30V, Nch synchronous buck NexFET MOSFET™, 5x2.5 LGA, 25A
Product details
Parameters
Features
- Half-Bridge Power Block
- 90% System Efficiency at 20 A
- Up to 25 A Operation
- High Density – 5 mm × 2.5 mm LGA Footprint
- Double Side Cooling Capability
- Ultra-Low Profile – 0.48 mm Max
- Optimized for 5 V Gate Drive
- Low Switching Losses
- Low Inductance Package
- RoHS Compliant
- Halogen Free
- Pb Free
Description
The CSD87588N NexFET™ power block II is a highly-optimized design for synchronous buck applications offering high current and high efficiency capability in a small 5 mm × 2.5 mm outline. Optimized for 5 V gate drive applications, this product offers an efficient and flexible solution capable of providing a high density power supply when paired with any 5 V gate driver from an external controller/driver.
Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | CSD87588N Synchronous Buck NexFET Power Block II datasheet (Rev. D) | Feb. 24, 2015 |
| Technical articles | How to choose the right power MOSFET or power block package for your application | Oct. 29, 2019 | |
| Technical articles | Discrete FETs vs. power blocks - how to choose the right SOA for your design | Jun. 06, 2019 | |
| Technical articles | Understanding the benefits of “lead-free” power MOSFETs | Feb. 07, 2019 | |
| Technical articles | When to use load switches in place of discrete MOSFETs | Feb. 03, 2016 | |
| User guide | CSD87588NEVM-603 User's Guide (Rev. A) | Feb. 06, 2014 | |
| User guide | Design Summary Power Block II | Apr. 15, 2013 | |
| Application note | Controlling switch-node ringing in synchronous buck converters | Apr. 26, 2012 | |
| Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | Nov. 16, 2011 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
CSD87588NEVM-603
Description
CSD87588NEVM-603 implements a step-down synchronous buck converter using the NextFETTM Power Block II CSD87588N together with controller TPS51219RTE from Texas Instruments. CSD87588N NexFET™ Power Block II is a highly optimized design for synchronous buck applications offering high current and (...)
Features
- 2% tolerance 1.0V output voltage
- Up to 25-Adc steady state output current
- 300kHz switching frequency
- Over 89.5% peak efficiency
Design tools & simulation
SLPM070A.ZIP (4 KB) - PSpice Model
FETPWRCALC — This tool is designed to assist engineers in the selection of Texas Instruments’ discrete power MOSFET and Power Block devices for their synchronous buck design. Users can input the conditions for their power supply and compare various discrete and power block solutions by power loss, relative (...)
Features
- Vary power supply conditions and observe TI’s most efficient solutions for any set of input parameters
- Select from a pre-established list of TI controllers or enter your own custom IC
- Rank solutions by effective power loss and compare by relative 1k price, device package, and total PCB footprint
- (...)
SPLR001.ZIP (824 KB)
Reference designs
TIDM-DC-DC-BUCK — The purpose of this design is to demonstrate digital power control using a C2000™ microcontroller and evaluate the powerSUITE Digital Power software tools. The design consists of two separate boards:
- Digital Power buck converter Boosterpack (BOOSTXL-BUCKCONV)
- C2000 F280049C Launchpad ( (...)
PMP20080 — The PMP20080 is a powerful design intended to operate 5 output rails with application to a Hybrid Memory Cube (HMC) Gen2. This design uses 5 synchronous bucks with multiple different controllers to allow for a well regulated set of outputs. Also, PMP20080 allows for the configurability that comes (...)
Design files
-
download PMP20080 BOM.pdf (76KB) -
download PMP20080 Assembly Drawing.pdf (391KB) -
download PMP20080 PCB.pdf (1776KB) -
download PMP20080 Altium.zip (18432KB) -
download PMP20080 Gerber.zip (2061KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| (MPA) | 5 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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