제품 상세 정보

Processor Arm® Cortex®-M33 Type Wireless MCU Technology Bluetooth® LE, Wi-Fi Protocols Qualified against Bluetooth® Core 5.4, Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS Certifications Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 20 Features 2M PHY, 802.11ax, AP, COEX, Coded PHY, Extended advertising, LE Secure Connections, STA Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG
Processor Arm® Cortex®-M33 Type Wireless MCU Technology Bluetooth® LE, Wi-Fi Protocols Qualified against Bluetooth® Core 5.4, Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS Certifications Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 20 Features 2M PHY, 802.11ax, AP, COEX, Coded PHY, Extended advertising, LE Secure Connections, STA Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG
VQFN (RSH) 56 49 mm² 7 x 7

Microcontroller

  • Powerful 160MHz Arm Cortex-M33 processor with FPU, TrustZone, and AI acceleration
  • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption
  • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code execution performance
  • 1.1MB embedded SRAM including 128KB TCM for Wi-Fi™, Bluetooth Low Energy, networking, and application data

Peripherals

  • Up to 38 I/Os with flexible multiplexing options
  • 8 × general-purpose timers and pulse-width modulation (PWM)
  • 3 × universal asynchronous receiver-transmitter (UART)
  • 2 × Serial Peripheral Interface (SPI)
  • 2 × inter-integrated circuit (I2C)
  • Inter-IC sound (I2S)
  • Pulse density modulation (PDM)
  • Secure digital and multimedia card (SD/MMC)
  • Secure digital input output (SDIO) 2.0
  • Controller area network (CAN) 2.0
  • 8-channel, 12-bit analog-to-digital converter (ADC)

System Services

  • Direct memory access (DMA)
  • One-time-programmable memory (OTP)
  • Real-time clock (RTC) and watchdog timer (WDT)

Radio

  • Wi-Fi 6 (802.11ax)

    • 2.4GHz and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps (UDP)
    • Compatible with IEEE 802.11 a/b/g/n/ax
      • Orthogonal frequency-division multiple access (OFDMA)
      • Target wake time (TWT)
      • Trigger frames
      • Basic service set (BSS) color
    • Integrated PA for a complete WLAN system with up to 20.5dBm output power at 1 DSSS
    • Role support: STA, softAP , Wi-Fi direct, multi-role AP + STA
    • Support for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise, WPA3 personal or enterprise
    • Wi-Fi TX Power:
      • 20.5dBm at 1DSSS
      • 17.8dBm at 54OFDM
    • Wi-Fi RX Sensitivity:
      • –98.7dBm at 1DSSS
      • –76.6dBm at 54OFDM
  • Bluetooth low energy
    • Bluetooth low energy 5.4 certified stack
    • Supports long-range and high-speed PHYs (up to 2Mbps)

Security Features

  • ARM TrustZone
  • Hardware security module supporting all of the following:
    • ECC, RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG
    • Secure key storage
  • Initial secure programming
  • Secure boot
  • Software IP and cloning protection
  • Debug security through JTAG and debug port lock
  • OTP with the ability to program root-of-trust public key
  • Secure over-the-air (OTA) updates
  • Anti-rollback protection

Clock Source

  • Fast clock: 52MHz XTAL
  • Slow clock: Internal low-frequency oscillator, 32.768kHz XTAL, or external slow clock source

Power Management

  • Support for 3.3V and 1.8V on multiple I/O domains
  • Supplies: VPA: 3.3V, VMAIN: 1.8V, VIO: 1.8/3.3V

Key Benefits

  • Complete software development kit with open-source TCP/IP and TLS stacks
  • Operating temperature: –40°C to +105°C
  • Support for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for example Thread or Zigbee)
  • Antenna selection capability

Package

  • Easy to design with 56-pin, 7mm × 7mm quad flat no leaded (QFN) package

Microcontroller

  • Powerful 160MHz Arm Cortex-M33 processor with FPU, TrustZone, and AI acceleration
  • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption
  • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code execution performance
  • 1.1MB embedded SRAM including 128KB TCM for Wi-Fi™, Bluetooth Low Energy, networking, and application data

Peripherals

  • Up to 38 I/Os with flexible multiplexing options
  • 8 × general-purpose timers and pulse-width modulation (PWM)
  • 3 × universal asynchronous receiver-transmitter (UART)
  • 2 × Serial Peripheral Interface (SPI)
  • 2 × inter-integrated circuit (I2C)
  • Inter-IC sound (I2S)
  • Pulse density modulation (PDM)
  • Secure digital and multimedia card (SD/MMC)
  • Secure digital input output (SDIO) 2.0
  • Controller area network (CAN) 2.0
  • 8-channel, 12-bit analog-to-digital converter (ADC)

System Services

  • Direct memory access (DMA)
  • One-time-programmable memory (OTP)
  • Real-time clock (RTC) and watchdog timer (WDT)

Radio

  • Wi-Fi 6 (802.11ax)

    • 2.4GHz and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps (UDP)
    • Compatible with IEEE 802.11 a/b/g/n/ax
      • Orthogonal frequency-division multiple access (OFDMA)
      • Target wake time (TWT)
      • Trigger frames
      • Basic service set (BSS) color
    • Integrated PA for a complete WLAN system with up to 20.5dBm output power at 1 DSSS
    • Role support: STA, softAP , Wi-Fi direct, multi-role AP + STA
    • Support for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise, WPA3 personal or enterprise
    • Wi-Fi TX Power:
      • 20.5dBm at 1DSSS
      • 17.8dBm at 54OFDM
    • Wi-Fi RX Sensitivity:
      • –98.7dBm at 1DSSS
      • –76.6dBm at 54OFDM
  • Bluetooth low energy
    • Bluetooth low energy 5.4 certified stack
    • Supports long-range and high-speed PHYs (up to 2Mbps)

Security Features

  • ARM TrustZone
  • Hardware security module supporting all of the following:
    • ECC, RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG
    • Secure key storage
  • Initial secure programming
  • Secure boot
  • Software IP and cloning protection
  • Debug security through JTAG and debug port lock
  • OTP with the ability to program root-of-trust public key
  • Secure over-the-air (OTA) updates
  • Anti-rollback protection

Clock Source

  • Fast clock: 52MHz XTAL
  • Slow clock: Internal low-frequency oscillator, 32.768kHz XTAL, or external slow clock source

Power Management

  • Support for 3.3V and 1.8V on multiple I/O domains
  • Supplies: VPA: 3.3V, VMAIN: 1.8V, VIO: 1.8/3.3V

Key Benefits

  • Complete software development kit with open-source TCP/IP and TLS stacks
  • Operating temperature: –40°C to +105°C
  • Support for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for example Thread or Zigbee)
  • Antenna selection capability

Package

  • Easy to design with 56-pin, 7mm × 7mm quad flat no leaded (QFN) package

The SimpleLink™ Wi-Fi system-on-chip CC35xx family is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC35xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 wireless microcontrollers (MCUs). The CC3550E and CC3551E are the first dual-band devices in this pin-to-pin compatible family.

  • CC3550E: 2.4GHz and 5GHz Wi-Fi 6 wireless MCU
  • CC3551E: 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 wireless MCU

The CC355xE offers the latest standards from Wi-Fi and Bluetooth Low Energy while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n)and Wi-Fi 5 (802.11 ac). These CC355xE are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC355xE is based on proven technology. These devices are an excellent choice to use in cost-sensitive embedded applications with RTOS software. CC355xE brings the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT), with a small PCB footprint and highly optimized bill of materials. Future device flavors will include in-package PSRAM for additional runtime memory, see the table below.

The SimpleLink™ Wi-Fi system-on-chip CC35xx family is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC35xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 wireless microcontrollers (MCUs). The CC3550E and CC3551E are the first dual-band devices in this pin-to-pin compatible family.

  • CC3550E: 2.4GHz and 5GHz Wi-Fi 6 wireless MCU
  • CC3551E: 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 wireless MCU

The CC355xE offers the latest standards from Wi-Fi and Bluetooth Low Energy while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n)and Wi-Fi 5 (802.11 ac). These CC355xE are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC355xE is based on proven technology. These devices are an excellent choice to use in cost-sensitive embedded applications with RTOS software. CC355xE brings the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT), with a small PCB footprint and highly optimized bill of materials. Future device flavors will include in-package PSRAM for additional runtime memory, see the table below.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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4개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet CC355xE SimpleLink 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Wireless MCU datasheet PDF | HTML 2024/12/11
* Errata CC355xE SimpleLink 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Wireless MCU Errata PDF | HTML 2025/12/05
User guide CC35xx SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU Technical Reference Manual PDF | HTML 2025/12/11
Technical article 저전력 무선 MCU로 주요 무선 연결 사이버 보안 문제 해결 (Rev. A) PDF | HTML 2024/12/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LP-EM-CC35X1 — SimpleLink™ Wi-Fi 6 및 Bluetooth® 저에너지 무선 MCU용 CC35xxE LaunchPad™ 개발 키트

LP-EM-CC35X1 SimpleLink™ LaunchPad™ 개발 키트는 CC3551E Wi-Fi 6 및 Bluetooth ® 저에너지 무선 MCU를 강조하여 즉시 사용 가능한 완벽한 환경과 빠른 개발 플랫폼을 위해 온보드 센서, 버튼, 간편한 인터페이스 옵션을 갖춘 테스트 및 개발 보드를 제공합니다. 이 키트는 핀 대 핀 호환 CC3500E, CC3501E, CC3550E 및 CC3551E Wi-Fi 6 및 Bluetooth 저에너지 무선 MCU를 위한 소프트웨어 개발을 지원하여 Wi-Fi 제품을 신속하게 출시할 수 있도록 (...)
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
도터 카드

BDE-3P-BW3551X — TI CC3551E 무선 MCU 모듈

BDE-BW3551은 TI의 SimpleLink™ Wi-Fi 시스템 온 칩 CC3551을 기반으로 하는 2.4GHz 및 5GHz 이중 대역 Wi-Fi® 6 및 Bluetooth® LE 콤보 무선 MCU 모듈 시리즈입니다. 이 모듈 시리즈는 최대 애플리케이션 처리량 요구 사항이 최대 20Mbps이며 RTOS 소프트웨어를 사용하는 비용에 민감한 임베디드 애플리케이션에 이상적입니다. BDE-BW3551 모듈 시리즈는 IoT(사물인터넷)용 임베디드 장치 애플리케이션에 Wi-Fi 6의 효율성을 결합하기 위한 탁월한 선택입니다. 이 (...)
도터 카드

TTC-3P-SR3551 — TTC SR-355101PC2N은 2.4GHz 및 5GHz 이중 대역 Wi-Fi 6 및 BLE를 지원합니다

CC3551E 모듈은 CC3551E를 핵심으로 설계된 WIFI+ Bluetooth 듀얼-인-원 무선 모듈입니다. 와이파이는 2.4GHz 및 5GHz 대역에서 IEEE 802.11b/g/n/ax 규격의 MAC, 베이스밴드 및 RF 트랜시버를 지원하며, 단일 스트림 20MHz 채널, 최대 20Mbps(UDP)의 애플리케이션 처리량, 하드웨어 기반 암호화 및 복호화를 지원하며 WPA2 및 WPA3를 지원합니다. 4비트 SDIO 및 SPI 호스트 인터페이스 지원. 블루투스는 저전력 Bluetooth® 5.4, LE 인코딩 (...)

개발 키트

WS-3P-WS8712 — 2.4GHz 및 5GHz 듀얼 대역 Wi-Fi 6 및 BLE 5.4 Bluetooth 모듈

WS8712는 TI의 차세대 Wi-Fi 6칩 CC3551E를 기반으로 개발된 고성능, 고신뢰성 듀얼 대역 Wi-Fi 6 및 Bluetooth® 모듈입니다. 이 제품에는 FPU, TrustZone®, AI 가속 기능을 지원하는 강력한 내장 160MHz Arm® Cortex®-M33 프로세서가 탑재되어 있습니다. 이 모듈은 20dBm@1Mbps DSSS 및 16dBm@54Mbps OFDM의 최대 무선 전송 전력을 지원합니다.

기능적으로 보면, 이 모듈은 IEEE 802.11 b/g/n/ax 표준, 2.4GHz와 5GHz 대역 모두에서 (...)

소프트웨어 개발 키트(SDK)

SIMPLELINK-WIFI-SDK SimpleLink Wi-Fi SDK for the CC35xxE Devices

The SimpleLink™ Wi-Fi® SDK provides a comprehensive software toolkit for developing IoT applications on the CC35xxE family of wireless MCUs. This powerful SDK includes essential components like the Bluetooth® LE protocol stack supporting Bluetooth 5.4, Wi-Fi 6 with an included networking stack (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

찾아보기 다운로드 옵션
애플리케이션 소프트웨어 및 프레임워크

SIMPLELINK-WIFI-TOOLBOX SimpleLink Wi-Fi Toolbox collection of tools to help development and testing of the CC33xx and CC35xxE Devices

The Wi-Fi toolbox package provides all the capabilities required to debug and monitor WLAN/Bluetooth® Low Energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues.

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
소프트웨어 프로그래밍 도구

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RSH) 56 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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