SM320F2808-EP

ACTIVO

MCU C2000™ de 32 bits de producto mejorado, con memoria flash de 100 MHz, 128 KB, 12 PWM

Detalles del producto

CPU 1 C28 Frequency (MHz) 100 Flash memory (kByte) 128 RAM (kByte) 36 ADC type 12-bit Total processing (MIPS) 100 Features 2-pin oscillator, 32-bit CPU timers, Watchdog timer UART 2 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 12 Number of ADC channels 16 Direct memory access (Ch) 0 SPI 4 QEP 2 USB No Hardware accelerators CPU only Edge AI enabled Yes Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS) Nonvolatile memory (kByte) 128 Number of GPIOs 35 Security Secure storage
CPU 1 C28 Frequency (MHz) 100 Flash memory (kByte) 128 RAM (kByte) 36 ADC type 12-bit Total processing (MIPS) 100 Features 2-pin oscillator, 32-bit CPU timers, Watchdog timer UART 2 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 12 Number of ADC channels 16 Direct memory access (Ch) 0 SPI 4 QEP 2 USB No Hardware accelerators CPU only Edge AI enabled Yes Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS) Nonvolatile memory (kByte) 128 Number of GPIOs 35 Security Secure storage
LQFP (PZ) 100 256 mm² 16 x 16
  • Controlled Baseline
    • One Assembly/Test/Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Static CMOS Technology
    • 100 MHz (10-ns Cycle Time)
    • Low-Power (1.8-V Core, 3.3-V I/O) Design
    • 3.3-V Flash Voltage
  • JTAG Boundary Scan Support
  • High-Performance 32-Bit CPU (TMS320C28x)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • On-Chip Memory
    • F2808: 64K X 16 Flash, 18K X 16 SARAM
      F2806: 32K X 16 Flash, 10K X 16 SARAM
      F2801: 16K X 16 Flash, 6K X 16 SARAM
      9501: 16K X 16 Flash, 6K X 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (4K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Clock-Fail-Detect Mode
    • Watchdog Timer Module
  • Any GPIO A Pin Can Be Connected to One of the Three External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 43 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/L0/L1 Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 16 PWM Outputs
    • Up to Four HRPWM Outputs With 150 ps MEP Resolution
    • Up to Four Capture Inputs
    • Up to Two Quadrature Encoder Interfaces
    • Up to Six 32-bit Timers
    • Up to Six 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to Four Serial Peripheral Interface (SPI) Modules
    • Up to Two Serial Communications Interface (SCI), Standard UART Modules
    • Up to Two Enhanced Controller Area Network (eCAN) Modules
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 160 ns/6.25 MSPS
    • Internal or External Reference
  • Up to 35 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Thin Quad Flatpack (PZ)
    • MicroStar BGA™ (GGM, ZGM)
  • Temperature Options:
    • M: -55°C to 125°C (PZ)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

MicroStar BGA, TMS320C28x, MicroStar, C28x, TMS320C2000, DSP/BIOS, Code Composer Studio, TMS320 are trademarks of Texas Instruments.
eZdsp, XDS510USB are trademarks of Spectrum Digital.

  • Controlled Baseline
    • One Assembly/Test/Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Static CMOS Technology
    • 100 MHz (10-ns Cycle Time)
    • Low-Power (1.8-V Core, 3.3-V I/O) Design
    • 3.3-V Flash Voltage
  • JTAG Boundary Scan Support
  • High-Performance 32-Bit CPU (TMS320C28x)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • On-Chip Memory
    • F2808: 64K X 16 Flash, 18K X 16 SARAM
      F2806: 32K X 16 Flash, 10K X 16 SARAM
      F2801: 16K X 16 Flash, 6K X 16 SARAM
      9501: 16K X 16 Flash, 6K X 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (4K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Clock-Fail-Detect Mode
    • Watchdog Timer Module
  • Any GPIO A Pin Can Be Connected to One of the Three External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 43 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/L0/L1 Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 16 PWM Outputs
    • Up to Four HRPWM Outputs With 150 ps MEP Resolution
    • Up to Four Capture Inputs
    • Up to Two Quadrature Encoder Interfaces
    • Up to Six 32-bit Timers
    • Up to Six 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to Four Serial Peripheral Interface (SPI) Modules
    • Up to Two Serial Communications Interface (SCI), Standard UART Modules
    • Up to Two Enhanced Controller Area Network (eCAN) Modules
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 160 ns/6.25 MSPS
    • Internal or External Reference
  • Up to 35 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Thin Quad Flatpack (PZ)
    • MicroStar BGA™ (GGM, ZGM)
  • Temperature Options:
    • M: -55°C to 125°C (PZ)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

MicroStar BGA, TMS320C28x, MicroStar, C28x, TMS320C2000, DSP/BIOS, Code Composer Studio, TMS320 are trademarks of Texas Instruments.
eZdsp, XDS510USB are trademarks of Spectrum Digital.

The SM320F2808, F2806, and F2801/UCD9501 devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The UCD9501 is a 32-bit digital signal controller for power management.

Throughout this document, SM320F2808, F2806, and F2801/UCD9501 are abbreviated as F2808, F2806, and F2801/9501, respectively. TMS320x280x device reference guides, flash tools, and other collateral are applicable to the UCD9501 device as well.

The SM320F2808, F2806, and F2801/UCD9501 devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The UCD9501 is a 32-bit digital signal controller for power management.

Throughout this document, SM320F2808, F2806, and F2801/UCD9501 are abbreviated as F2808, F2806, and F2801/9501, respectively. TMS320x280x device reference guides, flash tools, and other collateral are applicable to the UCD9501 device as well.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet Digital Signal Processors datasheet (Rev. A) 08 feb 2007
* Errata TMS320F280x, TMS320C280x, TMS320F2801x DSPs Silicon Errata (Rev. T) PDF | HTML 28 sep 2020
* Radiation & reliability report SM320F2808PZMEP Reliability Report 26 ago 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

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Herramienta de programación de hardware

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Guía del usuario: PDF
Firmware

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Productos y hardware compatibles

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Soporte de software

SPRC193 Download: TMS320F280xx Flash API

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Productos y hardware compatibles

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Herramienta de diseño

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LQFP (PZ) 100 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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