產品詳細資料

Processor External MCU Type Module, Wireless network processor Technology Wi-Fi Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS, TI RTOS Certifications CE, FCC, ISED, MIC, Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 16 Features 16 secure sockets, 2.4-GHz coexistence, 4 STAs, 802.11abgn, IPv4 & IPv6 Security Cryptographic acceleration, Device attestation & anti-counterfeit, FIPS 140-2 Level 1, Secure communication, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 85
Processor External MCU Type Module, Wireless network processor Technology Wi-Fi Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS, TI RTOS Certifications CE, FCC, ISED, MIC, Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 16 Features 16 secure sockets, 2.4-GHz coexistence, 4 STAs, 802.11abgn, IPv4 & IPv6 Security Cryptographic acceleration, Device attestation & anti-counterfeit, FIPS 140-2 Level 1, Secure communication, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 85
QFM (MOB) 63 358.75 mm² 20.5 x 17.5
  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4GHz and 5GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4GHz and 5GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16Mbps
    • TCP: 13Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3V to 3.6V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5µA
      • Low-power deep sleep (LPDS): 115µA
      • Idle connected (MCU in LPDS): 710µA
      • RX traffic (MCU active): 53mA
      • TX traffic (MCU active): 223mA
  • Wi-Fi TX power
    • 2.4GHz: 16dBm at 1 DSSS
    • 5GHz: 15.1dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4GHz: –94.5dBm at 1 DSSS
    • 5GHz: –89dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0MHz crystal with internal oscillator
    • 32.768kHz crystal (RTC)
    • 32Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27mm pitch, 63-pin, 20.5mm × 17.5mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem
  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4GHz and 5GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4GHz and 5GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16Mbps
    • TCP: 13Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3V to 3.6V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5µA
      • Low-power deep sleep (LPDS): 115µA
      • Idle connected (MCU in LPDS): 710µA
      • RX traffic (MCU active): 53mA
      • TX traffic (MCU active): 223mA
  • Wi-Fi TX power
    • 2.4GHz: 16dBm at 1 DSSS
    • 5GHz: 15.1dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4GHz: –94.5dBm at 1 DSSS
    • 5GHz: –89dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0MHz crystal with internal oscillator
    • 32.768kHz crystal (RTC)
    • 32Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27mm pitch, 63-pin, 20.5mm × 17.5mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

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技術文件

star =TI 所選的此產品重要文件
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重要文件 類型 標題 格式選項 日期
* Data sheet SimpleLink™ Wi-Fi CC3135MOD Dual-Band Network Processor Module datasheet (Rev. E) PDF | HTML 2024年 12月 6日
* Radiation & reliability report CC3135MOD Reliability Data – Reliability Estimate 2019年 6月 25日
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022年 10月 20日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
Cybersecurity advisory TI-PSIRT-2021-100117 Integrated HTTP Server Ping Utility Vulnerability PDF | HTML 2022年 1月 15日
Application note TI Wi-Fi Test Strategy Overview (Rev. A) 2021年 7月 1日
Certificate CC3135MODRNMMOB EC Declaration of Conformity (DoC) (Rev. A) 2021年 3月 3日
User guide SimpleLink™ Wi-Fi® CC3x20, CC3x3x Network Processor (Rev. M) PDF | HTML 2020年 9月 30日
Application note CC3x20, CC3x35 SimpleLink™ Wi-Fi® Internet-on-a chip™ Solution Built-In Security (Rev. C) 2020年 9月 29日
Application brief Wi-Fi® Enabled Electronic Smart Lock Security Application Brief (Rev. A) 2020年 9月 29日
Application note SimpleLink™ Wi-Fi® CC3x20, CC3x3x Device Provisioning (Rev. C) PDF | HTML 2020年 9月 18日
Application note SimpleLink™ Wi-Fi® CC3x20, CC3x3x Over-the-Air Update (Rev. B) 2020年 9月 17日
Application note CE Compliance Test Procedure for TI’s WiFi Devices PDF | HTML 2020年 8月 19日
Application note SimpleLink™ Wi-Fi® CC313x, CC323x BLE Coexistence (Rev. A) 2020年 8月 17日
User guide SimpleLink™ Wi-Fi® CC3x20 and CC3x3x Provisioning for Mobile Applications (Rev. B) 2020年 8月 17日
User guide SimpleLink™ Wi-Fi® CC3x20, CC3x3x Radio Tool User Guide (Rev. B) 2020年 8月 17日
Application note SimpleLink™ Wi-Fi® CC3x3x Networking Subsystem Power Management (Rev. A) 2020年 8月 17日
Application note SimpleLink™ Wi-Fi® CC3x3x Serial Flash (Rev. B) 2020年 8月 17日
User guide UniFlash CC3x20, CC3x3x SimpleLink™ Wi-Fi® and IoC™ Solution ImageCreator (Rev. H) 2020年 8月 17日
Certificate Product Information for CC3xxx Devices as Per Annex-E of EN 300 328 2020年 8月 10日
Certificate Product Information for CC3xxx Devices as Per Annex-G of EN 301 893 2020年 8月 10日
User guide CC3x35 Hardware Design Checklist (Rev. A) 2020年 2月 17日
Application note Module Reliability for CC2xxxMODx, CC3xxxMODx, CC3xxxMODAx, and WL18xxMOD (Rev. A) 2020年 2月 6日
Application note Transfer of TI Wi-Fi® Alliance Certifications to Products Using WFA Cert Policy (Rev. F) PDF | HTML 2020年 1月 30日
Application note FIPS Compliant vs. FIPS Validated (Rev. A) 2019年 6月 26日
White paper Low-Power Internet Connectivity Over Wi-Fi (Rev. A) 2019年 5月 23日
White paper A primer to Wi-Fi® provisioning for IoT applications (Rev. A) 2019年 1月 31日
Application note CC3135MOD Production Line Guide 2018年 12月 12日
Application note CC3135MOD BoosterPack Hardware Design Files 2018年 9月 12日
User guide CC3135MOD OEM Integrator’s Guide 2018年 9月 12日
Application note CC313x and CC323x Simplelink™ Wi-Fi® Embedded Programming User's Guide 2018年 3月 21日
User guide CC3135 SimpleLink™ Wi-Fi® BoosterPack™ Plug-in Module Hardware User’s Guide 2018年 3月 1日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

BOOSTXL-CC3135 — SimpleLink™ Wi-Fi® CC3135 雙頻無線網路處理器 BoosterPack™ 外掛程式模組

SimpleLink™ Wi-Fi® CC3135 無線網路處理器可提供使用者在任何微控制器 (MCU) 中加入 Wi-Fi 的彈性。CC3135 BoosterPack™ 外掛模組 (BOOSTXL-CC3135) 是一款可輕易連接至 TI 的 MCU Launchpad 套件(提供給 MSP-EXP432P401R 的軟體範例)的電路板,因此能快速進行軟體開發。此 BOOSTXL-CC3135 可插入進階模擬 BoosterPack (CC31xxEMUBOOST),並可連接至模擬 MCU 和 SimpleLink Studio 的 PC。最後,此套件也可透過轉接器電路板連接至 TI 的 (...)
使用指南: PDF
TI.com 無法提供
開發板

CC31XXEMUBOOST — 適用於 SimpleLink™ Wi-Fi® CC31xx 的進階模擬套件 BoosterPack™ 插入式模組

This advanced emulation BoosterPack™ plug-in module is an accessory for the SimpleLink™ Wi-Fi® CC31xx wireless network processor BoosterPack plug-in modules

This accessory can be used for:

  1. Flashing updates to the CC31xxBOOST
  2. Using the CC3xxx radio tool for RF performance evaluation
  3. Using (...)
使用指南: PDF
TI.com 無法提供
應用軟體及架構

WIFISTARTERPRO — SimpleLink™ Wi-Fi® Starter Pro

在 iTunes App Store 上下載
在 Google Play 上下載

SimpleLink™ Wi-Fi® Starter Pro 行動應用程式是一款適用於 SimpleLink 配置的全新行動應用程式。它與在裝置端運行的嵌入式配置庫和範例配套使用。新的配置發行版是 TI 推薦的使用 SimpleLink Wi-Fi 產品進行 Wi-Fi 配置的解決方案。它採用先進的 AP 模式配置,並提供意見回餽和回退選項,以確保成功完成該程序。客戶可以同時使用嵌入式庫和行動庫,將其整合到他們的終端產品中。
IDE、配置、編譯器或偵錯程式

CC3XXXRADIOTEST — SimpleLink™ Wi-Fi® 無線電測試工具

SimpleLink™ Wi-Fi® 無線電測試工具是 Windows 軟體工具,適用於在開發和認證過程中對 SimpleLink Wi-Fi CC31xx 和 CC32xx 設計進行 RF 評估和測試。  可透過手動方式利用此工具將無線電設定為傳輸或接收模式,以啓用低階無線電測試功能。使用此工具需要熟悉並了解無線電電路理論,以及無線電測試方法。

SimpleLink Wi-Fi CC31xx 和 CC32xx 裝置專爲物聯網 (IoT) 而建立,包括晶片內建 Wi-Fi、網際網路和穩健執行的安全協定,無需先前的 Wi-Fi 經驗即可加快開發速度。  如需有關 CC31xx 和 CC32xx (...)

IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ 整合式開發環境 (IDE)

Code Composer Studio 是適用於 TI 微控制器與處理器的整合式開發環境 (IDE)。它由一整套豐富的工具組成,可用於建立、除錯、分析及最佳化嵌入式應用程式。Code Composer Studio 支援 Windows®、Linux® 和 macOS® 平台。

Code Composer Studio 提供直覺式的使用者介面,引導使用者完成應用程式開發的每個步驟。它包含最佳化 C/C++ 編譯器、原始碼編輯器、專案建構環境、偵錯器、性能評測工具及其他多種功能。熟悉的工具和介面可讓您以簡單且輕鬆的方式開始開發。

Code Composer Studio 結合 Eclipse® (...)

使用指南: PDF | HTML
線上培訓

SIMPLELINK-ACADEMY-CC32XX SimpleLink™ Academy for CC32xx

SimpleLink Academy delivers easy-to-use training modules that span a wide range of topics for the SimpleLink Wi-Fi® evaluation platforms and software.
支援產品和硬體

支援產品和硬體

外掛程式

SIMPLELINK-SDK-WIFI-PLUGIN SimpleLink™ software development kit (SDK) Wi-Fi® plug-in

The SimpleLink SDK Wi-Fi Plug-in contains drivers, many sample applications for Wi-Fi features and internet, and documentation needed to use the CC3120 or CC3135 Internet-on-a-chip™ solutions. This Plug-in is a companion software package that enables the use of a Wi-Fi radio on any standard (...)

支援產品和硬體

支援產品和硬體

瀏覽 下載選項
軟體程式設計工具

EMBEDDED-PROGRAMMING — SimpleLink™ Wi-Fi® 嵌入式編程

每個板載嵌入式 CC3120/CC3220 裝置的產品,都必須連接一個序列快閃記憶體裝置。序列快閃記憶體必須進行格式化,並且至少需要編程為有必要軟體更新和額外功能的 Service Pack。以 CC3220 為例,在內部 MCU 處理器上執行的二進位映像也必須編程。序列快閃記憶體編程有多種現有選項:
  • Uniflash – 基於 PC 的公用程式,提供映像建立和編程。內容透過 UART 編程。
  • 無線傳輸編程 – 內容透過網路連接傳送。然而,這需要在生產過程中提前對序列快閃記憶體進行格式化。內容可透過主機介面(UART 或 SPI)編程。
  • 工業快閃記憶體編程 – 使用 Uniflash (...)
使用指南: PDF | HTML
軟體程式設計工具

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

支援產品和硬體

支援產品和硬體

啟動 下載選項
認證

SIMPLELINK-CC31XX-REPORTS Reports: CC31xx Regulatory Certification

Are you looking for CC3XXX certification support? SIMPLELINK-CC3XXX-CERTIFCATION provides the relevant information and support for successful certification of CC31XX, CC32XX, and CC33XX products. Within this page you will find the latest certification reports of our Modules as well as our (...)

支援產品和硬體

支援產品和硬體

認證

SIMPLELINK-CC3XXX-CERTIFICATION — SimpleLink™ CC3XXX 的無線電認證

您是否正在尋找 CC3XXX 認證支援?SIMPLELINK-CC3XXX-CERTIFCATION 提供相關資訊與支援,可協助 CC31XX、CC32XX 及 CC33XX 產品順利通過認證。在此頁面中,您將找到我們模組的最新認證報告以及我們為採用精簡晶片解決方案進行設計的客戶提供的評估板。
設計工具

SIMPLELINK-WIFI-DESIGN-REVIEWS — 適用於 SimpleLink™ Wi-Fi 裝置的硬體設計審查

CC3XXX Wi-Fi 硬體設計審查流程提供一對一接觸的方式,並由主題內容專家協助審查您的設計,為您提供寶貴的意見。  在要求審查之前,請務必檢閱技術文件及相應產品頁上提供的設計與開發資源。產品頁資源可能不再需要進行設計審查。

一般設計問題應張貼在我們的 E2E 討論區中,然後才能要求 Wi-Fi 硬體設計審查。

對於以 CC33xx 和 CC35xx 為架構的設計,請將設計檔案申請直接以電子郵件傳送至 connectivity-wifi-hw-reviews@list.ti.com。您可以從這些裝置的相關產品頁請求存取這些裝置的設計文件。

對於其他所有 CC3xxx (...)

使用指南: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
QFM (MOB) 63 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

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若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

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