CC2340R5-Q1

ACTIVO

MCU inalámbrico SimpleLink™ Bluetooth® de baja energía apto para automoción y flash de 512 kB

Detalles del producto

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
VQFN (RHB) 32 25 mm² 5 x 5

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC2340R5-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. A) PDF | HTML 30 jul 2025
* Errata CC2340R5-Q1 SimpleLink Wireless MCU Device Revision B Errata (Rev. B) PDF | HTML 16 jul 2025
* User guide CC23xx SimpleLink Wireless MCU Technical Reference Manual (Rev. A) PDF | HTML 07 ago 2024
Application note CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 04 feb 2026
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18 nov 2025
Application note High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 27 feb 2024
Application note CC2340 Bluetooth LE Software Product Brief (Rev. A) PDF | HTML 06 nov 2023
Application note Hardware Migration to CC2340R5 PDF | HTML 09 may 2023
Certificate LP-EM-CC2340R5 EU RoHS Declaration of Conformity (DoC) (Rev. A) 28 abr 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 mar 2022
Application note RF PCB Simulation Cookbook 09 ene 2019
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 02 oct 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

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Guía del usuario: PDF
No disponible en TI.com
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Kit de desarrollo

LP-XDS110 — Depurador del kit de desarrollo LaunchPad™ XDS110

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Kit de desarrollo de software (SDK)

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IDE, configuración, compilador o depurador

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Capacitación en línea

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Archivo Gerber

CC2340R5-Q1 LaunchPad Design Files

SWRR187.ZIP (4185 KB)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RHB) 32 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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