaver SDK based on AM275

This SDK provides a cohesive platform for audio signal chain processing by integrating with DSP Concepts' Audio Weaver (AWE). It includes the AM275-FREERTOS-SDK, low level drivers, and examples for audio signal chain layouts.