產品詳細資料

Frequency range 76 - 81 GHz Number of receivers 3 Number of transmitters 2 ADC sampling rate (max) (Msps) 12.5 Arm CPU Arm Cortex-M4F at 160 MHz Interface type CAN-FD, I2C, LIN, QSPI, SPI, UART Hardware accelerators Radar hardware accelerator Edge AI enabled Edge AI Studio enabled, Yes RAM (kByte) 1024 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Compliant Power supply solution LP87524B-Q1, LP87524J-Q1, LP87524P-Q1, LP87702-Q1
Frequency range 76 - 81 GHz Number of receivers 3 Number of transmitters 2 ADC sampling rate (max) (Msps) 12.5 Arm CPU Arm Cortex-M4F at 160 MHz Interface type CAN-FD, I2C, LIN, QSPI, SPI, UART Hardware accelerators Radar hardware accelerator Edge AI enabled Edge AI Studio enabled, Yes RAM (kByte) 1024 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Compliant Power supply solution LP87524B-Q1, LP87524J-Q1, LP87524P-Q1, LP87702-Q1
FCCSP (AMF) 102 41.6025 mm² 6.45 x 6.45
  • FMCW Transceiver
    • Integrated PLL, transmitter, receiver, baseband and ADC
    • 76-81GHz coverage with 5GHz continuous bandwidth
    • 3 receive channels and 2 transmit channels
    • Short range
    • 11dBm typical output power per Tx
    • 14dB typical noise figure
    • -89dBc/Hz typical phase noise at 1MHz
    • FMCW operation
    • 5MHz IF bandwidth, real-only Rx channels
    • Ultra-accurate chirp engine based on fractional-N PLL
    • Per transmitter binary phase shifter
  • Processing elements
    • Arm M4F core with single precision FPU (160 MHz)
    • TI Radar Hardware Accelerator (HWA 1.2) for FFT, Log Magnitude, and CFAR operations (80MHz)
  • Supports multiple low-power modes
    • Idle mode and deep sleep mode
  • Power management
    • 1.8V and 3.3V IO support
    • Built-in LDO network for enhanced PSRR
    • BOM-Optimized and Power-Optimized modes
    • One or two power rails for 1.8V IO mode, two or three power rails for 3.3V IO mode
  • Package size of FCCSP device: 6.45mm x 6.45mm
  • Built-in calibration and self-test
    • Built-in firmware (ROM)
    • Self-Contained on chip calibration system
  • Host Interface
    • UART
    • CAN-FD
    • SPI
    • LIN
  • RDIF (Radar Data Interface) for raw ADC sample capture
  • Other interfaces available to user application
    • QSPI
    • I2C
    • JTAG
    • GPIOs
    • PWM Interface
  • Internal Memory
    • 1MB of On-Chip RAM
    • Configurable L3 shared memory for Radar Cube
    • Data and Code RAM of (512/640/768KB)
  • Functional Safety-Compliant Targeted
    • Developed for Functional Safety Applications
    • Hardware integrity up to ASIL B targeted
  • FCCSP package with 12 x 12, 102 BGA balls
  • AEC Q-100 Qualified
  • Clock source
    • 40.0MHz Crystal for primary clock
    • Supports externally driven clock (Square/Sine) at 40.0MHz
    • 32kHz internal oscillator for low power operations
  • Supports temperature operating range
    • Operating Junction Temperature Range: –40°C to 125°C
  • FMCW Transceiver
    • Integrated PLL, transmitter, receiver, baseband and ADC
    • 76-81GHz coverage with 5GHz continuous bandwidth
    • 3 receive channels and 2 transmit channels
    • Short range
    • 11dBm typical output power per Tx
    • 14dB typical noise figure
    • -89dBc/Hz typical phase noise at 1MHz
    • FMCW operation
    • 5MHz IF bandwidth, real-only Rx channels
    • Ultra-accurate chirp engine based on fractional-N PLL
    • Per transmitter binary phase shifter
  • Processing elements
    • Arm M4F core with single precision FPU (160 MHz)
    • TI Radar Hardware Accelerator (HWA 1.2) for FFT, Log Magnitude, and CFAR operations (80MHz)
  • Supports multiple low-power modes
    • Idle mode and deep sleep mode
  • Power management
    • 1.8V and 3.3V IO support
    • Built-in LDO network for enhanced PSRR
    • BOM-Optimized and Power-Optimized modes
    • One or two power rails for 1.8V IO mode, two or three power rails for 3.3V IO mode
  • Package size of FCCSP device: 6.45mm x 6.45mm
  • Built-in calibration and self-test
    • Built-in firmware (ROM)
    • Self-Contained on chip calibration system
  • Host Interface
    • UART
    • CAN-FD
    • SPI
    • LIN
  • RDIF (Radar Data Interface) for raw ADC sample capture
  • Other interfaces available to user application
    • QSPI
    • I2C
    • JTAG
    • GPIOs
    • PWM Interface
  • Internal Memory
    • 1MB of On-Chip RAM
    • Configurable L3 shared memory for Radar Cube
    • Data and Code RAM of (512/640/768KB)
  • Functional Safety-Compliant Targeted
    • Developed for Functional Safety Applications
    • Hardware integrity up to ASIL B targeted
  • FCCSP package with 12 x 12, 102 BGA balls
  • AEC Q-100 Qualified
  • Clock source
    • 40.0MHz Crystal for primary clock
    • Supports externally driven clock (Square/Sine) at 40.0MHz
    • 32kHz internal oscillator for low power operations
  • Supports temperature operating range
    • Operating Junction Temperature Range: –40°C to 125°C

The AWRL1432 mmWave Sensor device is an integrated single chip mmWave sensor based on FMCW radar technology. The device is capable of operation in the 76GHz to 81GHz band and is partitioned into mainly four power domains:

  • RF/Analog Sub-System: This block includes all the RF and Analog components required to transmit and receive the RF signals.
  • Front-End Controller sub-System (FECSS): FECSS contains processor, responsible for radar front-end configuration, control, and calibration.
  • Application Sub-System (APPSS): APPSS is where the device implements a user programmable ARM Cortex M4 allowing for custom control and automotive interface applications. Top Sub-System (TOPSS) is part of the APPSS power domain and contains the clocking and power management sub-blocks.
  • Hardware Accelerator (HWA): HWA block supplements the APPSS by offloading common radar processing such as FFT, Constant False Alarm rate (CFAR), scaling, and compression.

AWRL1432 is specifically designed to have separate controls for each of the above-mentioned power domains to control their states (power ON or OFF) based on use case requirements. The device also features the capability to exercise various low-power states like sleep and deep sleep, where low-power sleep mode is achieved by clock gating and by turning off the internal IP blocks of the device. The device also provides the option of keeping some contents of the device, like Application image or RF profile retained in such scenarios.

Additionally, the device is built with TI’s low power 45nm RF CMOS process and enables unprecedented levels of integration in an extremely small form factor. AWRL1432 is designed for low power, self-monitored, ultra-accurate radar systems in the automotive space for applications like blind spot detection, kick-to-open, parking assist, and door obstacle detection.

The AWRL1432 mmWave Sensor device is an integrated single chip mmWave sensor based on FMCW radar technology. The device is capable of operation in the 76GHz to 81GHz band and is partitioned into mainly four power domains:

  • RF/Analog Sub-System: This block includes all the RF and Analog components required to transmit and receive the RF signals.
  • Front-End Controller sub-System (FECSS): FECSS contains processor, responsible for radar front-end configuration, control, and calibration.
  • Application Sub-System (APPSS): APPSS is where the device implements a user programmable ARM Cortex M4 allowing for custom control and automotive interface applications. Top Sub-System (TOPSS) is part of the APPSS power domain and contains the clocking and power management sub-blocks.
  • Hardware Accelerator (HWA): HWA block supplements the APPSS by offloading common radar processing such as FFT, Constant False Alarm rate (CFAR), scaling, and compression.

AWRL1432 is specifically designed to have separate controls for each of the above-mentioned power domains to control their states (power ON or OFF) based on use case requirements. The device also features the capability to exercise various low-power states like sleep and deep sleep, where low-power sleep mode is achieved by clock gating and by turning off the internal IP blocks of the device. The device also provides the option of keeping some contents of the device, like Application image or RF profile retained in such scenarios.

Additionally, the device is built with TI’s low power 45nm RF CMOS process and enables unprecedented levels of integration in an extremely small form factor. AWRL1432 is designed for low power, self-monitored, ultra-accurate radar systems in the automotive space for applications like blind spot detection, kick-to-open, parking assist, and door obstacle detection.

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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet AWRL1432 Single-Chip 76- to 81-GHz Automotive Radar Sensor datasheet (Rev. B) PDF | HTML 2024年 6月 13日
* Errata AWRL1432 Device Errata (Rev. B) PDF | HTML 2026年 1月 5日
Technical article The finalized configuration for xwrLx432 motion/presence detection demo and custom output of detection results PDF | HTML 2026年 1月 23日
User guide AWRL6432, IWRL6432, AWRL1432, IWRL1432 Technical Reference Manual (Rev. C) 2025年 5月 22日
Application note Getting Started with mmWave Sensors PDF | HTML 2025年 3月 12日
Application note Calibrations in TI Low-Power mmWave Radar Sensors (Rev. B) PDF | HTML 2025年 2月 3日
Application note Flash Variants Supported by the mmWave Sensor (Rev. G) PDF | HTML 2024年 12月 17日
User guide xWRLx432 Bootloader Flow and Warm Reset Recommendations (Rev. A) PDF | HTML 2024年 9月 30日
Functional safety information Design Guide for Functional Safety Compliant Systems using mmWave Radar Sensors (Rev. A) PDF | HTML 2024年 4月 4日
Technical article How 77-GHz mmWave radar sensors overcome the challenges of kick-to-open systems PDF | HTML 2024年 1月 5日
Technical article Why low-power mmWave radar is better than ultrasonic in parking assistance applications PDF | HTML 2024年 1月 5日
Technical article Bringing 77-GHz radar sensors to automotive and industrial applications PDF | HTML 2024年 1月 4日
Certificate AWRL1432BOOST EVM EU Declaration of Conformity (DoC) 2023年 7月 5日
Application note mmWave Radar Radome Design Guide PDF | HTML 2021年 8月 17日

設計與開發

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開發板

AWRL1432BOOST — 適用於單晶片低功率 76-GHz 至 81-GHz 車用雷達感測器的 AWRL1432 評估模組

AWRL1432BOOST 是以 AWRL1432 mmWave 雷達感測器為基礎,配備板載 ROGERS RO4835 LoPRO 型天線且使用方便的 77-GHz mmWave 感測器評估套件。此電路板可存取點雲資料及 USB 供電介面。AWRL1432BOOST 支援與 DCA1000EVM 開發套件直接連接。 

此套件受 mmWave 工具、示範與軟體支援,包括 mmWave 軟體開發套件 (MMWAVE-MCUPLUS-SDK) 和 TI 的 Code Composer Studio (CCS)。

可使用其他電路板來啟用其他功能。例如 DCA1000EVM 可存取感測器的原始 ADC (...)

使用指南: PDF | HTML
TI.com 無法提供
開發板

AWRL1432BOOST-BSD — 適用於盲點偵測的 AWRL1432 單晶片 mmWave 感測器評估板

AWRL1432BOOST-BSD 是一款易於使用的 70GHz mmWave 感測器評估套件,以具有板載 ROGERS RO3003 高性能天線的 AWRL1432 裝置為基礎。此電路板可存取點雲資料及 USB 供電介面。AWRL1432BOOST-BSD 支援與 DCA1000EVM 開發套件直接連接。AWRL1432BOOST-BSD 也具有適用於汽車應用的 12V 供電 TCAN4550。

此套件受 mmWave 工具、示範與軟體支援,包括 mmWave 軟體開發套件 (mmwave_mcuplus_sdk) 和 TI 的 Code Composer Studio (...)

使用指南: PDF | HTML
TI.com 無法提供
開發板

D3-3P-DESIGNCORE-RADAR — D3 Embedded DesignCore® 雷達評估模組

D3 Embedded 推出的微型感測器、感測器評估板和感測器融合裝置,可運用我們的 mmWave 雷達技術快速評估 D3 Embedded 雷達模組。這些感測器可輕鬆整合針對工業應用的雷達演算法。產品範圍包括彈性 60GHz 與 77GHz 模組、封裝微型天線 (AoP) 60GHz 與 77GHz 模組,以及玻璃纖維 60GHz(未來包括 77GHz)微型天線模組。

從:D3 Embedded
開發板

VENTROPIC-3P-NF-RADAR — 適用於 mmWave 雷達感測器的 VENTROPIC-NF 雷達模組

VENTROPIC-RPI is a radar development module that integrates Bluetooth and Wi-Fi communication functions, simplifying the development and market entry process for customer products. The built-in firmware supports various algorithms for smart home, elderly care, medical health, and other scenarios (...)

使用指南: PDF
偵錯探測器

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

硬體程式設計工具

HS-3P-77-3D-WGA-LOP-4X4 — HUBER+SUHNER ADAS 雷達感測器的天線設計

77GHz 3D 波導天線 4Tx4R - RF 無需基板解決方案系列

HUBER+SUHNER 開發並製造了第二代 3D 金屬化塑膠波導天線,專為 RF 無需基板解決方案設計。這項以專屬介面實現的尖端技術,支援新一代高密度封裝發射 (LOP) 單體微波積體電路 (MMIC),以 4TX、4RX 配置通道涵蓋完整的車用 77GHz 雷達頻帶(76GHz 至 81GHz),且具備 125mm2 的小巧連接埠面積。天線設計可大幅縮減 MMIC 封裝尺寸,同時強化傳輸功率、接收器靈敏度,並維持高隔離等級,即使組裝公差偏大也不例外。

Third-party accessory

GAPW-3P-ANTENNA — GapWaves ADAS 雷達感測器的天線設計

Gapwaves offers high-performance, low-loss, and cost-efficient waveguide antennas for short-, mid- and long-range automotive radars and industrial applications. Our antennas feature a flexible design and a compact form factor, robust contact-free PCB integration and support contact-free LoP (...)

從:Gapwaves
軟體開發套件 (SDK)

MMWAVE-L-SDK mmWave SDK for xWRL6432, IWRL6432AOP, IWRL6432W and xWRL1432

The mmWave low-power software development kit (SDK) is a collection of software packages that enable application evaluation and development on our low-power mmWave sensors. This tool includes MMWAVE-L-SDK and MMWAVE-L-SDK-6 companion packages to support customer design needs.

MMWAVE-L-SDK and (...)

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應用軟體及架構

PVIZ-3P-MIMSO — Provizio 5D MIMSO® 雷達軟體

Provizio MIMSO 是一款雷達成像強化解決方案,可將高解析度雷達資料轉換為密集,高傳真的 3D 環境感知。透過使用主動式天線架構和先進的訊號處理技術, MIMSO 可大幅提高角解析度和點雲密度,進而在複雜駕駛情境中改善物體的偵測,分離和追蹤。
 

此解決方案設計可與我們的 AWR2944 雷達感知器整合,使開發人員能結合高效能雷達硬體與 Provizio 的 MIMSO 主動式天線及處理技術。MIMSO 與 AWR2944 型雷達系統配對時,可透過提供更高解析度的雷達感知,協助加速自動與進階駕駛輔助應用的開發,同時維持系統成本效率。

從:Provizio Ltd
開發模組 (EVM) 的 GUI

MMWAVE-SENSING-ESTIMATOR-CLOUD mmWave sensing estimator cloud development on TI Resource Explorer

The mmWave Sensing Estimator is a web-based configuration tool for TI radar sensors
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快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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IDE、配置、編譯器或偵錯程式

MMWAVE-STUDIO-3G mmWave studio GUI tools for third-generation parts (xWRLx432)

MMWAVE-STUDIO is a stand-alone Windows® GUI that provides the ability to configure and control mmWave sensor modules and collect analog-to-digital (ADC) data for offline analysis. ADC data capture is intended to enable evaluation and characterization of radio-frequency (RF) performance, (...)

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線上培訓

RADAR-ACADEMY mmWave Radar Academy

The Radar Academy is a documentation package intended to provide educational resources related to mmWave radar technology
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軟體程式設計工具

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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支援軟體

RADAR-TOOLBOX Radar evaluation and development support package with example projects, documentation and tools

The Radar Toolbox is a collection of demos, software tools, and documentation designed to assist in the evaluation of TI Radar Devices
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模擬型號

BSDL Model – AWRL1432

SWRM052.ZIP (1 KB) - BSDL Model
模擬型號

IBIS Model - AWRL1432

SWRM054.ZIP (2295 KB) - IBIS Model
Gerber 檔案

xWRL1432BOOST-BSD Design Database Files

SWRC390.ZIP (28947 KB)
配置圖

HW design checklist for xWRL1432

SPRR508.ZIP (5825 KB)
參考設計

TIDEP-01034 — 使用 mmWave 雷達的入門級盲點偵測參考設計

此參考設計提供角落雷達應用的基礎,運用 AWRL1432BOOST-BSD 評估模組以符合入門級盲點偵測 (BSD) 需求。此設計讓使用者能在 120 公尺範圍內,評估並追蹤物體的位置 (在方位角平面) 與速度。
Design guide: PDF
參考設計

TIDEP-01036 — mmWave 雷達感測器腳踢開啟參考設計

此設計可為以 TI 單晶片 77GHz 車用雷達感測器 AWRL1432 為基礎的腳踢開啟 (KTO) 終端應用,提供低成本的小型參考。AWRL1432 裝置執行以機器學習為基礎的手勢感測演算法,可進行踢蹴偵測,以啟動汽車的電動升降門、電動後車廂或電動滑動門。
Design guide: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCCSP (AMF) 102 Ultra Librarian

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  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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