MSP430FR2533

ACTIVO

MCU táctil capacitivo con 16 E/S táctiles (24 sensores), 16 KB FRAM, 2 KB SRAM, 19 E/S y ADC de 10 b

Detalles del producto

CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 16 RAM (kByte) 2 ADC type 10-bit SAR Features Advanced sensing, CapTIvate Touch I/O, Real-time clock UART 2 Number of ADC channels 8 SPI 2 USB No Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Hardware accelerators 0 Nonvolatile memory (kByte) 16 Number of GPIOs 19 Number of I2Cs 1 Security Secure debug
CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 16 RAM (kByte) 2 ADC type 10-bit SAR Features Advanced sensing, CapTIvate Touch I/O, Real-time clock UART 2 Number of ADC channels 8 SPI 2 USB No Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Hardware accelerators 0 Nonvolatile memory (kByte) 16 Number of GPIOs 19 Number of I2Cs 1 Security Secure debug
TSSOP (DA) 32 89.1 mm² 11 x 8.1 VQFN (RHB) 32 25 mm² 5 x 5
  • CapTIvate™ technology – capacitive touch
    • Performance
      • Fast electrode scanning with four simultaneous scans
      • Support for high-resolution sliders with up to 1024 points
      • Proximity sensing
    • Reliability
      • Increased immunity to power line, RF, and other environmental noise
      • Built-in spread spectrum, automatic tuning, noise filtering, and debouncing algorithms
      • Enables reliable touch solutions with 10-V RMS common-mode noise, 4-kV electrical fast transients, and 15-kV electrostatic discharge, allowing for IEC‑61000-4-6, IEC‑61000-4-4, and IEC‑61000-4-2 compliance
      • Reduced RF emissions to simplify electrical designs
      • Support for metal touch and water rejection designs
    • Flexibility
    • Low power
      • <5 µA wake-on-touch with four sensors
      • Wake-on-touch state machine allows electrode scanning while CPU is asleep
      • Hardware acceleration for environmental compensation, filtering, and threshold detection
    • Ease of use
      • CapTIvate Design Center PC GUI lets engineers design and tune capacitive buttons in real time without having to write code
      • CapTIvate software library in ROM provides ample FRAM for customer application
  • Embedded microcontroller
    • 16-bit RISC architecture
    • Clock supports frequencies up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
  • Optimized ultra-low-power modes
    • Active mode: 126 µA/MHz (typical)
    • Standby: <5 µA wake-on-touch with four sensors
    • LPM3.5 real-time clock (RTC) counter with 32768-Hz crystal: 730 nA (typical)
    • Shutdown (LPM4.5): 16 nA (typical)
  • High-performance analog
    • 8-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
  • Enhanced serial communications
    • Two enhanced universal serial communication interfaces (eUSCI_A) support UART, IrDA, and SPI
    • One eUSCI (eUSCI_B) supports SPI and I2C
  • Intelligent digital peripherals
    • Four 16-bit timers
      • Two timers with three capture/compare registers each (Timer_A3)
      • Two timers with two capture/compare registers each (Timer_A2)
    • One 16-bit timer associated with CapTIvate technology
    • One 16-bit counter-only RTC
    • 16-bit cyclic redundancy check (CRC)
  • Low-power ferroelectric RAM (FRAM)
    • Up to 15.5KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
    • High FRAM-to-SRAM ratio, up to 4:1
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency-locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • Total of 19 I/Os on TSSOP-32 package
    • 16 interrupt pins (P1 and P2) can wake MCU from low-power modes
  • Development tools and software
  • Family members (also see Device Comparison)
    • MSP430FR2633: 15KB of program FRAM, 512 bytes of information FRAM, 4KB of RAM, up to 16 self-capacitive or 64 mutual-capacitive sensors
    • MSP430FR2533: 15KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 16 self-capacitive or 24 mutual-capacitive sensors
    • MSP430FR2632: 8KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 8 self-capacitive or 16 mutual-capacitive sensors
    • MSP430FR2532: 8KB of program FRAM, 512 bytes of information FRAM, 1KB of RAM, up to 8 self-capacitive or 8 mutual-capacitive sensors
  • Package options
    • 32 pin: VQFN (RHB)
    • 32 pin: TSSOP (DA)
    • 24 pin: VQFN (RGE)
    • 24-pin: DSBGA (YQW)
  • CapTIvate™ technology – capacitive touch
    • Performance
      • Fast electrode scanning with four simultaneous scans
      • Support for high-resolution sliders with up to 1024 points
      • Proximity sensing
    • Reliability
      • Increased immunity to power line, RF, and other environmental noise
      • Built-in spread spectrum, automatic tuning, noise filtering, and debouncing algorithms
      • Enables reliable touch solutions with 10-V RMS common-mode noise, 4-kV electrical fast transients, and 15-kV electrostatic discharge, allowing for IEC‑61000-4-6, IEC‑61000-4-4, and IEC‑61000-4-2 compliance
      • Reduced RF emissions to simplify electrical designs
      • Support for metal touch and water rejection designs
    • Flexibility
    • Low power
      • <5 µA wake-on-touch with four sensors
      • Wake-on-touch state machine allows electrode scanning while CPU is asleep
      • Hardware acceleration for environmental compensation, filtering, and threshold detection
    • Ease of use
      • CapTIvate Design Center PC GUI lets engineers design and tune capacitive buttons in real time without having to write code
      • CapTIvate software library in ROM provides ample FRAM for customer application
  • Embedded microcontroller
    • 16-bit RISC architecture
    • Clock supports frequencies up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
  • Optimized ultra-low-power modes
    • Active mode: 126 µA/MHz (typical)
    • Standby: <5 µA wake-on-touch with four sensors
    • LPM3.5 real-time clock (RTC) counter with 32768-Hz crystal: 730 nA (typical)
    • Shutdown (LPM4.5): 16 nA (typical)
  • High-performance analog
    • 8-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
  • Enhanced serial communications
    • Two enhanced universal serial communication interfaces (eUSCI_A) support UART, IrDA, and SPI
    • One eUSCI (eUSCI_B) supports SPI and I2C
  • Intelligent digital peripherals
    • Four 16-bit timers
      • Two timers with three capture/compare registers each (Timer_A3)
      • Two timers with two capture/compare registers each (Timer_A2)
    • One 16-bit timer associated with CapTIvate technology
    • One 16-bit counter-only RTC
    • 16-bit cyclic redundancy check (CRC)
  • Low-power ferroelectric RAM (FRAM)
    • Up to 15.5KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
    • High FRAM-to-SRAM ratio, up to 4:1
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency-locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • Total of 19 I/Os on TSSOP-32 package
    • 16 interrupt pins (P1 and P2) can wake MCU from low-power modes
  • Development tools and software
  • Family members (also see Device Comparison)
    • MSP430FR2633: 15KB of program FRAM, 512 bytes of information FRAM, 4KB of RAM, up to 16 self-capacitive or 64 mutual-capacitive sensors
    • MSP430FR2533: 15KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 16 self-capacitive or 24 mutual-capacitive sensors
    • MSP430FR2632: 8KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 8 self-capacitive or 16 mutual-capacitive sensors
    • MSP430FR2532: 8KB of program FRAM, 512 bytes of information FRAM, 1KB of RAM, up to 8 self-capacitive or 8 mutual-capacitive sensors
  • Package options
    • 32 pin: VQFN (RHB)
    • 32 pin: TSSOP (DA)
    • 24 pin: VQFN (RGE)
    • 24-pin: DSBGA (YQW)

The MSP430FR263x and MSP430FR253x are ultra-low-power MSP430™ microcontrollers for capacitive touch sensing that feature CapTIvate™ touch technology for buttons, sliders, wheels, and proximity applications. MSP430 MCUs with CapTIvate technology provide the most integrated and autonomous capacitive-touch solution in the market with high reliability and noise immunity at the lowest power. TI’s capacitive touch technology supports concurrent self-capacitance and mutual-capacitance electrodes on the same design for maximum flexibility. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

TI capacitive touch sensing MSP430 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-CAPT-FR2633 CapTIvate technology development kit. TI also provides free software including the CapTIvate Design Center, where engineers can quickly develop applications with an easy-to-use GUI and MSP430Ware™ software and comprehensive documentation with the CapTIvate Technology Guide.

TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

The MSP430FR263x and MSP430FR253x are ultra-low-power MSP430™ microcontrollers for capacitive touch sensing that feature CapTIvate™ touch technology for buttons, sliders, wheels, and proximity applications. MSP430 MCUs with CapTIvate technology provide the most integrated and autonomous capacitive-touch solution in the market with high reliability and noise immunity at the lowest power. TI’s capacitive touch technology supports concurrent self-capacitance and mutual-capacitance electrodes on the same design for maximum flexibility. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

TI capacitive touch sensing MSP430 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-CAPT-FR2633 CapTIvate technology development kit. TI also provides free software including the CapTIvate Design Center, where engineers can quickly develop applications with an easy-to-use GUI and MSP430Ware™ software and comprehensive documentation with the CapTIvate Technology Guide.

TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet MSP430FR263x, MSP430FR253x Capacitive Touch Sensing Mixed-Signal Microcontrollers datasheet (Rev. E) PDF | HTML 09 dic 2019
* Errata MSP430FR2533 Device Erratasheet (Rev. T) PDF | HTML 27 may 2021
* User guide MSP430FR4xx and MSP430FR2xx Family User's Guide (Rev. I) 13 mar 2019
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. B) PDF | HTML 02 jun 2025
Application note Liquid Level Detection System Based on MSP430 CapTIvate Technology (Rev. A) PDF | HTML 17 oct 2022
User guide MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB) PDF | HTML 22 sep 2022
Application note ESD Diode Current Specification (Rev. B) PDF | HTML 23 ago 2021
Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 12 ago 2021
Application note Designing With the MSP430FR4xx and MSP430FR2xx ADC (Rev. A) PDF | HTML 02 ago 2021
Application note Low-Power Battery Voltage Measurement With MSP430FR MCU On-Chip VREF and ADC (Rev. B) PDF | HTML 02 ago 2021
Application note Migrating from MSP430 F2xx and G2xx families to MSP430 FR4xx and FR2xx family (Rev. G) PDF | HTML 02 ago 2021
Application note Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B) PDF | HTML 02 ago 2021
Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 14 jul 2021
User guide CapTIvate™ Touch MCUs Getting Started Guide (Rev. A) PDF | HTML 12 jul 2021
User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 13 may 2021
Application note MSP430FR2xx and MSP430FR4xx DCO+FLL Application Guide 07 dic 2020
White paper Capacitive Sensing Technology, Products, and Applications 19 may 2020
Application note Automating Capacitive Touch Sensor PCB Design Using OpenSCAD Scripts (Rev. B) PDF | HTML 26 feb 2020
Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 13 dic 2019
White paper Enabling Noise Tolerant Capacitive Touch HMIs With MSP CapTIvate™ Technology (Rev. B) 12 nov 2019
Application note Capacitive Touch Design Flow for MSP430™ MCUs With CapTIvate™ Technology (Rev. B) PDF | HTML 14 ago 2019
Application note Sensitivity, SNR, and design margin in capacitive touch applications (Rev. A) PDF | HTML 25 mar 2019
White paper Capacitive touch building security system equipment using MSP430™ MCUs (Rev. B) 08 nov 2018
White paper Simplify smart speaker human machine interface with capacitive-touch technology 15 feb 2018
Application note Capacitive Touch Through Metal Using MSP430™ MCUs With CapTIvate™ Technology (Rev. A) 31 oct 2017
White paper Take your HMI design to the next level with transparent capacitive-touch technol 14 sep 2017
Technical article Why knock on wood when touch will do? PDF | HTML 25 may 2017
White paper Capacitive Touch and MSP Microcontrollers (Rev. A) 27 abr 2017
Technical article Getting a grip on handheld devices is easier with capacitive touch sensing PDF | HTML 28 feb 2017
Technical article Rain on this touch panel parade won’t matter PDF | HTML 28 nov 2016
White paper Smart Fault Indicator with MSP430 FRAM Microcontrollers 26 sep 2016
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 01 abr 2016
Application note VLO Calibration on the MSP430FR4xx and MSP430FR2xx Family (Rev. A) 19 feb 2016
User guide Getting started with MSP MCUs featuring CapTIvate™ technology 18 feb 2016
Application note MSP Code Protection Features PDF | HTML 07 dic 2015
White paper CapTIvate™ 터치 기술과 초저전력 MSP430™ FRAM 마이크로컨트롤러로 멋진 HMI 만들기 11 nov 2015
White paper MSP430™ FRAM Microcontrollers With CapTIvate™ Touch Technology 14 oct 2015
White paper Crypto-Bootloader - Secure In-Field Firmware Updates for Ultra-Low Power MCUs 19 ago 2015
White paper Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers 15 sep 2014
Application note MSP430 FRAM Quality and Reliability (Rev. A) 01 may 2014
White paper FRAM FAQs 23 abr 2014
White paper Benchmarking MCU power consumption for ultra-low-power applications 26 oct 2012

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Software de aplicación y estructura

MSPCAPTDSNCTR MSP CapTIvate™ design Center GUI

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Ejemplo de código o demostración

SLAC700 MSP430FR243x, MSP430FR253x, MSP430FR263x Code Examples

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Esquema: PDF
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Muchos productos se están conectando ahora a través del Internet de las cosas (IoT), incluidos los equipos de prueba, como los multímetros digitales (DMM).  Habilitado por la plataforma de microcontrolador (MCU) inalámbrico de potencia ultrabaja SimpleLink™ de Texas Instruments, el diseño de (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (DA) 32 Ultra Librarian
VQFN (RHB) 32 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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