產品詳細資料

CPU 1 Arm Cortex-A8 Frequency (MHz) 1000 Protocols Ethernet PCIe 1 PCIe Gen 2 Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Operating temperature range (°C) 0 to 90
CPU 1 Arm Cortex-A8 Frequency (MHz) 1000 Protocols Ethernet PCIe 1 PCIe Gen 2 Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Operating temperature range (°C) 0 to 90
FCBGA (CYE) 684 529 mm² 23 x 23
  • High-Performance Sitara™ ARM® Processors
    • ARM Cortex®-A8 Core
      • ARMv7 Architecture
        • In-Order, Dual-Issue, Superscalar Processor Core
        • Neon™ Multimedia Architecture
        • Supports Integer and Floating Point
        • Jazelle® RCT Execution Environment
    • ARM Cortex-A8 Memory Architecture
      • 32KB of Instruction and Data Caches
      • 512KB of L2 Cache
      • 64KB of RAM, 48KB of Boot ROM
    • 128KB of On-Chip Memory Controller (OCMC) RAM
    • Imaging Subsystem (ISS)
      • Camera Sensor Connection
        • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
      • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
      • Resizer
        • Resizing Image and Video From 1/16x to 8x
        • Generating Two Different Resizing Outputs Concurrently
    • Media Controller
      • Controls the HDVPSS and ISS
    • SGX530 3D Graphics Engine
      • Delivers up to 25 MPoly/sec
      • Universal Scalable Shader Engine (USSE™)
      • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
      • Advanced Geometry DMA-Driven Operation
      • Programmable HQ Image Anti-Aliasing
    • Endianness
      • ARM Instructions and Data – Little Endian
    • HD Video Processing Subsystem (HDVPSS)
      • Two 165-MHz, 2-channel HD Video Capture Modules
        • One 16- or 24-Bit Input or Dual 8-Bit SD Input Channels
        • One 8-, 16-, or 24-Bit Input and One 8-Bit Only Input Channels
      • Two 165-MHz HD Video Display Outputs
        • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
      • Composite or S-Video Analog Output
      • Macrovision® Support Available
      • Digital HDMI 1.3 Transmitter With Integrated PHY
      • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
      • Three Graphics Layers and Compositors
    • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
      • Supports up to DDR2-800 and DDR3-1066
      • Up to Eight x 8 Devices Comprise 2GB of the Total Address Space
      • Dynamic Memory Manager (DMM)
        • Programmable Multizone Memory Mapping and Interleaving
        • Enables Efficient 2D Block Accesses
        • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
        • Optimizes Interlaced Accesses
    • General-Purpose Memory Controller (GPMC)
      • 8- or 16-Bit Multiplexed Address and Data Bus
      • 512MB of Address Space Divided Among up to 8 Chip Selects
      • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
      • Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit or 512-Byte Hardware ECC for NAND
      • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
    • Enhanced Direct Memory Access (EDMA) Controller
      • Four Transfer Controllers
      • 64 Independent DMA Channels and 8 Independent QDMA Channels
    • Dual-Port Ethernet (10/100/1000 Mbps) With Optional Switch
      • IEEE 802.3 Compliant (3.3-V I/O Only)
      • MII/RMII/GMII/RGMII Media Independent Interfaces
      • Management Data I/O (MDIO) Module
      • Reset Isolation
      • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
    • Dual USB 2.0 Ports With Integrated PHYs
      • USB2.0 High- and Full-Speed Clients
      • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
      • Supports End-point 0–15
    • One PCI-Express 2.0 Port With Integrated PHY
      • Single Port With One Lane at 5.0 GT/s
      • Configurable as Root Complex or End-point
    • Eight 32-Bit General-Purpose Timers (Timer1–Timer8)
    • One System Watchdog Timer (WDT0)
    • Six Configurable UART/IrDA/CIR Modules
      • UART0 With Modem Control Signals
      • Supports up to 3.6864 Mbps UART0/1/2
      • Supports up to 12 Mbps UART3/4/5
      • SIR, MIR, FIR (4.0 MBAUD), and CIR
    • Four Serial Peripheral Interfaces (SPIs) (up to
      48 MHz)
      • Each With Four Chip Selects
    • Three MMC/SD/SDIO Serial Interfaces (up to
      48 MHz)
      • Three Supporting up to 1-, 4-, or 8-Bit Modes
    • Dual Controller Area Network (DCAN) Modules
      • CAN Version 2 Part A, B
    • Four Inter-Integrated Circuit (I2C Bus) Ports
    • Six Multichannel Audio Serial Ports (McASPs)
      • Dual 10 Serializer Transmit and Receive Ports
      • Quad Four Serializer Transmit and Receive Ports
      • DIT-Capable For S/PDIF (All Ports)
    • Multichannel Buffered Serial Port (McBSP)
      • Transmit and Receive Clocks up to 48 MHz
      • Two Clock Zones and Two Serial Data Pins
      • Supports TDM, I2S, and Similar Formats
    • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
      • Direct Interface to One Hard Disk Drive
      • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
      • Supports Port Multiplier and Command-Based Switching
    • Real-Time Clock (RTC)
      • One-Time or Periodic Interrupt Generation
    • Up to 128 General-Purpose I/O (GPIO) Pins
    • One Spin Lock Module With up to 128 Hardware Semaphores
    • One Mailbox Module With 12 Mailboxes
    • On-Chip ARM ROM Bootloader (RBL)
    • Power, Reset, and Clock Management
      • Multiple Independent Core Power Domains
      • Multiple Independent Core Voltage Domains
      • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
      • Clock Enable and Disable Control for Subsystems and Peripherals
    • 32KB of Embedded Trace Buffer (ETB) and
      5-Pin Trace Interface for Debug
    • IEEE 1149.1 (JTAG) Compatible
    • 684-Pin Pb-Free BGA Package (CYE Suffix),
      0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
    • 45-nm CMOS Technology
    • 1.8- and 3.3-V Dual Voltage Buffers for General I/O

    All trademarks are the property of their respective owners.

    • High-Performance Sitara™ ARM® Processors
      • ARM Cortex®-A8 Core
        • ARMv7 Architecture
          • In-Order, Dual-Issue, Superscalar Processor Core
          • Neon™ Multimedia Architecture
          • Supports Integer and Floating Point
          • Jazelle® RCT Execution Environment
      • ARM Cortex-A8 Memory Architecture
        • 32KB of Instruction and Data Caches
        • 512KB of L2 Cache
        • 64KB of RAM, 48KB of Boot ROM
      • 128KB of On-Chip Memory Controller (OCMC) RAM
      • Imaging Subsystem (ISS)
        • Camera Sensor Connection
          • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
        • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
        • Resizer
          • Resizing Image and Video From 1/16x to 8x
          • Generating Two Different Resizing Outputs Concurrently
      • Media Controller
        • Controls the HDVPSS and ISS
      • SGX530 3D Graphics Engine
        • Delivers up to 25 MPoly/sec
        • Universal Scalable Shader Engine (USSE™)
        • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
        • Advanced Geometry DMA-Driven Operation
        • Programmable HQ Image Anti-Aliasing
      • Endianness
        • ARM Instructions and Data – Little Endian
      • HD Video Processing Subsystem (HDVPSS)
        • Two 165-MHz, 2-channel HD Video Capture Modules
          • One 16- or 24-Bit Input or Dual 8-Bit SD Input Channels
          • One 8-, 16-, or 24-Bit Input and One 8-Bit Only Input Channels
        • Two 165-MHz HD Video Display Outputs
          • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
        • Composite or S-Video Analog Output
        • Macrovision® Support Available
        • Digital HDMI 1.3 Transmitter With Integrated PHY
        • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
        • Three Graphics Layers and Compositors
      • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
        • Supports up to DDR2-800 and DDR3-1066
        • Up to Eight x 8 Devices Comprise 2GB of the Total Address Space
        • Dynamic Memory Manager (DMM)
          • Programmable Multizone Memory Mapping and Interleaving
          • Enables Efficient 2D Block Accesses
          • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
          • Optimizes Interlaced Accesses
      • General-Purpose Memory Controller (GPMC)
        • 8- or 16-Bit Multiplexed Address and Data Bus
        • 512MB of Address Space Divided Among up to 8 Chip Selects
        • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
        • Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit or 512-Byte Hardware ECC for NAND
        • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
      • Enhanced Direct Memory Access (EDMA) Controller
        • Four Transfer Controllers
        • 64 Independent DMA Channels and 8 Independent QDMA Channels
      • Dual-Port Ethernet (10/100/1000 Mbps) With Optional Switch
        • IEEE 802.3 Compliant (3.3-V I/O Only)
        • MII/RMII/GMII/RGMII Media Independent Interfaces
        • Management Data I/O (MDIO) Module
        • Reset Isolation
        • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
      • Dual USB 2.0 Ports With Integrated PHYs
        • USB2.0 High- and Full-Speed Clients
        • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
        • Supports End-point 0–15
      • One PCI-Express 2.0 Port With Integrated PHY
        • Single Port With One Lane at 5.0 GT/s
        • Configurable as Root Complex or End-point
      • Eight 32-Bit General-Purpose Timers (Timer1–Timer8)
      • One System Watchdog Timer (WDT0)
      • Six Configurable UART/IrDA/CIR Modules
        • UART0 With Modem Control Signals
        • Supports up to 3.6864 Mbps UART0/1/2
        • Supports up to 12 Mbps UART3/4/5
        • SIR, MIR, FIR (4.0 MBAUD), and CIR
      • Four Serial Peripheral Interfaces (SPIs) (up to
        48 MHz)
        • Each With Four Chip Selects
      • Three MMC/SD/SDIO Serial Interfaces (up to
        48 MHz)
        • Three Supporting up to 1-, 4-, or 8-Bit Modes
      • Dual Controller Area Network (DCAN) Modules
        • CAN Version 2 Part A, B
      • Four Inter-Integrated Circuit (I2C Bus) Ports
      • Six Multichannel Audio Serial Ports (McASPs)
        • Dual 10 Serializer Transmit and Receive Ports
        • Quad Four Serializer Transmit and Receive Ports
        • DIT-Capable For S/PDIF (All Ports)
      • Multichannel Buffered Serial Port (McBSP)
        • Transmit and Receive Clocks up to 48 MHz
        • Two Clock Zones and Two Serial Data Pins
        • Supports TDM, I2S, and Similar Formats
      • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
        • Direct Interface to One Hard Disk Drive
        • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
        • Supports Port Multiplier and Command-Based Switching
      • Real-Time Clock (RTC)
        • One-Time or Periodic Interrupt Generation
      • Up to 128 General-Purpose I/O (GPIO) Pins
      • One Spin Lock Module With up to 128 Hardware Semaphores
      • One Mailbox Module With 12 Mailboxes
      • On-Chip ARM ROM Bootloader (RBL)
      • Power, Reset, and Clock Management
        • Multiple Independent Core Power Domains
        • Multiple Independent Core Voltage Domains
        • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
        • Clock Enable and Disable Control for Subsystems and Peripherals
      • 32KB of Embedded Trace Buffer (ETB) and
        5-Pin Trace Interface for Debug
      • IEEE 1149.1 (JTAG) Compatible
      • 684-Pin Pb-Free BGA Package (CYE Suffix),
        0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
      • 45-nm CMOS Technology
      • 1.8- and 3.3-V Dual Voltage Buffers for General I/O

      All trademarks are the property of their respective owners.

      AM387x Sitara ARM processors are highly integrated, programmable platforms that leverage the Sitara processor technology.

      The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable ARM processing with a highly integrated peripheral set.

      The AM387x Sitara ARM processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM who used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x core DSP along with a video encoder and decoder to the hardware on the AM387x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and/or DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.

      Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension. The ARM processor lets developers keep control functions separate from algorithms programmed on coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-bit RISC core with Neon floating-point extension includes: 32KB of instruction cache; 32KB of data cache; 512KB of L2 cache; 48KB of boot ROM; and 64KB of RAM.

      The AM387x Sitara ARM processors also include an SGX530 3D graphics engine to off-load many graphics processing tasks from the ARM core, making more ARM MIPS available for common processing tasks on algorithms. Additionally, the AM387x processor has a complete set of development tools for the ARM which include C compilers and a Microsoft Windows debugger interface for visibility into source code execution.

      AM387x Sitara ARM processors are highly integrated, programmable platforms that leverage the Sitara processor technology.

      The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable ARM processing with a highly integrated peripheral set.

      The AM387x Sitara ARM processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM who used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x core DSP along with a video encoder and decoder to the hardware on the AM387x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and/or DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.

      Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension. The ARM processor lets developers keep control functions separate from algorithms programmed on coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-bit RISC core with Neon floating-point extension includes: 32KB of instruction cache; 32KB of data cache; 512KB of L2 cache; 48KB of boot ROM; and 64KB of RAM.

      The AM387x Sitara ARM processors also include an SGX530 3D graphics engine to off-load many graphics processing tasks from the ARM core, making more ARM MIPS available for common processing tasks on algorithms. Additionally, the AM387x processor has a complete set of development tools for the ARM which include C compilers and a Microsoft Windows debugger interface for visibility into source code execution.

      下載 觀看有字幕稿的影片 影片

      您可能會感興趣的類似產品

      open-in-new 比較替代產品
      引腳對引腳且具備與所比較裝置相同的功能
      AM3874 現行 Sitara 處理器:ARM Cortex-A8、HDMI、3D 圖形 This device adds display capability in a software and pin compatible package

      技術文件

      star =TI 所選的此產品重要文件
      找不到結果。請清除您的搜尋條件,然後再試一次。
      檢視所有 7
      重要文件 類型 標題 格式選項 日期
      * Data sheet AM387x Sitara™ARM® Processors datasheet (Rev. D) PDF | HTML 2016年 1月 5日
      * Errata AM387x Sitara ARM Microprocessors (MPUs) Errata (Silicon Revisions 3.0, 2.1) (Rev. C) 2013年 4月 15日
      Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023年 2月 24日
      More literature From Start to Finish: A Product Development Roadmap for Sitara™ Processors 2020年 12月 16日
      User guide How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 2018年 9月 24日
      User guide AM387x Sitara ARM Microprocessors (MPUs) Technical Reference Manual (Rev. E) 2015年 7月 3日
      Application note Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 2009年 11月 25日

      設計與開發

      如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

      偵錯探測器

      TMDSEMU200-U — XDS200 USB 偵錯探測器

      XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器(模擬器)。對於大多數裝置,建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

      XDS200 透過 TI 20 接腳連接器(配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器)連接到目標電路板,並透過 USB2.0 高速 (...)

      TI.com 無法提供
      偵錯探測器

      TMDSEMU560V2STM-U — XDS560v2 System Trace USB 偵錯探測器

      XDS560v2 是 XDS560™ 偵錯探測器系列的最高性能表現,支援傳統 JTAG 標準 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。請注意,序列線偵錯 (SWD) 不受支援。

      所有 XDS 偵錯探測器均支援所有具有嵌入式追踪緩衝區 (ETB) 的 ARM 和 DSP 處理器中的核心和系統追蹤功能。對於針腳追蹤則需要 XDS560v2 PRO TRACE

      XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (480Mbps) (...)

      TI.com 無法提供
      偵錯探測器

      TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

      The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

      All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

      TI.com 無法提供
      軟體開發套件 (SDK)

      LINUXEZSDK-SITARA — 用於 Sitara™ 處理器的 Linux EZ 軟體開發套件 (EZSDK)

      SITARA LINUX SDK

      Linux Software Development Kits (SDK) provide Sitara™ developers with an easy set up and quick out-of-box experience that is specific to and highlights the features of TI's ARM processors. Launching demos, benchmarks and applications is a snap with the included graphical user (...)

      驅動程式或資料庫

      WIND-3P-VXWORKS-LINUX-OS — Wind River 處理器 VxWorks 和 Linux 作業系統

      Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)
      IDE、配置、編譯器或偵錯程式

      CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

      CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)

      支援產品和硬體

      支援產品和硬體

      啟動 下載選項
      作業系統 (OS)

      GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

      The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
      作業系統 (OS)

      MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

      Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
      作業系統 (OS)

      QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

      QNX Neutrino® 即時作業系統 (RTOS) 是一款功能完整且穩固的 RTOS,專為實現適用於汽車、醫療、運輸、軍事和工業嵌入式系統的新一代產品而設計。微核心設計與模組化架構,能讓客戶以低整體擁有成本打造高度最佳化且可靠的系統。
      軟體程式設計工具

      UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

      UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

      UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

      支援產品和硬體

      支援產品和硬體

      啟動 下載選項
      模擬型號

      AM387x CYE BSDL Model

      SPRM551.ZIP (21 KB) - BSDL Model
      計算工具

      CLOCKTREETOOL — 適用於 Sitara、車用、視覺分析和數位訊號處理器的時脈樹工具

      The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
      • Visualize the device clock tree
      • Interact with clock tree (...)
      使用指南: PDF
      封裝 針腳 CAD 符號、佔位空間與 3D 模型
      FCBGA (CYE) 684 Ultra Librarian

      訂購與品質

      內含資訊:
      • RoHS
      • REACH
      • 產品標記
      • 鉛塗層/球物料
      • MSL 等級/回焊峰值
      • MTBF/FIT 估算值
      • 材料內容
      • 認證摘要
      • 進行中的可靠性監測
      內含資訊:
      • 晶圓廠位置
      • 組裝地點

      支援與培訓

      內含 TI 工程師技術支援的 TI E2E™ 論壇

      內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

      若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

      影片