MSPM0L1306-Q1

ACTIVO

Arm® Cortex®-M0+ de 32 Mhz para automoción con memoria flash de 64 KB, 4 KB de RAM, ADC de 12 bits,

Detalles del producto

CPU Arm Cortex-M0+ Frequency (MHz) 32 Flash memory (kByte) 64 RAM (kByte) 4 ADC type 12-bit SAR Features 5-V-tolerant I/Os, AEC Q100, Comparator, DMA, LIN, Zero-drift OpAmp UART 2 TI functional safety category Functional Safety-Compliant Number of ADC channels 6, 8, 9, 10 SPI 1 Operating temperature range (°C) -40 to 125 Rating Automotive Operating system Not Applicable Nonvolatile memory (kByte) 64 Number of GPIOs 13, 20, 24, 28 Number of I2Cs 2 Security Secure debug
CPU Arm Cortex-M0+ Frequency (MHz) 32 Flash memory (kByte) 64 RAM (kByte) 4 ADC type 12-bit SAR Features 5-V-tolerant I/Os, AEC Q100, Comparator, DMA, LIN, Zero-drift OpAmp UART 2 TI functional safety category Functional Safety-Compliant Number of ADC channels 6, 8, 9, 10 SPI 1 Operating temperature range (°C) -40 to 125 Rating Automotive Operating system Not Applicable Nonvolatile memory (kByte) 64 Number of GPIOs 13, 20, 24, 28 Number of I2Cs 2 Security Secure debug
SOT-23-THN (DYY) 16 8.4 mm² 4.2 x 2 VQFN (RGE) 24 16 mm² 4 x 4 VQFN (RHB) 32 25 mm² 5 x 5 VSSOP (DGS) 20 24.99 mm² 5.1 x 4.9 VSSOP (DGS) 32 39.69 mm² 8.1 x 4.9 VSSOP (DGS) 28 34.79 mm² 7.1 x 4.9
  • AEC-Q100 qualified for automotive applications

    • Temperature grade 1: –40°C to +125°C, TA

  • Functional Safety Quality-Managed
    • Documentation available to aid in functional safety system design
  • Core
    • Arm 32-bit Cortex-M0+ CPU, frequency up to 32 MHz
  • Operating characteristics
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 64KB of flash
    • Up to 4KB of SRAM
  • High-performance analog peripherals
    • One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels
    • Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)
    • Two zero-drift, zero-crossover chopper operational amplifiers (OPA)
      • 0.5-µV/°C drift with chopping
      • Integrated programmable gain stage (1-32x)
    • One general-purpose amplifier (GPAMP)
    • One high-speed comparator (COMP) with 8-bit reference DAC
      • 32-ns propagation delay
      • Low power mode down to <1-µA
    • Programmable analog connections between ADC, OPAs, COMP, and DAC
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 71 µA/MHz (CoreMark)
    • STOP: 151 µA at 4 MHz and 44 µA at 32 kHz
    • STANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µs
    • SHUTDOWN: 61 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 3-channel DMA controller
    • 3-channel event fabric signaling system
    • Four 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channels
    • Windowed watchdog timer
  • Enhanced communication interfaces
    • Two UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBY
    • Two I2C interfaces; one supporting FM+ (1 Mbit/s) and both supporting SMBus, PMBus, and wakeup from STOP
    • One SPI supporting up to 16 Mbit/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)
    • Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)
  • Data integrity
    • Cyclic redundancy checker (CRC-16 or CRC-32)
  • Flexible I/O features
    • Up to 28 GPIOs
    • Two 5-V-tolerant open-drain IOs with fail-safe protection
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN (RHB)
    • 32-pin VSSOP (DGS)
    • 28-pin VSSOP (DGS)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS)
    • 16-pin SOT(DYY)
  • Family members (also see Device Comparison)
    • MSPM0L1304: 16KB of flash, 2KB of RAM
    • MSPM0L1305: 32KB of flash, 4KB of RAM
    • MSPM0L1306: 64KB of flash, 4KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L1306 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)
  • AEC-Q100 qualified for automotive applications

    • Temperature grade 1: –40°C to +125°C, TA

  • Functional Safety Quality-Managed
    • Documentation available to aid in functional safety system design
  • Core
    • Arm 32-bit Cortex-M0+ CPU, frequency up to 32 MHz
  • Operating characteristics
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 64KB of flash
    • Up to 4KB of SRAM
  • High-performance analog peripherals
    • One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels
    • Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)
    • Two zero-drift, zero-crossover chopper operational amplifiers (OPA)
      • 0.5-µV/°C drift with chopping
      • Integrated programmable gain stage (1-32x)
    • One general-purpose amplifier (GPAMP)
    • One high-speed comparator (COMP) with 8-bit reference DAC
      • 32-ns propagation delay
      • Low power mode down to <1-µA
    • Programmable analog connections between ADC, OPAs, COMP, and DAC
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 71 µA/MHz (CoreMark)
    • STOP: 151 µA at 4 MHz and 44 µA at 32 kHz
    • STANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µs
    • SHUTDOWN: 61 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 3-channel DMA controller
    • 3-channel event fabric signaling system
    • Four 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channels
    • Windowed watchdog timer
  • Enhanced communication interfaces
    • Two UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBY
    • Two I2C interfaces; one supporting FM+ (1 Mbit/s) and both supporting SMBus, PMBus, and wakeup from STOP
    • One SPI supporting up to 16 Mbit/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)
    • Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)
  • Data integrity
    • Cyclic redundancy checker (CRC-16 or CRC-32)
  • Flexible I/O features
    • Up to 28 GPIOs
    • Two 5-V-tolerant open-drain IOs with fail-safe protection
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN (RHB)
    • 32-pin VSSOP (DGS)
    • 28-pin VSSOP (DGS)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS)
    • 16-pin SOT(DYY)
  • Family members (also see Device Comparison)
    • MSPM0L1304: 16KB of flash, 2KB of RAM
    • MSPM0L1305: 32KB of flash, 4KB of RAM
    • MSPM0L1306: 64KB of flash, 4KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L1306 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)

MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.

MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.

MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.

MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet MSPM0L130x-Q1 Automotive Mixed-Signal Microcontrollers datasheet (Rev. A) PDF | HTML 22 dic 2023
* Errata MSPM0L130x-Q1 Microcontrollers (Rev. B) PDF | HTML 07 ago 2025
* User guide MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual (Rev. E) PDF | HTML 23 may 2025
User guide MSPM0 Bootloader User's Guide (Rev. A) PDF | HTML 08 ene 2026
Application note Cybersecurity Enablers in MSPM0 MCUs (Rev. A) PDF | HTML 10 dic 2025
Application note EMC Improvement Guide for MSPM0 (Rev. A) PDF | HTML 02 dic 2025
Application note MSPM0 L-Series MCUs Hardware Development Guide (Rev. B) PDF | HTML 29 sep 2025
Subsystem design DMA Ping Pong With ADC (Rev. B) PDF | HTML 09 sep 2025
Subsystem design Thermistor Temperature Sensing (Rev. A) PDF | HTML 09 sep 2025
Application note MSPM0 Bootloader Implementation (Rev. D) PDF | HTML 04 sep 2025
User guide MSPM0 MCUs Development Guide (Rev. G) PDF | HTML 27 ago 2025
Subsystem design 5V Interface (Rev. A) PDF | HTML 20 ago 2025
Subsystem design Emulate EEPROM with FLASH (Type A) (Rev. A) PDF | HTML 13 ago 2025
Subsystem design Common Amplifier Topologies: PGA (Rev. A) PDF | HTML 12 ago 2025
Subsystem design LED Driver With PWM (Rev. A) PDF | HTML 12 ago 2025
Subsystem design Transimpedance Amplifier (Rev. A) PDF | HTML 12 ago 2025
Application note Migration Guide From STM32 to Arm-Based MSPM0 (Rev. B) PDF | HTML 11 ago 2025
Subsystem design Emulate EEPROM With FLASH (Type B) (Rev. A) PDF | HTML 06 ago 2025
Subsystem design Frequency Counter: Tone Detection (Rev. A) PDF | HTML 06 ago 2025
Application note MSPM0 MCUs Quick Reference Guide (Rev. B) PDF | HTML 04 ago 2025
Subsystem design MCU Design Techniques: ADC to PWM (Rev. A) PDF | HTML 01 ago 2025
User guide MSPM0 Gauge L2 Solution Guide (Rev. B) PDF | HTML 30 jun 2025
Product overview MSPM0 MCUs: More Options, Unlimited Possibilities (Rev. B) PDF | HTML 29 jun 2025
Application note LIN Basics and Implementation on MSPM0 PDF | HTML 21 feb 2025
Application note Laser Speckle Reduction Solution in Projector based on MSPM0 MCU PDF | HTML 20 feb 2025
User guide Migration Guide From NXP to MSPM0 PDF | HTML 03 feb 2025
Application note Closed Loop Constant Power Drive to Simplify Heater Element Control and Extend Battery Life PDF | HTML 29 ene 2025
Application note Realization of Password-Protected Debug Based on Software PDF | HTML 06 mar 2024
Functional safety information MSPM0L130x-Q1 Functional Safety Manual PDF | HTML 22 dic 2023
Application brief Optimize Automotive Body Electronics Designs With AEC-Q100 MSPM0 MCUs PDF | HTML 24 oct 2023
Application note Operating Time of MSPM0 Powered by a Capacitor PDF | HTML 03 oct 2023
Application brief Using MSPM0 MCUs to Design Trapezoidal-Based BLDC Motor Controllers (Rev. A) PDF | HTML 14 sep 2023
Application brief Optimized H-Bridge Driver Control for Stepper and BDC Motors Using MSPM0 MCUs (Rev. A) PDF | HTML 06 sep 2023
Application note EEPROM Emulation Type A Solution PDF | HTML 18 abr 2023
Application note EEPROM Emulation Type B Design PDF | HTML 11 abr 2023
Application brief Increasing Flexibility in Your Battery Management Designs With a Low-Cost MSPM0 PDF | HTML 02 mar 2023
Application brief Optimizing Field Sensor and Transmitter Applications With MSPM0 MCUs PDF | HTML 02 mar 2023
Application note MSPM0 L-Series MCUs Power Optimization Guide PDF | HTML 22 feb 2023
Application note Make System Design Easy With MSPM0 Precision Analog PDF | HTML 22 feb 2023
Application note MSPM0L or MSPM0G: How to Pick the Right MSP Microcontroller for Your Application PDF | HTML 13 dic 2022

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Kit de desarrollo de software (SDK)

MSPM0-SDK MSPM0 Software Development Kit (SDK)

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MSPM0-DIAGNOSTIC-LIB MSPM0 diagnostic library

The MSPM0 diagnostic library software development kit (SDK) is a collection of functional safety software to assist customers to meet their functional safety diagnostic requirements.

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Firmware

LDC3114-MSPM0L1306-CODE-EXAMPLE Example code for the BOOST-LDC3114EVM connected to the LP-MSPM0L1306

Example code for using the BOOST-LDC3114EVM with the LP-MSPM0L1306
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Firmware

TMAG5273-MSPM0L1306-CODE-EXAMPLE Example Code for the TMAG5273EVM connected to the LP-MSPM01306

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GUI para el módulo de evaluación (EVM)

LP-MSPM0L1306-OOBE Out-of-box experience GUI for LP-MSPM0L1306

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GUI para el módulo de evaluación (EVM)

MSPM0-ANALOG-CONFIGURATOR Analog Configurator for MSPM0

The MSPM0 analog configurator is a graphical configuration tool designed to simplify and accelerate the design and enablement of an analog signal chain using a MSPM0 device with no traditional coding development necessary.

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CCSTUDIO-STARTHUB Example application browser

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MSP-MOTOR-CONTROL MSPM0 Firmware solutions for motor control applications

MSP Motor Control is a collection of software, tools and examples to spin motors in 30 minutes or less with MSPM0 Arm® Cortex® M0+ MCUs and popular motor driver solutions.

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TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE, configuración, compilador o depurador

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

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MSP-ZERO-CODE-STUDIO Graphical development environment for designing applications for MSP microcontrollers

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Capacitación en línea

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Sistema operativo (SO)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

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Herramienta de programación de software

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Herramienta de programación de software

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

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Design guide: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOT-23-THN (DYY) 16 Ultra Librarian
VQFN (RGE) 24 Ultra Librarian
VQFN (RHB) 32 Ultra Librarian
VSSOP (DGS) 20 Ultra Librarian
VSSOP (DGS) 32 Ultra Librarian
VSSOP (DGS) 28 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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