CC2755P10

ACTIVO

MCU inalám. SimpleLink™ Arm® Cortex®-M33, compat. EdgeAI, seg., +20 dBm y <1 µA en modo de espera

Detalles del producto

CPU Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 1024 RAM (kByte) 162 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125 Hardware accelerators CDE NPU Edge AI enabled Edge AI Studio enabled, Yes
CPU Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 1024 RAM (kByte) 162 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125 Hardware accelerators CDE NPU Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RHA) 40 36 mm² (6 mm × 6 mm)
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Matter
  • Zigbee 3.0 Certified
  • Thread
  • Proprietary systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm
    • IEEE 802.15.4 (2.4GHz): –103dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • 3.5mm × 3.4mm WCSP (Preview)

  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Matter
  • Zigbee 3.0 Certified
  • Thread
  • Proprietary systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm
    • IEEE 802.15.4 (2.4GHz): –103dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • 3.5mm × 3.4mm WCSP (Preview)

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation
    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation
    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos CC2755x10 SimpleLink Family of 2.4GHz High Performance Wireless MCUs datasheet (Rev. D) PDF | HTML 12/12/2025
* Guía del usuario CC27xx Technical Reference Manual (Rev. A) PDF | HTML 19/05/2025
* Errata Errata CC2755x10 SimpleLink™ Wireless MCU Device Revision F PDF | HTML 11/07/2025
Asesoramiento en ciberseguridad Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS PDF | HTML 28/05/2026
Asesoramiento en ciberseguridad Denial of Service during Bluetooth LE authentication and connection PDF | HTML 28/05/2026
Asesoramiento en ciberseguridad Enabling Tools Client Mode Leads to Possibility of Bypassing Debug Authentication on CC27xx Devices PDF | HTML 12/05/2026

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

LP-EM-CC2745R10-Q1 — Kit de desarrollo LaunchPad™ CC2745R10-Q1 para MCU inalámbrico de 2.4 GHz SimpleLink™

Este kit de desarrollo LaunchPad™ acelera el desarrollo en dispositivos con amplificador de potencia integrado y soporte de radio para funcionamiento de 2.4 Ghz. El LaunchPad viene equipado con un microcontrolador (MCU) inalámbrico que cumple con AEC-Q100 y es compatible con Bluetooth® baja energía (...)

Guía del usuario: PDF | HTML
Productos y hardware compatibles
En inventario
Límite:
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No disponible
Kit de desarrollo

LP-XDS110 — Depurador del kit de desarrollo LaunchPad™ XDS110

El depurador del kit de desarrollo LaunchPad LP-XDS110 es una herramienta para programar y depurar microcontroladores, microprocesadores y dispositivos DSP compatibles con XDS de Texas Instruments (TI). El LP-XDS110 está diseñado para conectarse directamente a Launchpads divididos a través del (...)

Productos y hardware compatibles
En inventario
Límite:
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No disponible
Kit de desarrollo

LP-XDS110ET — Kit de desarrollo XDS110ET LaunchPad™ depurador con software EnergyTrace™

El depurador del kit de desarrollo LaunchPad LP-XDS110ET es una herramienta para programar y depurar microcontroladores, microprocesadores y dispositivos DSP compatibles con XDS de Texas Instruments (TI). El LP-XDS110ET puede conectarse directamente a kits de desarrollo Split Launchpad a través del (...)

Productos y hardware compatibles
En inventario
Límite:
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No disponible
Sonda de depuración

TMDSEMU110-U — Sonda de depuración XDS110 JTAG

El XDS110 de Texas Instruments es una nueva clase de sonda de depuración (emulador) para procesadores integrados de TI. El XDS110 sustituye a la familia XDS100, al tiempo que es compatible con una mayor variedad de estándares (IEEE1149.1, IEEE1149.7, SWD) en un único pod. Todas las sondas de (...)

Productos y hardware compatibles
En inventario
Límite:
??asset.out-of-stock-ti_es_MX??
No disponible
Kit de desarrollo de software (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

SIMPLELINK-LOWPOWER-ZEPHYR-SDK — Zephyr® Platform support for the SimpleLink™ Low Power family of devices

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

SIMPLELINK-LOWPOWER-ZEPHYR-SDK — Zephyr® Platform support for the SimpleLink™ Low Power family of devices

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

SIMPLELINK-MATTER — SimpleLink™ family of devices Matter software

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

Productos y hardware compatibles
IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

Productos y hardware compatibles
IDE, configuración, compilador o depurador

CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
Productos y hardware compatibles
IDE, configuración, compilador o depurador

EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

Edge AI Studio es una colección de herramientas gráficas y de línea de comandos diseñadas para acelerar el desarrollo de Edge AI en procesadores y microcontroladores de TI. Ya sea que use el Model Zoo de TI para desarrollar una prueba de concepto o aproveche su propio modelo, Edge AI Studio (...)

Productos y hardware compatibles
IDE, configuración, compilador o depurador

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

Productos y hardware compatibles
Enchufe

SIMPLELINK-SDK-EDGEAI-PLUGIN — Edge AI Plugin and application support for SimpleLink™ family of devices

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

Productos y hardware compatibles
Soporte de software

SMARTRF-STUDIO-8 — Software de aplicación SmartRF Studio 8 para dispositivos CC23xx y CC27xx, y transceptores CC140xP

SmartRF™ Studio es una aplicación para Windows que ayuda a los diseñadores de sistemas de RF a evaluar fácilmente la radio en una etapa temprana del proceso de diseño para todos los dispositivos de RF de baja potencia CC1xxx y CC2xxx de TI. Simplifica la generación de los valores y comandos del (...)

Productos y hardware compatibles
Soporte de software

HN-3P-BLE-TOOLKIT — Hubble Network: conectividad global Bluetooth® baja energía para los MCU inalámbricos SimpleLink™ de

El firmware de Hubble Network permite la visibilidad global de los activos en los MCU con Bluetooth baja energía (LE) SimpleLink™ de Texas Instruments, incluidas las familias de dispositivos CC2340 y CC2755, sin necesidad de un módem celular, radio satelital ni hardware personalizado. Al ejecutar (...)

Productos y hardware compatibles
Certificación

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
Productos y hardware compatibles
Herramienta de diseño

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

El proceso de revisión del diseño de hardware de SimpleLink le ofrece la posibilidad de ponerse en contacto, de forma personalizada, con un experto en la materia que puede ayudarlo a revisar su diseño y proporcionarle valiosos comentarios. Aquí encontrará un sencillo proceso de 3 pasos para (...)

Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RHA) 40 Ultra Librarian

Pedidos y calidad

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

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Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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