SPRADO8
March
2025
AM62L
-
1
-
Abstract
-
Trademarks
-
1 Introduction
- 1.1
User's Guide Usage Guidelines
- 1.1.1
Custom Board Design - Implementation
References
- 1.1.2
Processor Family Specific User's Guide
- 1.1.3
Schematic Design Guidelines
- 1.1.4
Schematic Review Checklist
- 1.1.5
FAQ Reference for User's Guide Usage
Guidelines
- 1.2
List of Processors
- 1.2.1
AM62Lx Processor Family
-
2 Related Collaterals
- 2.1
Links to Commonly Available and Applicable Collaterals
- 2.2
Hardware Design Considerations for Custom Board Design
-
3 Processor Selection
- 3.1
AM62Lx Processor Family Change Summary (With Respect to AM62x Processor Family)
- 3.2
Data Sheet Use Case and Version Referenced
- 3.3
Processor Selection (OPN Orderable Part
Number)
- 3.4
Peripheral Instance Naming Convention
- 3.5
Unused Peripherals
- 3.6
Processor Ordering and Quality
- 3.7
Processor Selection Checklist
-
4 Power Architecture
- 4.1
Generating Supply Rails
- 4.1.1
AM62Lx
- 4.1.1.1
Power Management IC (PMIC)
- 4.1.1.1.1
PMIC Based Power Architecture Checklist for
TPS65214x
- 4.1.1.1.2
Additional References
- 4.1.1.2
Discrete Power
- 4.1.1.2.1
DC/DC Converter
- 4.1.1.2.2
LDO
- 4.1.1.2.3
Discrete Power Checklist
- 4.2
Power Control and Circuit
Protection
- 4.2.1
Load Switch (Power Switching)
- 4.2.1.1
Load Switch Checklist
- 4.2.2
eFuse IC (Power Switching and
Protection)
-
5 General Recommendations
- 5.1
Processor Performance Evaluation Module (EVM)
- 5.1.1
Evaluation Module Checklist
- 5.2
Processor-Specific EVM Versus Data
Sheet
- 5.2.1
Notes About Component Selection
- 5.2.1.1
Series Resistor
- 5.2.1.2
Parallel Pull Resistor
- 5.2.1.3
Drive Strength Configuration
- 5.2.1.4
Data Sheet Recommendations
- 5.2.1.5
Processor IOs - External ESD
Protection
- 5.2.1.6
Peripheral Clock Output Series
Resistor
- 5.2.1.7
Component Selection Checklist
- 5.2.2
Additional Information Regarding Reuse of EVM
Design
- 5.2.2.1
Updated EVM Schematic With Design, Review and CAD Notes Added
- 5.2.2.2
EVM Design Files Reuse
- 5.2.2.2.1
Modular Schematic Sections
- 5.2.2.2.2
Reuse of EVM Design Checklist
- 5.3
Before Beginning the Design
- 5.3.1
Documentation
- 5.3.2
Processor Pin Attributes (Pinout) Verification
- 5.3.3
Device Comparison, IOSET and Voltage Conflict
- 5.3.4
RSVD Reserved Pin (Signal)
- 5.3.5
Note on PADCONFIG Registers
- 5.3.6
Processor IO (Signal) Isolation for
Fail-Safe Operation
- 5.3.7
Reference to Processor-Specific EVM
- 5.3.8
High-Speed Interface Design Guidelines
- 5.3.9
Recommended Current Source or Sink for LVCMOS (GPIO) Outputs
- 5.3.10
Connection of Slow Ramp Inputs or Capacitors to LVCMOS IOs (Inputs or Outputs)
- 5.3.11
Queries and Clarifications Related to Processor During Custom Board Design
- 5.3.12
Before Beginning the Design Checklist
- 5.3.13
Device Recommendations
-
6 Processor-Specific Recommendations
- 6.1
Common (Processor Start-Up)
Connection
- 6.1.1
Power Supply
- 6.1.1.1
Supply for Core and Peripherals
- 6.1.1.1.1
Power Supply Ramp (Slew Rate) Requirement and
Dynamic Voltage Scaling / Change
- 6.1.1.1.2
AM62Lx
- 6.1.1.1.3
Additional Information
- 6.1.1.1.4
Processor Core and Peripheral Core Power
Supply Checklist
- 6.1.1.1.5
Peripheral Analog Power Supply
Checklist
- 6.1.1.2
IO Supply for IO Groups
- 6.1.1.2.1
Dual-voltage 1.8V/3.3V IO Supply for IO
Groups
- 6.1.1.2.1.1
Dual-voltage IO Supply for IO Groups Checklist
- 6.1.1.2.2
Fixed-voltage 1.8V IO Supply for (Peripheral)
IO Groups
- 6.1.1.2.2.1
Fixed-voltage 1.8V IO Supply for (Peripheral)
IO Groups Checklist
- 6.1.1.2.3
Additional Information
- 6.1.1.3
Supply for VPP (eFuse ROM Programming)
- 6.1.1.3.1
VPP Checklist
- 6.1.1.4
Supply Connection for Configuring Low-Power
Modes
- 6.1.1.4.1
RTC Only Low-power Mode
- 6.1.1.4.1.1
RTC Only Mode Used
- 6.1.1.4.1.1.1
RTC_PORz Delay When RTC Only Mode is
Used
- 6.1.1.4.1.1.2
EVM Implementation of RTC Only Mode Power
Supply Architecture
- 6.1.1.4.1.2
RTC Only Mode Not Used
- 6.1.1.4.1.2.1
32kHz LFOSC0 Clock When RTC Mode is not
Used
- 6.1.1.4.1.3
RTC Only Low-power Mode Checklist
- 6.1.1.4.2
RTC + IO + DDR Self-refresh Low-power Mode
- 6.1.1.4.2.1
RTC + IO + DDR Self-refresh Mode Used
- 6.1.1.4.2.2
RTC + IO + DDR Self-refresh Mode Not
Used
- 6.1.1.4.2.3
RTC + IO + DDR Self-refresh Low-power Mode
Checklist
- 6.1.1.4.3
DeepSleep, Standby
- 6.1.1.5
Additional Information
- 6.1.2
Capacitors for Supply Rails
- 6.1.2.1
AM62Lx
- 6.1.2.2
Additional Information
- 6.1.2.2.1
AM62Lx
- 6.1.2.3
Capacitors for Supply Rails Checklist
- 6.1.3
Processor Clock
- 6.1.3.1
Clock Inputs
- 6.1.3.1.1
High Frequency Oscillator (WKUP_OSC0_XI / WKUP_OSC0_XO)
- 6.1.3.1.2
Low Frequency Oscillator (LFOSC0_XI,
LFOSC0_XO)
- 6.1.3.1.3
EXT_REFCLK1 (External Clock Input to Main Domain)
- 6.1.3.1.4
Additional Information
- 6.1.3.1.5
Clock Input Checklist - WKUP_OSC0
- 6.1.3.1.6
Clock Input Checklist - LFOSC0
- 6.1.3.2
Clock Outputs
- 6.1.3.2.1
Clock Output Checklist
- 6.1.4
Processor Reset
- 6.1.4.1
External Reset Inputs
- 6.1.4.2
Reset Status Outputs
- 6.1.4.3
Additional Information
- 6.1.4.4
Processor Reset Input Checklist
- 6.1.4.5
Processor Reset Status Output
Checklist
- 6.1.5
Configuration of Boot Modes for
Processor
- 6.1.5.1
Processor Boot Mode Inputs Isolation Buffers Use Case and Optimization
- 6.1.5.2
Boot Mode Selection
- 6.1.5.2.1
Notes for USB Boot Mode
- 6.1.5.3
Boot Mode Implementation Approaches
- 6.1.5.4
Additional Information
- 6.1.5.5
Configuration of Boot Modes (for Processor) Checklist
- 6.2
Board Debug Using JTAG and EMU
- 6.2.1
JTAG and EMU Used
- 6.2.2
JTAG and EMU Not Used
- 6.2.3
Additional Information
- 6.2.4
Board Debug Using JTAG and EMU Checklist
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7 Processor Peripherals
- 7.1
Supply Connections for IO Supply for IO Groups
- 7.1.1
Dual-voltage IO Supplies and Fixed-voltage Supplies for IO Groups
- 7.1.2
Fixed 1.8V
- 7.1.3
Supply Connections for IO Supply for IO Groups Checklist
- 7.2
Memory Interface (DDRSS (DDR4/LPDDR4), MMCSD
(eMMC/SD/SDIO), OSPI/QSPI and GPMC)
- 7.2.1
DDR Subsystem (DDRSS)
- 7.2.1.1
DDR4 SDRAM (Double Data Rate 4 Synchronous
Dynamic Random-Access Memory)
- 7.2.1.1.1
AM62Lx
- 7.2.1.1.1.1
Memory Interface Configuration
- 7.2.1.1.1.2
Routing Topology and Terminations
- 7.2.1.1.1.3
Resistors for Control and
Calibration
- 7.2.1.1.1.4
Capacitors for the Power Supply
Rails
- 7.2.1.1.1.5
Data Bit or Byte Swapping
- 7.2.1.1.1.6
VTT Termination Schematics Reference
- 7.2.1.1.1.7
DDR4 Implementation Checklist
- 7.2.1.2
LPDDR4 SDRAM (Low-Power Double Data Rate 4
Synchronous Dynamic Random-Access Memory)
- 7.2.1.2.1
AM62Lx
- 7.2.1.2.1.1
Memory Interface Configuration
- 7.2.1.2.1.2
Routing Topology and Terminations
- 7.2.1.2.1.3
Resistors for Control and
Calibration
- 7.2.1.2.1.4
Capacitors for the Power Supply
Rails
- 7.2.1.2.1.5
Data Bit or Byte Swapping
- 7.2.1.2.1.6
LPDDR4 Implementation Checklist
- 7.2.2
Multi-Media Card/Secure Digital (MMCSD)
- 7.2.2.1
MMC0 - eMMC (Embedded Multi-Media Card) Interface
- 7.2.2.1.1
AM62Lx
- 7.2.2.1.1.1
IO Power Supply
- 7.2.2.1.1.2
eMMC (Attached Device) Reset
- 7.2.2.1.1.3
Signals Connection
- 7.2.2.1.1.4
Capacitors for the Power Supply
Rails
- 7.2.2.1.1.5
MMC0 (eMMC) Checklist
- 7.2.2.1.2
Additional Information on eMMC PHY
- 7.2.2.1.3
MMC0 – SD (Secure Digital) Card Interface
- 7.2.2.2
MMC1/MMC2 – SD (Secure Digital) Card Interface
- 7.2.2.2.1
IO Power Supply
- 7.2.2.2.2
SD Card Supply Reset and Boot Configuration
- 7.2.2.2.3
Signals Connection
- 7.2.2.2.4
ESD Protection
- 7.2.2.2.5
Capacitors for the Power Supply Rails
- 7.2.2.2.6
MMC1 SD Card Interface Checklist
- 7.2.2.3
MMC1 / MMC2 SDIO (Embedded) Interface
- 7.2.2.3.1
IO Power Supply
- 7.2.2.3.2
Signals Connection
- 7.2.2.3.3
MMC2 SDIO (Embedded) Interface Checklist
- 7.2.2.4
Additional Information
- 7.2.3
Octal Serial Peripheral Interface (OSPI) or Quad Serial Peripheral Interface (QSPI)
- 7.2.3.1
OSPI0 Interfaced to Single Device
- 7.2.3.1.1
IO Power Supply
- 7.2.3.1.2
OSPI or QSPI Device Reset
- 7.2.3.1.3
Signals Connection
- 7.2.3.1.4
Loopback Clock
- 7.2.3.2
Interfaced to x2 Devices
- 7.2.3.3
Capacitors for the Power Supply
Rails
- 7.2.3.4
OSPI or QSPI Interface Implementation Checklist
- 7.2.4
General-Purpose Memory Controller
(GPMC)
- 7.2.4.1
IO Power Supply
- 7.2.4.2
GPMC Interface
- 7.2.4.3
Memory (Attached Device) Reset
- 7.2.4.4
Signals Connection
- 7.2.4.4.1
GPMC NAND
- 7.2.4.5
Capacitors for the Power Supply
Rails
- 7.2.4.6
GPMC Interface Checklist
- 7.3
External Communication Interface (Ethernet (CPSW3G0), USB2.0, UART and MCAN)
- 7.3.1
Ethernet Interface Using CPSW3G0 (Common Platform Ethernet Switch 3-Port Gigabit)
- 7.3.1.1
IO Power Supply
- 7.3.1.2
Ethernet PHY Reset
- 7.3.1.3
Ethernet PHY Pin Strapping
- 7.3.1.4
Ethernet PHY (and MAC) Operation and Media
Independent Interface (MII) Clock
- 7.3.1.4.1
Crystal
- 7.3.1.4.2
Oscillator
- 7.3.1.4.3
Processor Clock Output (CLKOUT0)
- 7.3.1.5
MAC (Data, Control and Clock) Interface
Signals Connection
- 7.3.1.6
External Interrupt (EXTINTn)
- 7.3.1.6.1
External Interrupt (EXTINTn) Checklist
- 7.3.1.7
MAC (Media Access Controller) to MAC
Interface
- 7.3.1.8
MDIO (Management Data Input/Output) Interface
- 7.3.1.9
Ethernet MDI (Medium Dependent Interface)
Including Magnetics
- 7.3.1.10
Capacitors for the Power Supply
Rails
- 7.3.1.11
Ethernet Interface Checklist
- 7.3.2
Universal Serial Bus (USB2.0)
- 7.3.2.1
USBn (n = 0-1) Used
- 7.3.2.1.1
USB Host Interface
- 7.3.2.1.2
USB Device Interface
- 7.3.2.1.3
USB Dual-Role-Device Interface
- 7.3.2.1.4
USB Type-C®
- 7.3.2.2
USBn (n = 0-1) Not Used
- 7.3.2.3
Additional Information
- 7.3.2.4
USB Interface Checklist
- 7.3.3
Universal Asynchronous Receiver/Transmitter (UART)
- 7.3.3.1
Universal Asynchronous Receiver/Transmitter (UART) Checklist
- 7.3.4
Modular Controller Area Network (MCAN)
- 7.3.4.1
Modular Controller Area Network Checklist
- 7.4
On-board Synchronous Communication Interface
(MCSPI, MCASP and I2C)
- 7.4.1
Multichannel Serial Peripheral Interface (MCSPI) and Multichannel Audio Serial Ports (MCASP)
- 7.4.1.1
MCSPI Checklist
- 7.4.1.2
MCASP Checklist
- 7.4.2
Inter-Integrated Circuit (I2C)
- 7.4.2.1
I2C (Open-drain Output Type Buffer) Interface
Checklist
- 7.4.2.2
I2C (Emulated Open-drain Output Type Buffer)
Interface Checklist
- 7.5
User Interface (DPI, DSI), GPIO and Hardware
Diagnostics
- 7.5.1
Display Subsystem
- 7.5.1.1
Display Parallel Interface (DPI)
- 7.5.1.1.1
AM62Lx
- 7.5.1.1.1.1
IO Power Supply
- 7.5.1.1.1.2
DPI (Attached Device) Reset
- 7.5.1.1.1.3
Connection
- 7.5.1.1.1.4
Signals Connection
- 7.5.1.1.1.5
Capacitors for the Power Supply
Rails
- 7.5.1.1.1.6
DPI (VOUT0) Checklist
- 7.5.1.2
Display Serial Interface (DSI)
- 7.5.1.2.1
AM62Lx
- 7.5.1.2.1.1
DSITX0 Used
- 7.5.1.2.1.1.1
DSITX0 Checklist
- 7.5.1.2.1.2
DSITX0 Not Used
- 7.5.2
General Purpose Input and Output
(GPIO)
- 7.5.2.1
Availability of CLKOUT on Processor
GPIO
- 7.5.2.2
Connection and External Buffering
- 7.5.2.3
Additional Information
- 7.5.2.4
GPIO Checklist
- 7.5.3
On-board Hardware Diagnostics
- 7.5.3.1
Internal Temperature Monitoring
- 7.6
Analog to Digital Converter (ADC)
- 7.6.1
ADC0 Used
- 7.6.2
ADC0 Not Used
- 7.6.3
ADC0 Checklist
- 7.7
Verifying Board Level Design
Issues
- 7.7.1
Processor Pin Configuration Using PinMux Tool
- 7.7.2
Schematics Configurations
- 7.7.3
Connecting Supply Rails to Pullups
- 7.7.4
Peripheral (Subsystem) Clock Outputs
- 7.7.5
General Board Bring-up and Debug
- 7.7.5.1
Clock Output for Board Bring-Up, Test, or
Debug
- 7.7.5.2
Additional Information
- 7.7.5.3
General Board Bring-up and Debug Checklist
-
8 Self-Review of the Custom Board Schematics Design
-
9 Layout Notes (Added on the Schematic)
- 9.1
Layout Checklist
-
10Custom Board Design Simulation
-
11Additional References
- 11.1
FAQ Covering AM6xx Processor Family
- 11.2
FAQs - Processor Product Family Wise and Sitara Processor Families
- 11.3
Processor Attached Devices
-
12Summary
-
13Terminology
13 Terminology
ADCAnalog-to-Digital Converter
CANController Area Network
CPPICommunications Port Programming Interface
CPSW3GCommon Platform Ethernet Switch 3-port Gigabit
DFUDevice Firmware Upgrade
DPIDisplay Parallel Interface
EMCElectromagnetic Compatibility
EMIElectromagnetic Interference
eMMCembedded Multi-Media Card
EOSElectrical Over-Stress
ESDElectrostatic discharge
ESLEffective Series Inductance
ESREffective Series Resistance
FAQFrequently Asked Question
FETField-Effect Transistor
GPIOGeneral Purpose Input/Output
GPMCGeneral-Purpose Memory Controller
HS-RTDXHigh Speed Real Time Data eXchange
I2CInter-Integrated Circuit
IBISInput/Output Buffer Information Specification
IEPIndustrial Ethernet Peripheral
JTAGJoint Test Action Group
LVCMOSLow Voltage Complementary Metal Oxide Semiconductor
MACMedia Access Controller
MCASPMultichannel Audio Serial Ports
MCSPIMultichannel Serial Peripheral Interface
MDIMedium Dependent Interface
MDIOManagement Data Input/Output
MMCSDMulti-Media Card/Secure Digital
OSPIOctal Serial Peripheral Interface
PDNPower Distribution Network
PMICPower Management Integrated Circuit
QSPIQuad Serial Peripheral Interface
RGMIIReduced Gigabit Media Independent Interface
RMIIReduced Media Independent Interface
ROCProcessor-Specific Data Sheet Recommended Operating Condition
SDIOSecure Digital Input Output
SPISerial Peripheral Interface
TMSTest Mode Select Input
TRMTechnical Reference Manual
UARTUniversal Asynchronous Receiver/Transmitter
XDSeXtended Development System
ZQDevices Calibration reference