AM13E23019

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200MHz Arm® Cortex®-M33 real-time motor control MCU with edge AI, TMU, 512KB flash, security

제품 상세 정보

CPU Arm® Cortex®-M33 Frequency (MHz) 200 Flash memory (kByte) 512 RAM (kByte) 128 ADC type 3 12-bit SAR Features AES encryption, Automation, CAN FD, CRC, Comparator, DAC, DMA, Robotics UART 6 CAN (#) 1, CAN-FD PWM (Ch) 30 TI functional safety category Functional Safety-Compliant Number of ADC channels 21, 22, 26, 27, 39, 43, 44 SPI 4 QEP 3 Operating temperature range (°C) -40 to 105 Rating Catalog Communication interface CAN, CAN-FD, I2C, LIN, SMbus, SPI, UART Operating system BareMetal (No OS), FreeRTOS, Zephyr RTOS Hardware accelerators Floating point unit, TinyEngine™ NPU, Trigonometric math accelerator Edge AI enabled Edge AI Studio enabled, Yes Security Cryptographic acceleration, Secure boot, Secure debug, Secure firmware & software update, Software IP protection
CPU Arm® Cortex®-M33 Frequency (MHz) 200 Flash memory (kByte) 512 RAM (kByte) 128 ADC type 3 12-bit SAR Features AES encryption, Automation, CAN FD, CRC, Comparator, DAC, DMA, Robotics UART 6 CAN (#) 1, CAN-FD PWM (Ch) 30 TI functional safety category Functional Safety-Compliant Number of ADC channels 21, 22, 26, 27, 39, 43, 44 SPI 4 QEP 3 Operating temperature range (°C) -40 to 105 Rating Catalog Communication interface CAN, CAN-FD, I2C, LIN, SMbus, SPI, UART Operating system BareMetal (No OS), FreeRTOS, Zephyr RTOS Hardware accelerators Floating point unit, TinyEngine™ NPU, Trigonometric math accelerator Edge AI enabled Edge AI Studio enabled, Yes Security Cryptographic acceleration, Secure boot, Secure debug, Secure firmware & software update, Software IP protection
LQFP (PM) 64 144 mm² 12 x 12 LQFP (PZ) 100 256 mm² 16 x 16 TQFP (PDT) 128 256 mm² 16 x 16
  • Device Cores
    • Arm Cortex-M33 32-bit CPU up to 200MHz
      • Floating Point Unit (FPU), Custom Datapath Extension (CDE), Memory Protection Unit (MPU) and Micro Trace Buffer (MTB)
      • DSP Extension and 32-bit Trigonometric Math Unit (TMU) accelerates trigonometric calculations
      • DMIPS=310 and Coremark=800
    • 1x TinyEngineTM Neural-Network Processing Unit (NPU) optimized for time-series Edge AI enablement
  • Memories
    • Up to 512kB (2 banks of up to 256kB, 1kB sectors) of non-volatile flash memory
      • 144-bit word with Error Correction Code
      • Bank swap for dual-image firmware
    • Up to 128kB of 0-wait state SRAM
      • Hardware parity and 1kB instruction cache
    • External Peripheral Interface (EPI) supporting SDRAM, ASRAM, or ASIC/FPGA external interfaces
  • High-Performance Analog Peripherals
    • 3x SAR Analog-to-digital Converters (ADCs)
      • 6.67MSPS with 12-bit resolution
      • Each ADC supports up to 32 channels
      • Configurable 1.65V or 2.5V internal shared voltage reference (VREF)
      • Support for external voltage reference (VREF)
      • Hardware oversampling and undersampling modes, with accumulation, averaging and outlier rejection
    • 4x Analog Comparator Sub-systems (CMPSS)
      • 2x Comparators with Window Functionality
      • 2x 10-bit effective DAC and 2x digital filters
      • CMPSS[2:3] support buffered DACL_OUT to pin
    • 3x Programmable Gain Amplifiers (PGA)
      • Unity Gain Support
      • Inverting and non-inverting gain mode support
      • Gain options: 1, 2/-1, 4/-3, 8/-7, 16/-15, 32/-31, 64/-63
      • 4:1 input mux supporting up to 12 channels
      • Programmable output filtering
    • Programmable analog connections between ADC, PGAs, CMPSS and DAC
  • Optimized Low-Power Modes
    • RUN: 49mA @ 200MHz
    • STANDBY: 1.84mA with CPU execution resume and 32kB SRAM retention
    • SHUTDOWN: <5µA with IO wake-up capability
  • Flexible System Peripherals
    • 12-channel Data Movement Architecture (DMA) controller
    • Nested Vectored Interrupt Controller (NVIC)
    • Up to 107 GPIO with Input/Output XBAR connectivity
    • 8 GPIOs with Shutdown Wakeup Capability
    • 1x Windowed Watchdog Timer (WWDT)
      • Independent 32kHz clock with programmable divider
      • 25-bit counter with configurable timer periods
    • 2x general-purpose timers
      • TIMG4 (32-bit), TIMG12 (16-bit)
      • Pre-scaler, Compare/Capture, Shadow
      • Up to 2x channels each
  • Real-time Control Peripherals
    • 5x Motor Control Pulse Width Modulation (MCPWM) modules
      • 6 PWM channels per module with 16-bit time base
      • 4 Start Of Conversion (SOCs) per module enable precise ADC sampling for single shunt or three shunt current sensing mode
      • Support dead-band, trip event and time base synchronization
    • 2x Enhanced Capture (eCAP) modules
      • 32-bit timer for speed, elapsed time, period and duty cycle measurements
      • 1x alternative PWM channel per module
    • 3x Enhanced Quadrature Encoder Pulse (eQEP)
      • Supports linear or rotary incremental encoder interface
      • Edge capture unit for optimized speed measurement at low speed
    • Device Crossbars (INPUTXBAR, OUTPUTXBAR, PWMXBAR)
      • Flexibility to route signals from GPIO to other modules
      • For example, the INPUTXBAR is used to route signals from a GPIO to other modules such as ADC, CMPSS, MCPWM, eCAP, eQEP, and external interrupts

  • Enhanced Serial Communication Interfaces
    • Two configurable serial interfaces supporting UART (LIN) or I2C (SMBus/PMBus)
    • Four configurable serial interfaces supporting UART, I2C, or SPI
    • One Modular Controller Area Network (MCAN) with Flexible Data-rate (CAN FD)

  • Clock System
    • Internal 4MHz/32MHz oscillator (SYSOSC)
    • Internal 32kHz oscillator (LFOSC)
    • System Phase-locked loop (SYSPLL) up to 200MHz
    • External 4MHz to 25MHz crystal oscillator (XTAL)
    • External 4MHz to 48MHz clock input (HFCLK)
  • OS Support
    • FreeRTOS, Zephyr, Baremetal
  • Safety
    • Enabling IEC61508 SIL-2 and SIL-3 systems
  • Data Integrity and Encryption
    • Secure Boot/FWU/Debug/JTAG Lock
    • Secure Key Storage and Management
    • Privileged/Non-Privileged resource partitioning
    • Flash Write/Erase/Hide Protections
    • Device Life cycle Management
    • AES Encryption with 128- or 256-bit Key
    • Unique Identification Number (UID)
  • Internal Diagnostic Modules
    • Cyclic Redundancy Checker (CRC-16, CRC-32)
    • Integrated Temperature Sensor
    • Integrated BOR/POR Supply Monitors
  • Development Support
    • JTAG (4-pin) and Serial Wire Debug (SWD) (2-pin)
    • Micro Trace Buffer (MTB)
    • Embedded Trace Macrocell (ETM) (TRACE_DATA[0:3])
      • Supports Serial Trace and Parallel Trace
  • Package Options
    • 128-pin PDT Thin Quad Flat Package (TQFP) (0.4mm pitch)
    • 100-pin PZ Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 80-pin PN Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 64-pin PM Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 48-pin PT Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 48-pin RGZ Very Thin Quad Flatpack No-Lead (VQFN) (0.5mm pitch)
  • Operating Characteristics
    • Supply voltage: 3.3V
    • Ambient Temperature Range(TA): –40°C up to 105°C
  • Device Cores
    • Arm Cortex-M33 32-bit CPU up to 200MHz
      • Floating Point Unit (FPU), Custom Datapath Extension (CDE), Memory Protection Unit (MPU) and Micro Trace Buffer (MTB)
      • DSP Extension and 32-bit Trigonometric Math Unit (TMU) accelerates trigonometric calculations
      • DMIPS=310 and Coremark=800
    • 1x TinyEngineTM Neural-Network Processing Unit (NPU) optimized for time-series Edge AI enablement
  • Memories
    • Up to 512kB (2 banks of up to 256kB, 1kB sectors) of non-volatile flash memory
      • 144-bit word with Error Correction Code
      • Bank swap for dual-image firmware
    • Up to 128kB of 0-wait state SRAM
      • Hardware parity and 1kB instruction cache
    • External Peripheral Interface (EPI) supporting SDRAM, ASRAM, or ASIC/FPGA external interfaces
  • High-Performance Analog Peripherals
    • 3x SAR Analog-to-digital Converters (ADCs)
      • 6.67MSPS with 12-bit resolution
      • Each ADC supports up to 32 channels
      • Configurable 1.65V or 2.5V internal shared voltage reference (VREF)
      • Support for external voltage reference (VREF)
      • Hardware oversampling and undersampling modes, with accumulation, averaging and outlier rejection
    • 4x Analog Comparator Sub-systems (CMPSS)
      • 2x Comparators with Window Functionality
      • 2x 10-bit effective DAC and 2x digital filters
      • CMPSS[2:3] support buffered DACL_OUT to pin
    • 3x Programmable Gain Amplifiers (PGA)
      • Unity Gain Support
      • Inverting and non-inverting gain mode support
      • Gain options: 1, 2/-1, 4/-3, 8/-7, 16/-15, 32/-31, 64/-63
      • 4:1 input mux supporting up to 12 channels
      • Programmable output filtering
    • Programmable analog connections between ADC, PGAs, CMPSS and DAC
  • Optimized Low-Power Modes
    • RUN: 49mA @ 200MHz
    • STANDBY: 1.84mA with CPU execution resume and 32kB SRAM retention
    • SHUTDOWN: <5µA with IO wake-up capability
  • Flexible System Peripherals
    • 12-channel Data Movement Architecture (DMA) controller
    • Nested Vectored Interrupt Controller (NVIC)
    • Up to 107 GPIO with Input/Output XBAR connectivity
    • 8 GPIOs with Shutdown Wakeup Capability
    • 1x Windowed Watchdog Timer (WWDT)
      • Independent 32kHz clock with programmable divider
      • 25-bit counter with configurable timer periods
    • 2x general-purpose timers
      • TIMG4 (32-bit), TIMG12 (16-bit)
      • Pre-scaler, Compare/Capture, Shadow
      • Up to 2x channels each
  • Real-time Control Peripherals
    • 5x Motor Control Pulse Width Modulation (MCPWM) modules
      • 6 PWM channels per module with 16-bit time base
      • 4 Start Of Conversion (SOCs) per module enable precise ADC sampling for single shunt or three shunt current sensing mode
      • Support dead-band, trip event and time base synchronization
    • 2x Enhanced Capture (eCAP) modules
      • 32-bit timer for speed, elapsed time, period and duty cycle measurements
      • 1x alternative PWM channel per module
    • 3x Enhanced Quadrature Encoder Pulse (eQEP)
      • Supports linear or rotary incremental encoder interface
      • Edge capture unit for optimized speed measurement at low speed
    • Device Crossbars (INPUTXBAR, OUTPUTXBAR, PWMXBAR)
      • Flexibility to route signals from GPIO to other modules
      • For example, the INPUTXBAR is used to route signals from a GPIO to other modules such as ADC, CMPSS, MCPWM, eCAP, eQEP, and external interrupts

  • Enhanced Serial Communication Interfaces
    • Two configurable serial interfaces supporting UART (LIN) or I2C (SMBus/PMBus)
    • Four configurable serial interfaces supporting UART, I2C, or SPI
    • One Modular Controller Area Network (MCAN) with Flexible Data-rate (CAN FD)

  • Clock System
    • Internal 4MHz/32MHz oscillator (SYSOSC)
    • Internal 32kHz oscillator (LFOSC)
    • System Phase-locked loop (SYSPLL) up to 200MHz
    • External 4MHz to 25MHz crystal oscillator (XTAL)
    • External 4MHz to 48MHz clock input (HFCLK)
  • OS Support
    • FreeRTOS, Zephyr, Baremetal
  • Safety
    • Enabling IEC61508 SIL-2 and SIL-3 systems
  • Data Integrity and Encryption
    • Secure Boot/FWU/Debug/JTAG Lock
    • Secure Key Storage and Management
    • Privileged/Non-Privileged resource partitioning
    • Flash Write/Erase/Hide Protections
    • Device Life cycle Management
    • AES Encryption with 128- or 256-bit Key
    • Unique Identification Number (UID)
  • Internal Diagnostic Modules
    • Cyclic Redundancy Checker (CRC-16, CRC-32)
    • Integrated Temperature Sensor
    • Integrated BOR/POR Supply Monitors
  • Development Support
    • JTAG (4-pin) and Serial Wire Debug (SWD) (2-pin)
    • Micro Trace Buffer (MTB)
    • Embedded Trace Macrocell (ETM) (TRACE_DATA[0:3])
      • Supports Serial Trace and Parallel Trace
  • Package Options
    • 128-pin PDT Thin Quad Flat Package (TQFP) (0.4mm pitch)
    • 100-pin PZ Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 80-pin PN Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 64-pin PM Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 48-pin PT Low-profile Quad Flat Pack (LQFP) (0.5mm pitch)
    • 48-pin RGZ Very Thin Quad Flatpack No-Lead (VQFN) (0.5mm pitch)
  • Operating Characteristics
    • Supply voltage: 3.3V
    • Ambient Temperature Range(TA): –40°C up to 105°C

AM13E230x microcontrollers (MCUs) are part of the AM13x highly integrated, low-cost 32-bit MCU family based on the Arm® Cortex®-M33 32-bit CPU operating at up to 200MHz frequency. These real-time control optimized MCUs offer high-performance analog, control, and digital peripheral integration, support ambient temperature ranges from -40°C to 105°C, and operate with a 3.3V supply voltage.

The AM13E230x MCUs provide up to 512KB of embedded flash program memory (2 banks of up to 256KB) with built-in error correction code (ECC) and up to 128KB SRAM with hardware parity. Smaller memory configuration variants are offered.

The processing system incorporates Custom Datapath Extension (CDE) support, a Memory Protection Unit (MPU), Micro Trace Buffer (MTB), a 32-bit Trigonometric Math Unit (TMU), and a TinyEngineTM Neural-network Processing Unit (NPU).

AM13E230x MCUs are enabled with robust, high-performance analog peripherals. Three 12-bit ADCs with a maximum sampling rate of 6.67MSPS, four high speed comparator subsystems with built-in 10-bit reference DACs, and three programmable gain amplifiers with 4:1 mux provide true real-time signal chain performance.

These MCUs also offer real-time control and timing peripherals such as a 12-channel DMA controller, multi-channel PWM generation, generic timers, specialty timers for capture and encoder interface, and a flexible X-BAR system for connecting GPIO and control peripherals.

An independent oscillator and windowed watchdog timer are included as well as multiple internal and external clocking options. Multiple operational power modes are offered for flexibility in controlling power consumption vs. wake-up time.

Data integrity and encryption features (AES, secure boot) provide security across the AM13E230x domains. A Cyclic Redundancy Checker (CRC) module provides internal diagnostics to the AM13E230x MCUs.

Enhanced communication interfaces are supported through one MCAN and up to 6 UNICOMM peripherals to support a combination of UART/LIN, I2C/SMBUS, and SPI. For connecting to external devices or memory, the high-speed External Peripheral Interface (EPI) can connect to SDRAM or asynchronous RAM devices such as FPGA or ASIC.

Package options include 48-pin QFN as well as 48/64/80/100/128-pin QFP.

AM13E230x microcontrollers (MCUs) are part of the AM13x highly integrated, low-cost 32-bit MCU family based on the Arm® Cortex®-M33 32-bit CPU operating at up to 200MHz frequency. These real-time control optimized MCUs offer high-performance analog, control, and digital peripheral integration, support ambient temperature ranges from -40°C to 105°C, and operate with a 3.3V supply voltage.

The AM13E230x MCUs provide up to 512KB of embedded flash program memory (2 banks of up to 256KB) with built-in error correction code (ECC) and up to 128KB SRAM with hardware parity. Smaller memory configuration variants are offered.

The processing system incorporates Custom Datapath Extension (CDE) support, a Memory Protection Unit (MPU), Micro Trace Buffer (MTB), a 32-bit Trigonometric Math Unit (TMU), and a TinyEngineTM Neural-network Processing Unit (NPU).

AM13E230x MCUs are enabled with robust, high-performance analog peripherals. Three 12-bit ADCs with a maximum sampling rate of 6.67MSPS, four high speed comparator subsystems with built-in 10-bit reference DACs, and three programmable gain amplifiers with 4:1 mux provide true real-time signal chain performance.

These MCUs also offer real-time control and timing peripherals such as a 12-channel DMA controller, multi-channel PWM generation, generic timers, specialty timers for capture and encoder interface, and a flexible X-BAR system for connecting GPIO and control peripherals.

An independent oscillator and windowed watchdog timer are included as well as multiple internal and external clocking options. Multiple operational power modes are offered for flexibility in controlling power consumption vs. wake-up time.

Data integrity and encryption features (AES, secure boot) provide security across the AM13E230x domains. A Cyclic Redundancy Checker (CRC) module provides internal diagnostics to the AM13E230x MCUs.

Enhanced communication interfaces are supported through one MCAN and up to 6 UNICOMM peripherals to support a combination of UART/LIN, I2C/SMBUS, and SPI. For connecting to external devices or memory, the high-speed External Peripheral Interface (EPI) can connect to SDRAM or asynchronous RAM devices such as FPGA or ASIC.

Package options include 48-pin QFN as well as 48/64/80/100/128-pin QFP.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
7개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet AM13E230x Microcontrollers datasheet PDF | HTML 2026/02/25
* Errata AM13E230x Errata PDF | HTML 2026/01/13
User guide AM13E230x Microcontrollers Technical Reference Manual (Rev. A) PDF | HTML 2026/04/02
User guide AM13E230x Bootloader User Guide PDF | HTML 2026/03/12
Application note AM13E230x Hardware Design Guidelines PDF | HTML 2026/03/12
User guide STM32G4 to AM13E230 Migration Guide PDF | HTML 2026/03/12
Application brief Achieving edge AI-enabled motor control in industrial automation and smart home appliance designs (Rev. A) PDF | HTML 2026/03/10

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LP-AM13E230 — AM13E230xx LaunchPad™ 개발 키트

LP-AM13E230 EVM은 텍사스 인스트루먼트 AM13E230x 실시간 MCU(마이크로컨트롤러) 시리즈용으로 특별히 설계된 비용 최적화 EVM(평가 모듈)입니다. 이 보드는 64핀 AM13E23019GTPMR 장치를 사용하며, 제어, 아날로그, 통신 인터페이스와 함께 통합된 비휘발성 메모리 등 주요 주변 기능을 선보입니다. 또한 BoosterPack 호환 확장 커넥터(40핀), 5V 인코더 인터페이스(eQEP) 커넥터, 전원 도메인 절연, CAN-FD 트랜시버, 온 보드 XDS110 디버그 프로브를 제공합니다. 이 EVM은 (...)
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
소프트웨어 개발 키트(SDK)

AM13E2X-SDK SDK for AM13E2x Devices

The AM13E2 MCU SDK provides easy setup and fast out-of-the-box access to examples, drivers, common APIs, benchmarks and demonstrations – accelerating application development schedules.

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

찾아보기 다운로드 옵션
평가 모듈(EVM)용 GUI

MOTORCONTROL-WORKBENCH-GUI — TI 마이크로컨트롤러를 사용하여 모터를 구성하고 튜닝하는 제로 코드 그래픽 툴

MotorControl Workbench는 신규 사용자가 신속하게 모터 제어 솔루션을 평가하고 자체 모터를 구현 및 구성할 수 있게 해 주는 툴 모음입니다.

MotorControl Workbench는 여러 TI MCU 및 레퍼런스 설계의 간단하고 빠른 평가를 지원합니다. MCU 신호 감시, 가상 오실로스코프 및 SysConfig와 같은 여러 독립형 툴을 활용하는 이 단일 GUI 툴은 구성, 코드 생성, 디버그 및 다양한 모터 컨트롤 애플리케이션 튜닝에 도움이 됩니다. 시스템 솔루션은 추가 소프트웨어 제품 없이도 사용자 지정할 수 (...)

IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

EDGE-AI-STUDIO-MCU Edge AI Studio for Microcontrollers

Edge AI Studio is part of the CCStudio™ development tool ecosystem.  Edge AI Studio is a collection of graphical and command line tools designed to accelerate edge AI development on TI processors, microcontrollers, connectivity devices and radar sensors.  It supports both AI-accelerated (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
시뮬레이션 모델

AM13E23019 BSDL Model

SPRM889.ZIP (22 KB) - BSDL Model
시뮬레이션 모델

AM13E23019 IBIS Model

SPRM888.ZIP (4105 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
LQFP (PM) 64 Ultra Librarian
LQFP (PZ) 100 Ultra Librarian
TQFP (PDT) 128 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

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품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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