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Microcontroladores (MCU) y procesadores
Microprocesadores y DSP
Sistemas automotrices SoC de asistencia al conductor

TDA2SX

ACTIVO

Procesador SoC con aceleración de gráficos, visión y video con todas las funciones para aplicaciones

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TDA2SX

ACTIVO
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Detalles del producto

CPU 2 Arm Cortex-A15 Frequency (MHz) 1176 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 2 3D Display type 1 HDMI, 3 LCD Protocols Ethernet PCIe 2 PCIe Gen 3 Hardware accelerators Embedded vision engines, Image video accelerator Features Vision Analytics Operating system Android, Linux, RTOS Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
CPU 2 Arm Cortex-A15 Frequency (MHz) 1176 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 2 3D Display type 1 HDMI, 3 LCD Protocols Ethernet PCIe 2 PCIe Gen 3 Hardware accelerators Embedded vision engines, Image video accelerator Features Vision Analytics Operating system Android, Linux, RTOS Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABC) 760 529 mm² 23 x 23
  • Architecture designed for ADAS applications
  • Video, image, and gaphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
  • Dual Arm® Cortex®-A15 microprocessor subsystem
  • Up to two C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-Bit fixed-point multiplies per cycle
  • Up to 2.5MB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • Two DDR2/DDR3/DDR3L memory interface (EMIF) modules
    • Supports up to DDR2-800 and DDR3-1066
    • Up to 2GB supported per EMIF
  • Dual Arm® Cortex®-M4 Image Orocessing Units (IPU)
  • Vision acceleration pac
    • Up to four Embedded Vision Engines (EVEs)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Dual-core PowerVR® SGX544 3D GPU
  • Three Video Input Port (VIP) modules
    • Support for up to 10 multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • 2-port gigabit ethernet (GMAC)
  • Enhanced Direct Memory Access (EDMA) controller
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • PCI-Express® 3.0 port with integrated PHY
    • One 2-lane gen2-compliant port
    • or two 1-lane gen2-compliant ports
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Five Inter-Integrated Circuit (I2C) ports
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • Three high-speed USB 2.0 dual-role devices
  • Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces (MMC®/SD®/SDIO)
  • Up to 247 General-Purpose I/O (GPIO) pins
  • Real-Time Clock SubSystem (RTCSS)
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG® lock
    • Secure keys
    • Secure ROM and boot
  • Power, Reset, and Clock Management (PRSM)
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm pitch, 760-Pin BGA (ABC)
  • Architecture designed for ADAS applications
  • Video, image, and gaphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
  • Dual Arm® Cortex®-A15 microprocessor subsystem
  • Up to two C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-Bit fixed-point multiplies per cycle
  • Up to 2.5MB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • Two DDR2/DDR3/DDR3L memory interface (EMIF) modules
    • Supports up to DDR2-800 and DDR3-1066
    • Up to 2GB supported per EMIF
  • Dual Arm® Cortex®-M4 Image Orocessing Units (IPU)
  • Vision acceleration pac
    • Up to four Embedded Vision Engines (EVEs)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Dual-core PowerVR® SGX544 3D GPU
  • Three Video Input Port (VIP) modules
    • Support for up to 10 multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • 2-port gigabit ethernet (GMAC)
  • Enhanced Direct Memory Access (EDMA) controller
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • PCI-Express® 3.0 port with integrated PHY
    • One 2-lane gen2-compliant port
    • or two 1-lane gen2-compliant ports
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Five Inter-Integrated Circuit (I2C) ports
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • Three high-speed USB 2.0 dual-role devices
  • Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces (MMC®/SD®/SDIO)
  • Up to 247 General-Purpose I/O (GPIO) pins
  • Real-Time Clock SubSystem (RTCSS)
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG® lock
    • Secure keys
    • Secure ROM and boot
  • Power, Reset, and Clock Management (PRSM)
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm pitch, 760-Pin BGA (ABC)

TI’s new TDA2x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2x SoC enables sophisticated embedded vision technology in automobiles by broadest range of ADAS applications including front camera, park assist, surround view and sensor fusion on a single architecture.

The TDA2x SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac, Arm® Cortex®-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerators for rendering virtual views, enable a 3D viewing experience. And the TDA2x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes multiple embedded vision engines (EVEs) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA2x ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2x SoC enables sophisticated embedded vision technology in automobiles by broadest range of ADAS applications including front camera, park assist, surround view and sensor fusion on a single architecture.

The TDA2x SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac, Arm® Cortex®-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerators for rendering virtual views, enable a 3D viewing experience. And the TDA2x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes multiple embedded vision engines (EVEs) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA2x ADAS processor is qualified according to the AEC-Q100 standard.
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Esta familia de productos está disponible para fabricantes de automóviles de gran volumen. Póngase en contacto con su representante de ventas de TI para obtener más información.

Obtenga más información sobre el SoC TDAx para sistemas avanzados de asistencia al conductor (ADAS).

Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0 datasheet (Rev. F) PDF | HTML 06 jun 2019
* Errata TDA2x ADAS Applications Processor (Rev. K) PDF | HTML 08 sep 2024
Application note Integrating virtual DRM between VISION SDK and PSDK on Jacinto6 SOC PDF | HTML 05 may 2021
Application note IVA-HD Sharing Between VISION-SDK and PSDKLA on Jacinto6 SoC PDF | HTML 24 ago 2020
White paper Paving the way to self-driving cars with ADAS (Rev. A) 24 jul 2020
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 24 jul 2020
User guide TDA2x ADAS Applications Processor Public Technical Reference Manual (Rev. G) 22 feb 2020
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 06 ene 2020
Technical article The need for speed – The future of radar processing PDF | HTML 17 jul 2019
Application note Integrating New Cameras With Video Input Port on DRA7xx SoCs PDF | HTML 11 jun 2019
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 10 jun 2019
Application note The Implementation of YUV422 Output for SRV 02 ago 2018
Application note MMC DLL Tuning (Rev. B) 31 jul 2018
Application note Integrating AUTOSAR on TI SoC: Fundamentals 18 jun 2018
Application note ECC/EDC on TDAxx (Rev. B) 13 jun 2018
Application note Sharing VPE Between VISIONSDK and PSDKLA 04 may 2018
Application note TMS320C66x XMC Memory Protection 31 ene 2018
Application note DSS Bit Exact Output (Rev. A) 12 ene 2018
Application note Flashing Utility - mflash 09 ene 2018
White paper Embedded low-power deep learning with TIDL 08 dic 2017
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 07 nov 2017
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 03 nov 2017
Application note DSS BT656 Workaround for TDA2x (Rev. A) 03 nov 2017
Functional safety information Safety Features on VisionSDK 26 oct 2017
Application note Optimization of GPU-Based Surround View on TI’s TDA2x SoC 12 sep 2017
White paper Step into next-gen architectures for multi-camera operations in automobiles 16 jun 2017
Technical article Vehicle vision: beyond the crystal ball? PDF | HTML 08 jun 2017
White paper Making Cars Safer Through Technology Innovation (Rev. A) 07 jun 2017
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 15 dic 2016
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 23 ago 2016
Application note ADAS Power Management 07 mar 2016
White paper Multicore SoCs stay a step ahead of SoC FPGAs 23 feb 2016
User guide Vision Application Board User's Guide 09 feb 2016
White paper Surround view camera systems for ADAS (Rev. A) 20 oct 2015
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 13 ago 2014
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 14 abr 2014
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 16 oct 2013
White paper Empowering Automotive Vision with TI’s Vision AccelerationPac 13 oct 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

ALTOS-3P-V2 — Radar de imágenes en cascada de cuatro chips de Altos basado en el procesador TDA4

Altos Radar es el desarrollador líder mundial en materia de radares de imágenes para aplicaciones automotrices. 

 

El Altos V2 es un diseño de radar de imágenes en cascada de cuatro chips basado en el circuito integrado de microondas monolíticos (MMIC) AWR2243 y el procesador TDA4 de TI. Cuenta con (...)

Desde: Altos Radar Inc.
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Kit de desarrollo

D3-3P-RVP-TDA2X — Kit del desarrollador RVP-TDA2x de DesignCore® D3 Embedded para procesadores TDA2

La RVP-TDA2x es una plataforma multicámara para sistemas ADAS de alta gama. Incluye dos procesadores de aplicaciones ARM A15, hasta cuatro coprocesadores Vision Acceleration Pac (EVE) y un codificador H.264 acelerado por hardware. El kit de desarrollo admite ocho entradas de cámara, pero se puede (...)

Desde: D3 Embedded
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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

Productos y hardware compatibles

Productos y hardware compatibles
Opciones de descarga
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

Productos y hardware compatibles

Productos y hardware compatibles
Opciones de descarga
Software de aplicación y estructura

MOMENTA-3P-DL-ALGORITHMS — Algoritmos de aprendizaje profundo de Momenta para aplicaciones de cámara frontal ADAS en procesador

Momenta’s deep learning based algorithms for ADAS applications make full use of the DSP cores and accelerators on TDA4x for neural network processing. Designed to achieve market leading computational and power efficiency, Momenta’s algorithms offer an array of pre- and post-imaging (...)
Desde: Momenta
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Ejemplo de código o demostración

D3-3P-DEV — Soporte D3 Embedded para cámaras IA, hardware, controladores y firmware

D3 Embedded es una empresa radicada en Estados Unidos que se especializa en soluciones de extremo a extremo que integran detección de visión y radar mmWave, conectividad, procesamiento integrado e inteligencia artificial para aplicaciones de alto rendimiento. Con más de 25 años de experiencia de (...)
Desde: D3 Embedded
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar Opciones de descarga
IDE, configuración, compilador o depurador

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

Productos y hardware compatibles

Productos y hardware compatibles
Iniciar Opciones de descarga
Sistema operativo (SO)

GHS-3P-INTEGRITY-RTOS — INTEGRITY RTOS de Green Hills

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
Desde: Green Hills Software
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Sistema operativo (SO)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
Desde: QNX Software Systems
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Modelo de simulación

TDA2x BSDL Model

SPRM670.ZIP (28 KB) - BSDL Model
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Modelo de simulación

TDA2x IBIS Model

SPRM671.ZIP (36408 KB) - IBIS Model
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Modelo de simulación

TDA2x Thermal Model

SPRM672.ZIP (3 KB) - Thermal Model
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Herramienta de cálculo

CLOCKTREETOOL — Herramienta de árbol de reloj para Sitara, automoción, análisis de visión y procesadores de señal di

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
Guía del usuario: PDF
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCBGA (ABC) 760 Ultra Librarian
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Pedidos y calidad

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  • RoHS
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  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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