홈 무선 연결 저전력 2.4GHz 제품
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저전력 2.4GHz 제품
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CC2755P10

활성

EdgeAI, 보안, 최대 +20dBm, 1µA 미만의 대기 전류를 지원하는 SimpleLink™ Arm® Cortex®-M33 무선 MCU

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CC2755P10

활성
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제품 상세 정보

CPU core Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 1024 RAM (kByte) 162 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125 Hardware accelerators CDE NPU Edge AI enabled Edge AI Studio enabled, Yes
CPU core Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 1024 RAM (kByte) 162 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125 Hardware accelerators CDE NPU Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RHA) 40 36 mm² 6 x 6
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Matter
  • Zigbee 3.0 Certified
  • Thread
  • Proprietary systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm
    • IEEE 802.15.4 (2.4GHz): –103dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • 3.5mm × 3.4mm WCSP (Preview)
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Matter
  • Zigbee 3.0 Certified
  • Thread
  • Proprietary systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm
    • IEEE 802.15.4 (2.4GHz): –103dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • 3.5mm × 3.4mm WCSP (Preview)

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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3개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet CC2755x10 SimpleLink Family of 2.4GHz High Performance Wireless MCUs datasheet (Rev. D) PDF | HTML 2025/12/12
* Errata Errata CC2755x10 SimpleLink™ Wireless MCU Device Revision F PDF | HTML 2025/07/11
* User guide CC27xx Technical Reference Manual (Rev. A) PDF | HTML 2025/05/19

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LP-EM-CC2745R10-Q1 — CC2745R10-Q1 SimpleLink™ 2.4GHz 무선 MCU용 LaunchPad™ 개발 키트

이 LaunchPad™ 개발 키트는 2.4GHz 작동을 위한 일체형 전력 증폭기 및 무선 지원을 갖춘 장치에서 개발 속도를 높여줍니다. LaunchPad에는 차량용 애플리케이션을 위해 Bluetooth® 저에너지(5.3 및 향후 버전)를 지원하는 AEC-Q100 준수 무선 마이크로컨트롤러(MCU)가 장착되어 있습니다. 이 키트는 분할 LaunchPad™ 개발 키트이며, 따라서 XDS 디버거가 포함되어 있지 않습니다. 권장 디버거는 LP-XDS110 or LP-XDS110ET입니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
디버그 프로브

TMDSEMU110-U — XDS110 JTAG 디버그 프로브

텍사스 인스트루먼트 XDS110은 TI 임베디드 프로세서를 위한 새로운 디버그 프로브(에뮬레이터)입니다. XDS110은 XDS100 제품군을 대체하면서 하나의 포드로 더 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을지원합니다. 또한 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)가 포함되어 있는 모든 Arm® 및 DSP 프로세서에서 코어(Core) 및 시스템 트레이스(System Trace)를 지원합니다.  핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

(...)
사용 설명서: PDF
Download English Version: PDF
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개발 키트

LP-XDS110 — XDS110 LaunchPad™ 개발 키트 디버거

LP-XDS110 LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110은 20핀 엣지 커넥터를 통해 분할 LaunchPad에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다.

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개발 키트

LP-XDS110ET — XDS110ET LaunchPad™ 개발 키트 디버거(EnergyTrace™ 소프트웨어 포함)

LP-XDS110ET LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110ET는 20핀 엣지 커넥터를 통해 분할 LaunchPad 개발 키트에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 개발 키트 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다. LP-XDS110ET는 EnergyTrace™ 소프트웨어를 지원하기 위해 전력 측정용 회로를 추가했습니다.

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소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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찾아보기 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

Edge AI Studio is a collection of graphical and command line tools designed to accelerate edge AI development on TI processors, microcontrollers and radar sensors. Whether developing a proof of concept using a model from the TI Model Zoo or leveraging your own model, Edge AI Studio provides the (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
지원 소프트웨어

SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
VQFN (RHA) 40 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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