SPRADO8 March   2025 AM62L

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 User's Guide Usage Guidelines
      1. 1.1.1 Custom Board Design - Implementation References
      2. 1.1.2 Processor Family Specific User's Guide
      3. 1.1.3 Schematic Design Guidelines
      4. 1.1.4 Schematic Review Checklist
      5. 1.1.5 FAQ Reference for User's Guide Usage Guidelines
    2. 1.2 List of Processors
      1. 1.2.1 AM62Lx Processor Family
  5. 2 Related Collaterals
    1. 2.1 Links to Commonly Available and Applicable Collaterals
    2. 2.2 Hardware Design Considerations for Custom Board Design
  6. 3 Processor Selection
    1. 3.1 AM62Lx Processor Family Change Summary (With Respect to AM62x Processor Family)
    2. 3.2 Data Sheet Use Case and Version Referenced
    3. 3.3 Processor Selection (OPN Orderable Part Number)
    4. 3.4 Peripheral Instance Naming Convention
    5. 3.5 Unused Peripherals
    6. 3.6 Processor Ordering and Quality
    7. 3.7 Processor Selection Checklist
  7. 4 Power Architecture
    1. 4.1 Generating Supply Rails
      1. 4.1.1 AM62Lx
        1. 4.1.1.1 Power Management IC (PMIC)
          1. 4.1.1.1.1 PMIC Based Power Architecture Checklist for TPS65214x
          2. 4.1.1.1.2 Additional References
        2. 4.1.1.2 Discrete Power
          1. 4.1.1.2.1 DC/DC Converter
          2. 4.1.1.2.2 LDO
          3. 4.1.1.2.3 Discrete Power Checklist
    2. 4.2 Power Control and Circuit Protection
      1. 4.2.1 Load Switch (Power Switching)
        1. 4.2.1.1 Load Switch Checklist
      2. 4.2.2 eFuse IC (Power Switching and Protection)
  8. 5 General Recommendations
    1. 5.1 Processor Performance Evaluation Module (EVM)
      1. 5.1.1 Evaluation Module Checklist
    2. 5.2 Processor-Specific EVM Versus Data Sheet
      1. 5.2.1 Notes About Component Selection
        1. 5.2.1.1 Series Resistor
        2. 5.2.1.2 Parallel Pull Resistor
        3. 5.2.1.3 Drive Strength Configuration
        4. 5.2.1.4 Data Sheet Recommendations
        5. 5.2.1.5 Processor IOs - External ESD Protection
        6. 5.2.1.6 Peripheral Clock Output Series Resistor
        7. 5.2.1.7 Component Selection Checklist
      2. 5.2.2 Additional Information Regarding Reuse of EVM Design
        1. 5.2.2.1 Updated EVM Schematic With Design, Review and CAD Notes Added
        2. 5.2.2.2 EVM Design Files Reuse
          1. 5.2.2.2.1 Modular Schematic Sections
          2. 5.2.2.2.2 Reuse of EVM Design Checklist
    3. 5.3 Before Beginning the Design
      1. 5.3.1  Documentation
      2. 5.3.2  Processor Pin Attributes (Pinout) Verification
      3. 5.3.3  Device Comparison, IOSET and Voltage Conflict
      4. 5.3.4  RSVD Reserved Pin (Signal)
      5. 5.3.5  Note on PADCONFIG Registers
      6. 5.3.6  Processor IO (Signal) Isolation for Fail-Safe Operation
      7. 5.3.7  Reference to Processor-Specific EVM
      8. 5.3.8  High-Speed Interface Design Guidelines
      9. 5.3.9  Recommended Current Source or Sink for LVCMOS (GPIO) Outputs
      10. 5.3.10 Connection of Slow Ramp Inputs or Capacitors to LVCMOS IOs (Inputs or Outputs)
      11. 5.3.11 Queries and Clarifications Related to Processor During Custom Board Design
      12. 5.3.12 Before Beginning the Design Checklist
      13. 5.3.13 Device Recommendations
  9. 6 Processor-Specific Recommendations
    1. 6.1 Common (Processor Start-Up) Connection
      1. 6.1.1 Power Supply
        1. 6.1.1.1 Supply for Core and Peripherals
          1. 6.1.1.1.1 Power Supply Ramp (Slew Rate) Requirement and Dynamic Voltage Scaling / Change
          2. 6.1.1.1.2 AM62Lx
          3. 6.1.1.1.3 Additional Information
          4. 6.1.1.1.4 Processor Core and Peripheral Core Power Supply Checklist
          5. 6.1.1.1.5 Peripheral Analog Power Supply Checklist
        2. 6.1.1.2 IO Supply for IO Groups
          1. 6.1.1.2.1 Dual-voltage 1.8V/3.3V IO Supply for IO Groups
            1. 6.1.1.2.1.1 Dual-voltage IO Supply for IO Groups Checklist
          2. 6.1.1.2.2 Fixed-voltage 1.8V IO Supply for (Peripheral) IO Groups
            1. 6.1.1.2.2.1 Fixed-voltage 1.8V IO Supply for (Peripheral) IO Groups Checklist
          3. 6.1.1.2.3 Additional Information
        3. 6.1.1.3 Supply for VPP (eFuse ROM Programming)
          1. 6.1.1.3.1 VPP Checklist
        4. 6.1.1.4 Supply Connection for Configuring Low-Power Modes
          1. 6.1.1.4.1 RTC Only Low-power Mode
            1. 6.1.1.4.1.1 RTC Only Mode Used
              1. 6.1.1.4.1.1.1 RTC_PORz Delay When RTC Only Mode is Used
              2. 6.1.1.4.1.1.2 EVM Implementation of RTC Only Mode Power Supply Architecture
            2. 6.1.1.4.1.2 RTC Only Mode Not Used
              1. 6.1.1.4.1.2.1 32kHz LFOSC0 Clock When RTC Mode is not Used
            3. 6.1.1.4.1.3 RTC Only Low-power Mode Checklist
          2. 6.1.1.4.2 RTC + IO + DDR Self-refresh Low-power Mode
            1. 6.1.1.4.2.1 RTC + IO + DDR Self-refresh Mode Used
            2. 6.1.1.4.2.2 RTC + IO + DDR Self-refresh Mode Not Used
            3. 6.1.1.4.2.3 RTC + IO + DDR Self-refresh Low-power Mode Checklist
          3. 6.1.1.4.3 DeepSleep, Standby
        5. 6.1.1.5 Additional Information
      2. 6.1.2 Capacitors for Supply Rails
        1. 6.1.2.1 AM62Lx
        2. 6.1.2.2 Additional Information
          1. 6.1.2.2.1 AM62Lx
        3. 6.1.2.3 Capacitors for Supply Rails Checklist
      3. 6.1.3 Processor Clock
        1. 6.1.3.1 Clock Inputs
          1. 6.1.3.1.1 High Frequency Oscillator (WKUP_OSC0_XI / WKUP_OSC0_XO)
          2. 6.1.3.1.2 Low Frequency Oscillator (LFOSC0_XI, LFOSC0_XO)
          3. 6.1.3.1.3 EXT_REFCLK1 (External Clock Input to Main Domain)
          4. 6.1.3.1.4 Additional Information
          5. 6.1.3.1.5 Clock Input Checklist - WKUP_OSC0
          6. 6.1.3.1.6 Clock Input Checklist - LFOSC0
        2. 6.1.3.2 Clock Outputs
          1. 6.1.3.2.1 Clock Output Checklist
      4. 6.1.4 Processor Reset
        1. 6.1.4.1 External Reset Inputs
        2. 6.1.4.2 Reset Status Outputs
        3. 6.1.4.3 Additional Information
        4. 6.1.4.4 Processor Reset Input Checklist
        5. 6.1.4.5 Processor Reset Status Output Checklist
      5. 6.1.5 Configuration of Boot Modes for Processor
        1. 6.1.5.1 Processor Boot Mode Inputs Isolation Buffers Use Case and Optimization
        2. 6.1.5.2 Boot Mode Selection
          1. 6.1.5.2.1 Notes for USB Boot Mode
        3. 6.1.5.3 Boot Mode Implementation Approaches
        4. 6.1.5.4 Additional Information
        5. 6.1.5.5 Configuration of Boot Modes (for Processor) Checklist
    2. 6.2 Board Debug Using JTAG and EMU
      1. 6.2.1 JTAG and EMU Used
      2. 6.2.2 JTAG and EMU Not Used
      3. 6.2.3 Additional Information
      4. 6.2.4 Board Debug Using JTAG and EMU Checklist
  10. 7 Processor Peripherals
    1. 7.1 Supply Connections for IO Supply for IO Groups
      1. 7.1.1 Dual-voltage IO Supplies and Fixed-voltage Supplies for IO Groups
      2. 7.1.2 Fixed 1.8V
      3. 7.1.3 Supply Connections for IO Supply for IO Groups Checklist
    2. 7.2 Memory Interface (DDRSS (DDR4/LPDDR4), MMCSD (eMMC/SD/SDIO), OSPI/QSPI and GPMC)
      1. 7.2.1 DDR Subsystem (DDRSS)
        1. 7.2.1.1 DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory)
          1. 7.2.1.1.1 AM62Lx
            1. 7.2.1.1.1.1 Memory Interface Configuration
            2. 7.2.1.1.1.2 Routing Topology and Terminations
            3. 7.2.1.1.1.3 Resistors for Control and Calibration
            4. 7.2.1.1.1.4 Capacitors for the Power Supply Rails
            5. 7.2.1.1.1.5 Data Bit or Byte Swapping
            6. 7.2.1.1.1.6 VTT Termination Schematics Reference
            7. 7.2.1.1.1.7 DDR4 Implementation Checklist
        2. 7.2.1.2 LPDDR4 SDRAM (Low-Power Double Data Rate 4 Synchronous Dynamic Random-Access Memory)
          1. 7.2.1.2.1 AM62Lx
            1. 7.2.1.2.1.1 Memory Interface Configuration
            2. 7.2.1.2.1.2 Routing Topology and Terminations
            3. 7.2.1.2.1.3 Resistors for Control and Calibration
            4. 7.2.1.2.1.4 Capacitors for the Power Supply Rails
            5. 7.2.1.2.1.5 Data Bit or Byte Swapping
            6. 7.2.1.2.1.6 LPDDR4 Implementation Checklist
      2. 7.2.2 Multi-Media Card/Secure Digital (MMCSD)
        1. 7.2.2.1 MMC0 - eMMC (Embedded Multi-Media Card) Interface
          1. 7.2.2.1.1 AM62Lx
            1. 7.2.2.1.1.1 IO Power Supply
            2. 7.2.2.1.1.2 eMMC (Attached Device) Reset
            3. 7.2.2.1.1.3 Signals Connection
            4. 7.2.2.1.1.4 Capacitors for the Power Supply Rails
            5. 7.2.2.1.1.5 MMC0 (eMMC) Checklist
          2. 7.2.2.1.2 Additional Information on eMMC PHY
          3. 7.2.2.1.3 MMC0 – SD (Secure Digital) Card Interface
        2. 7.2.2.2 MMC1/MMC2 – SD (Secure Digital) Card Interface
          1. 7.2.2.2.1 IO Power Supply
          2. 7.2.2.2.2 SD Card Supply Reset and Boot Configuration
          3. 7.2.2.2.3 Signals Connection
          4. 7.2.2.2.4 ESD Protection
          5. 7.2.2.2.5 Capacitors for the Power Supply Rails
          6. 7.2.2.2.6 MMC1 SD Card Interface Checklist
        3. 7.2.2.3 MMC1 / MMC2 SDIO (Embedded) Interface
          1. 7.2.2.3.1 IO Power Supply
          2. 7.2.2.3.2 Signals Connection
          3. 7.2.2.3.3 MMC2 SDIO (Embedded) Interface Checklist
        4. 7.2.2.4 Additional Information
      3. 7.2.3 Octal Serial Peripheral Interface (OSPI) or Quad Serial Peripheral Interface (QSPI)
        1. 7.2.3.1 OSPI0 Interfaced to Single Device
          1. 7.2.3.1.1 IO Power Supply
          2. 7.2.3.1.2 OSPI or QSPI Device Reset
          3. 7.2.3.1.3 Signals Connection
          4. 7.2.3.1.4 Loopback Clock
        2. 7.2.3.2 Interfaced to x2 Devices
        3. 7.2.3.3 Capacitors for the Power Supply Rails
        4. 7.2.3.4 OSPI or QSPI Interface Implementation Checklist
      4. 7.2.4 General-Purpose Memory Controller (GPMC)
        1. 7.2.4.1 IO Power Supply
        2. 7.2.4.2 GPMC Interface
        3. 7.2.4.3 Memory (Attached Device) Reset
        4. 7.2.4.4 Signals Connection
          1. 7.2.4.4.1 GPMC NAND
        5. 7.2.4.5 Capacitors for the Power Supply Rails
        6. 7.2.4.6 GPMC Interface Checklist
    3. 7.3 External Communication Interface (Ethernet (CPSW3G0), USB2.0, UART and MCAN)
      1. 7.3.1 Ethernet Interface Using CPSW3G0 (Common Platform Ethernet Switch 3-Port Gigabit)
        1. 7.3.1.1  IO Power Supply
        2. 7.3.1.2  Ethernet PHY Reset
        3. 7.3.1.3  Ethernet PHY Pin Strapping
        4. 7.3.1.4  Ethernet PHY (and MAC) Operation and Media Independent Interface (MII) Clock
          1. 7.3.1.4.1 Crystal
          2. 7.3.1.4.2 Oscillator
          3. 7.3.1.4.3 Processor Clock Output (CLKOUT0)
        5. 7.3.1.5  MAC (Data, Control and Clock) Interface Signals Connection
        6. 7.3.1.6  External Interrupt (EXTINTn)
          1. 7.3.1.6.1 External Interrupt (EXTINTn) Checklist
        7. 7.3.1.7  MAC (Media Access Controller) to MAC Interface
        8. 7.3.1.8  MDIO (Management Data Input/Output) Interface
        9. 7.3.1.9  Ethernet MDI (Medium Dependent Interface) Including Magnetics
        10. 7.3.1.10 Capacitors for the Power Supply Rails
        11. 7.3.1.11 Ethernet Interface Checklist
      2. 7.3.2 Universal Serial Bus (USB2.0)
        1. 7.3.2.1 USBn (n = 0-1) Used
          1. 7.3.2.1.1 USB Host Interface
          2. 7.3.2.1.2 USB Device Interface
          3. 7.3.2.1.3 USB Dual-Role-Device Interface
          4. 7.3.2.1.4 USB Type-C®
        2. 7.3.2.2 USBn (n = 0-1) Not Used
        3. 7.3.2.3 Additional Information
        4. 7.3.2.4 USB Interface Checklist
      3. 7.3.3 Universal Asynchronous Receiver/Transmitter (UART)
        1. 7.3.3.1 Universal Asynchronous Receiver/Transmitter (UART) Checklist
      4. 7.3.4 Modular Controller Area Network (MCAN)
        1. 7.3.4.1 Modular Controller Area Network Checklist
    4. 7.4 On-board Synchronous Communication Interface (MCSPI, MCASP and I2C)
      1. 7.4.1 Multichannel Serial Peripheral Interface (MCSPI) and Multichannel Audio Serial Ports (MCASP)
        1. 7.4.1.1 MCSPI Checklist
        2. 7.4.1.2 MCASP Checklist
      2. 7.4.2 Inter-Integrated Circuit (I2C)
        1. 7.4.2.1 I2C (Open-drain Output Type Buffer) Interface Checklist
        2. 7.4.2.2 I2C (Emulated Open-drain Output Type Buffer) Interface Checklist
    5. 7.5 User Interface (DPI, DSI), GPIO and Hardware Diagnostics
      1. 7.5.1 Display Subsystem
        1. 7.5.1.1 Display Parallel Interface (DPI)
          1. 7.5.1.1.1 AM62Lx
            1. 7.5.1.1.1.1 IO Power Supply
            2. 7.5.1.1.1.2 DPI (Attached Device) Reset
            3. 7.5.1.1.1.3 Connection
            4. 7.5.1.1.1.4 Signals Connection
            5. 7.5.1.1.1.5 Capacitors for the Power Supply Rails
            6. 7.5.1.1.1.6 DPI (VOUT0) Checklist
        2. 7.5.1.2 Display Serial Interface (DSI)
          1. 7.5.1.2.1 AM62Lx
            1. 7.5.1.2.1.1 DSITX0 Used
              1. 7.5.1.2.1.1.1 DSITX0 Checklist
            2. 7.5.1.2.1.2 DSITX0 Not Used
      2. 7.5.2 General Purpose Input and Output (GPIO)
        1. 7.5.2.1 Availability of CLKOUT on Processor GPIO
        2. 7.5.2.2 Connection and External Buffering
        3. 7.5.2.3 Additional Information
        4. 7.5.2.4 GPIO Checklist
      3. 7.5.3 On-board Hardware Diagnostics
        1. 7.5.3.1 Internal Temperature Monitoring
    6. 7.6 Analog to Digital Converter (ADC)
      1. 7.6.1 ADC0 Used
      2. 7.6.2 ADC0 Not Used
      3. 7.6.3 ADC0 Checklist
    7. 7.7 Verifying Board Level Design Issues
      1. 7.7.1 Processor Pin Configuration Using PinMux Tool
      2. 7.7.2 Schematics Configurations
      3. 7.7.3 Connecting Supply Rails to Pullups
      4. 7.7.4 Peripheral (Subsystem) Clock Outputs
      5. 7.7.5 General Board Bring-up and Debug
        1. 7.7.5.1 Clock Output for Board Bring-Up, Test, or Debug
        2. 7.7.5.2 Additional Information
        3. 7.7.5.3 General Board Bring-up and Debug Checklist
  11. 8 Self-Review of the Custom Board Schematics Design
  12. 9 Layout Notes (Added on the Schematic)
    1. 9.1 Layout Checklist
  13. 10Custom Board Design Simulation
  14. 11Additional References
    1. 11.1 FAQ Covering AM6xx Processor Family
    2. 11.2 FAQs - Processor Product Family Wise and Sitara Processor Families
    3. 11.3 Processor Attached Devices
  15. 12Summary
  16. 13Terminology

7.3.3 Universal Asynchronous Receiver/Transmitter (UART)

Note:

The following (UART, MCAN, MCSPI, MCASP, I2C) peripherals implements IOSET. Make sure the usage of the correct IOSET in the custom design.

Timing closure is based on the IOSETs.

Verify the IO supply for IO group that is referenced by the IOs (fixed or dual-voltage) of the connected processor peripheral and the IO voltage level of the attached device are compatible. The recommendation is to connect the IO supply of the attached device and the IO supply for the IO group referenced by the connected processor. Peripheral IOs are connected to the same supply source.

Verify the application requirements for UART interface (external communication interface or debug) and configuration (2-wire or 4-wire with flow control). For the number of UART instances supported, see the processor-specific data sheet.

When an external transceiver is used, match the external interface signal IO levels and the dual-voltage IO supply for IO group voltage level. The recommendation is to power the IO supply of the transceiver and the processor IO supply for IO group VDDSHVx or VDDSx or VDDS_WKUP from the same source. Verify fail-safe operation and the pullup voltage level and supply connected as required.

The recommendation is to provision the series resistors on the interface signals, close to source, for isolation or debug.

A pullup is recommended on the processor UART receive inputs (UARTn_RXD (n = 0-6) and WKUP_UART0_RXD). Verify the availability of pulls on the external interface signal and configure the pull accordingly.

External ESD protection is recommended in case the interface signals from the processor are directly connected to external inputs.

The UART interface is frequently hooked up incorrectly. Connect the signals as below:

  • TX to RX
  • RX to TX

Verify the connections if additional interface signals are used.

When the debug interface UART signals are directly connected to external interface, take note of fail-safe operation, IO levels. Provide provision for external ESD protection.