CC2640R2F-Q1

활성

SimpleLink™ 차량용 등급 32비트 Arm Cortex-M3 Bluetooth® 저에너지 무선 MCU

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비교 대상 장치와 유사한 기능
CC2340R5-Q1 활성 512KB 플래시를 지원하는 오토모티브 등급 SimpleLink™ Bluetooth® 저에너지 무선 MCU This product offers an ARM Cortex M0+, more Flash, more RAM
CC2745R10-Q1 활성 1MB 플래시, HSM, APU, CAN-FD를 지원하는 오토모티브 SimpleLink™ Bluetooth® LE 무선 MCU This product offers an ARM Cortex-M33, more Flash, more RAM, integrated HSM and CAN-FD

제품 상세 정보

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 CPU Arm Cortex-M3 Flash memory (kByte) 128 RAM (kByte) 28 Number of GPIOs 31 TX power (max) (dBm) 5 Features AEC-Q100 Grade 2, LE 1M PHY, LE Coded PHY (long range), OAD, Over-the-air upgrade Peripherals 1 UART, 12-bit ADC 8-channel, 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug Rating Automotive Operating temperature range (°C) -40 to 105 Cryptographic accelerators AES, TRNG
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 CPU Arm Cortex-M3 Flash memory (kByte) 128 RAM (kByte) 28 Number of GPIOs 31 TX power (max) (dBm) 5 Features AEC-Q100 Grade 2, LE 1M PHY, LE Coded PHY (long range), OAD, Over-the-air upgrade Peripherals 1 UART, 12-bit ADC 8-channel, 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug Rating Automotive Operating temperature range (°C) -40 to 105 Cryptographic accelerators AES, TRNG
VQFN (RGZ) 48 49 mm² 7 x 7
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful Arm Cortex-M3
    • EEMBC CoreMark Score: 142
    • Up to 48MHz clock speed
    • 275KB nonvolatile memory, including 128KB in-system Programmable Flash
    • Up to 28KB system SRAM, of which 20KB is ultra-low leakage SRAM
    • 8KB SRAM for Cache or system RAM use
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air (OTA) upgrade
  • Ultra-low power sensor controller
    • Can run autonomously from the rest of the system
    • 16-bit architecture
    • 2-KB ultra-low leakage SRAM for code and data
  • Efficient code size architecture, placing drivers, Bluetooth Low Energy Controller, and bootloader in ROM to make more flash available for the application
  • RoHS-compliant automotive grade package
    • 7mm × 7mm RGZ VQFN48 with wettable flanks>
  • Peripherals
    • 31 GPIOs, all digital peripheral pins can be routed to any GPIO
    • Four general-purpose timer modules (eight 16-bit or four 32-bit timers, PWM each)
    • 12-bit ADC, 200-ksamples/s, 8-channel analog MUX
    • Continuous time comparator
    • Ultra-low power analog comparator
    • Programmable current source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-time clock (RTC)
    • AES-128 security module
    • True random number generator (TRNG)
    • Support for eight capacitive-sensing buttons
    • Integrated temperature sensor
  • External system
    • On-chip internal DC/DC converter
    • Very few external components
    • Seamless integration with the SimpleLink™ CC2590 and CC2592 range extenders
  • Low power
    • Wide supply voltage range: 1.8V to 3.8V
    • Active mode RX: 6.1mA
    • Active mode TX at 0dBm: 7.0mA
    • Active mode TX at +5dBm: 9.3mA
    • Active mode MCU: 61µA/MHz
    • Active mode MCU: 48.5 CoreMark/mA
    • Active mode sensor controller: 0.4mA + 8.2µA/MHz
    • Standby: 1.3µA (RTC running and RAM/CPU retention)
    • Shutdown: 150nA (wake up on external events)
  • RF section
    • 2.4GHz RF transceiver compatible with Bluetooth Low Energy (BLE) 4.2 and 5 specifications
    • Excellent receiver sensitivity (–97dBm for Bluetooth Low Energy 1Mbps), selectivity, and blocking performance
    • Programmable output power up to +5dBm
    • Link budget of 102dB for Bluetooth Low Energy 1Mbps
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 328 and EN 300 440 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Development Tools and Software
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful Arm Cortex-M3
    • EEMBC CoreMark Score: 142
    • Up to 48MHz clock speed
    • 275KB nonvolatile memory, including 128KB in-system Programmable Flash
    • Up to 28KB system SRAM, of which 20KB is ultra-low leakage SRAM
    • 8KB SRAM for Cache or system RAM use
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air (OTA) upgrade
  • Ultra-low power sensor controller
    • Can run autonomously from the rest of the system
    • 16-bit architecture
    • 2-KB ultra-low leakage SRAM for code and data
  • Efficient code size architecture, placing drivers, Bluetooth Low Energy Controller, and bootloader in ROM to make more flash available for the application
  • RoHS-compliant automotive grade package
    • 7mm × 7mm RGZ VQFN48 with wettable flanks>
  • Peripherals
    • 31 GPIOs, all digital peripheral pins can be routed to any GPIO
    • Four general-purpose timer modules (eight 16-bit or four 32-bit timers, PWM each)
    • 12-bit ADC, 200-ksamples/s, 8-channel analog MUX
    • Continuous time comparator
    • Ultra-low power analog comparator
    • Programmable current source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-time clock (RTC)
    • AES-128 security module
    • True random number generator (TRNG)
    • Support for eight capacitive-sensing buttons
    • Integrated temperature sensor
  • External system
    • On-chip internal DC/DC converter
    • Very few external components
    • Seamless integration with the SimpleLink™ CC2590 and CC2592 range extenders
  • Low power
    • Wide supply voltage range: 1.8V to 3.8V
    • Active mode RX: 6.1mA
    • Active mode TX at 0dBm: 7.0mA
    • Active mode TX at +5dBm: 9.3mA
    • Active mode MCU: 61µA/MHz
    • Active mode MCU: 48.5 CoreMark/mA
    • Active mode sensor controller: 0.4mA + 8.2µA/MHz
    • Standby: 1.3µA (RTC running and RAM/CPU retention)
    • Shutdown: 150nA (wake up on external events)
  • RF section
    • 2.4GHz RF transceiver compatible with Bluetooth Low Energy (BLE) 4.2 and 5 specifications
    • Excellent receiver sensitivity (–97dBm for Bluetooth Low Energy 1Mbps), selectivity, and blocking performance
    • Programmable output power up to +5dBm
    • Link budget of 102dB for Bluetooth Low Energy 1Mbps
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 328 and EN 300 440 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Development Tools and Software

The SimpleLink™ Bluetooth® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth® 4.2 and Bluetooth® 5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.

The CC2640R2F-Q1 device is part of the SimpleLink™ MCU platform from Texas Instruments™. The platform consists of Wi-Fi®, Bluetooth® low energy, Sub-1GHz, Ethernet, Zigbee, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables users to add any combination of the portfolio’s devices into their design, allowing 100 percent code reuse when design requirements change. For more information, visit http://www.ti.com/wireless-connectivity/simplelink-solutions/overview/overview.html.

With very low active RF and MCU current consumption, in addition to flexible low power modes, the CC2640R2F-Q1 provides excellent battery life and allows long-range operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. Excellent receiver sensitivity and programmable output power provide industry-leading RF performance that is required for the demanding automotive RF environment.

The CC2640R2F-Q1 wireless MCU contains a 32-bit Arm® Cortex®-M3 processor that runs at 48MHz as the main application processor and includes the Bluetooth® 4.2 low energy controller and host libraries embedded in ROM. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application.

Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and is offered in a 7mm × 7mm VQFN packagewith wettable flanks.The wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points.

The Bluetooth Low Energy Software Stack is available free of charge from ti.com.

The SimpleLink™ Bluetooth® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth® 4.2 and Bluetooth® 5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.

The CC2640R2F-Q1 device is part of the SimpleLink™ MCU platform from Texas Instruments™. The platform consists of Wi-Fi®, Bluetooth® low energy, Sub-1GHz, Ethernet, Zigbee, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables users to add any combination of the portfolio’s devices into their design, allowing 100 percent code reuse when design requirements change. For more information, visit http://www.ti.com/wireless-connectivity/simplelink-solutions/overview/overview.html.

With very low active RF and MCU current consumption, in addition to flexible low power modes, the CC2640R2F-Q1 provides excellent battery life and allows long-range operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. Excellent receiver sensitivity and programmable output power provide industry-leading RF performance that is required for the demanding automotive RF environment.

The CC2640R2F-Q1 wireless MCU contains a 32-bit Arm® Cortex®-M3 processor that runs at 48MHz as the main application processor and includes the Bluetooth® 4.2 low energy controller and host libraries embedded in ROM. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application.

Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and is offered in a 7mm × 7mm VQFN packagewith wettable flanks.The wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points.

The Bluetooth Low Energy Software Stack is available free of charge from ti.com.

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38개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet CC2640R2F-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU for Automotive datasheet (Rev. C) PDF | HTML 2025/03/25
* Errata CC2640R2F-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU Silicon Errata (Rev. B) 2018/08/24
* User guide CC13x0, CC26x0 SimpleLink™ Wireless MCU Technical Reference Manual (Rev. I) 2020/06/30
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025/11/18
Application note Crystal Oscillator and Crystal Selection for the CC13xx, CC26xx, and CC23xx Family of Wireless MCUs (Rev. L) PDF | HTML 2025/04/21
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024/08/06
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2024/05/02
Application note Bluetooth® Angle of Arrival (AoA) Antenna Design (Rev. A) PDF | HTML 2023/06/07
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022/02/25
Cybersecurity advisory Bluetooth® Low Energy – Missing Length Check for UNPI Packets Over SPI 2020/10/08
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020/07/17
Cybersecurity advisory Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 2020/06/05
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/05/18
Technical article Exploring connectivity trends for Bluetooth® Low Energy in the car PDF | HTML 2020/02/19
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 2020/01/27
Technical article Bluetooth® Low Energy shifts gears for car access PDF | HTML 2019/07/15
Technical article Adding CAN nodes in Bluetooth® Low Energy PEPS systems PDF | HTML 2019/06/11
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 2019/01/10
Application note Increase RAM Size on the CC2640R2F Bluetooth low energy Wireless MCU (Rev. A) 2018/07/26
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 2018/02/27
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017/10/16
Technical article Bluetooth® low energy makes automotive systems more automatic PDF | HTML 2017/10/04
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 2017/10/02
White paper Bluetooth® low energy and the automotive transformation 2017/09/25
White paper Enabling Wireless Firmware Update for Bluetooth® low energy Applications 2017/08/28
Application note Design Considerations for High Temperature Applications Using the CC2640R2F-Q1 2017/08/15
Application note Johanson Balun for the CC26xx Device Family 2017/08/07
White paper IoT provokes change in ultra-low-power MCUs 2017/07/19
More literature SimpleLink™ Bluetooth® low energy CC2640R2 MCU Security (Rev. A) 2017/05/26
White paper RTOS Power Management Emerges as a Key for MCU-based IoT Nodes (Rev. A) 2017/05/11
User guide CC26x0/CC13x0 SimpleLink™ Wireless MCU Power Management Software Development Ref (Rev. A) PDF | HTML 2017/04/17
Application note ETSI EN 300 328 Blocking Test for Bluetooth Low Energy PDF | HTML 2017/02/08
Application note Hardware Migration From CC2640F128 to CC2640R2F 2017/01/31
Technical article 5 need to know facts about the new SimpleLink™ Bluetooth low energy CC2640R2F wire PDF | HTML 2017/01/19
User guide TI-RTOS 2.20 for CC13xx/CC26xx SimpleLink Getting Started Guide (Rev. D) 2016/06/17
Application note Using the Wireless SimpleLink CC26xx in Ext Regulator Mode With the TPS62740 2015/11/19
Application note CC2640 Wireless MCU DC Supply Evaluation 2015/10/05
Application note Using GCC/GDB With SimpleLink CC26xx PDF | HTML 2015/02/23

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LAUNCHXL-CC2640R2 — SimpleLink™ Bluetooth® 저에너지 무선 MCU용 CC2640R2 LaunchPad™ 개발 키트

이 LaunchPad™는 CC2640R2F 또는 CC2640R2L 장치를 사용하는 BLE(Bluetooth® 저에너지) 연결로 개발 속도를 높입니다. 호환되는 SDK는 고속 모드를 지원하는 단일 모드 BLE 애플리케이션을 위한 완전한 검증을 거친 Bluetooth 5 프로토콜 스택과 장거리 모드 테스트를 위한 Bluetooth 5 코딩된 PHY(물리 계층)의 예를 제공합니다. Bluetooth 4.2 스택도 사용할 수 있습니다.

디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

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XDS200은 TI 20핀 커넥터(TI 14핀, (...)

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LB-3P-TRACE32-WIRELESS — 무선 연결용 Lauterbach TRACE32® 디버그 시스템

Lauterbach의 TRACE32® 툴은 개발자가 다양한 종류의 TI 무선 연결 칩을 분석, 최적화 및 인증할 수 있도록 하는 첨단 하드웨어 및 소프트웨어 구성 요소 제품군입니다. 세계적으로 유명한 임베디드 시스템용 디버그 솔루션은 초기 사전 실리콘 개발부터 현장의 제품 인증 및 문제 해결에 이르기까지 다음을 포함하는 모든 개발 단계를 위한 완벽한 솔루션입니다.   전체 온칩 중단점 지원, 런타임 메모리 액세스, 플래시 프로그래밍 및 벤치마크 카운터. 모든 것이 스크립팅이 가능하므로 개발자는 동일한 테스트 시퀀스를 계속해서 (...)

발송: Lauterbach GmbH
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TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

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소프트웨어 개발 키트(SDK)

SIMPLELINK-CC2640R2-SDK SimpleLink CC2640R2 Software Development Kit

Important Note: The SimpleLink SDKs are updated regularly, to get the latest release updates click Alert Me above.

This SDK includes TI’s royalty-free Bluetooth® Low Energy (BLE) software stacks with all necessary software, example applications and documentation to quickly get started with (...)

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드라이버 또는 라이브러리

BLE-STACK — 블루투스 저에너지 소프트웨어 스택

TI의 ARM® Cortex®-M3 기반 무선 MCU(마이크로컨트롤러)의 SimpleLink™ Bluetooth® 저에너지 제품군을 위한 이 로열티 없는 BLE-Stack에는 단일 모드 BLE(Bluetooth 저에너지) 애플리케이션 개발을 빠르게 시작하는 데 필요한 모든 소프트웨어, 샘플 애플리케이션 및 설명서와 함께 모든 기능을 갖춘 블루투스 4.2 및 블루투스 5 인증 스택이 포함되어 있습니다.

특징

  • 2Mbps 고속 모드, 장거리 모드(LE 코딩 PHY), 광고 확장(AE), 개인 정보 보호 1.2.1 및 채널 선택 알고리즘 (...)
사용 설명서: PDF | HTML
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TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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The TI Arm® code generation (compiler) tools support development of applications for TI Arm-based platforms, especially those featuring TI Arm Cortex-M and Cortex-R series devices.

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SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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FLASH-PROGRAMMER-2 SmartRF Flash Programmer v2

SmartRF Flash Programmer 2 can be used to program the flash memory in Texas Instruments ARM based low-power RF wireless MCUs over the debug and serial interfaces. Check the list of supported products for compatibility. Uniflash can also be used to program any SimpleLink product.

SmartRF Flash (...)

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UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

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지원되는 제품 및 하드웨어

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지원 소프트웨어

PACKET-SNIFFER SmartRF™ Packet Sniffer 2.18.1

The SmartRF Packet Sniffer is a PC software application that can display and store radio packets captured by a listening RF device. The capture device is connected to the PC via USB. Various RF protocols are supported. The Packet Sniffer filters and decodes packets and displays them in a convenient (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

계산 툴

BT-POWER-CALC Bluetooth Power Calculator for CC13xx, CC26xx and CC23xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
계산 툴

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
설계 툴

3P-WIRELESS-MODULES — 타사 무선 모듈 검색 툴

타사 무선 모듈 검색 툴은 개발자가 완제품 사양을 충족하는 제품을 식별하고 생산 준비가 완료된 무선 모듈을 조달하는 데 유용합니다. 검색 툴에 포함되어 있는 타사 모듈 공급업체는 TI 무선 연결 제품을 사용하여 무선 모듈을 설계 및 제조하는 전문성을 갖춘 독립 회사입니다.
설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEW Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEWS — SimpleLink™ CC2xxx 장치에 대한 하드웨어 설계 검토

SimpleLink 하드웨어 설계 검토 프로세스는 설계를 검토하고 귀중한 피드백을 제공할 수 있는 주제 전문가와 일대일로 연락할 수 있는 방법을 제공합니다. 간단한 3단계 검토 요청 절차와 관련 기술 문서 및 리소스 링크는 여기서 확인할 수 있습니다.

시작하기

일반 설계 질문은 2.4GHz 하드웨어 설계 검토를 요청하기 전에 E2E 포럼에 게시해야 합니다.

하드웨어 설계 검토 요청 양식과 함께 전송할 다음 필수 문서가 준비되어 있는지 확인하세요:

  • 데이터 시트, 설계 가이드, 사용 설명서 및 기타 하드웨어 리소스와 같이 제품 (...)
거버(Gerber) 파일

LAUNCHXL-CC2640R2 Design Files

SWRC335.ZIP (5459 KB)
레퍼런스 디자인

TIDA-01632 — 차량용 Bluetooth® 저에너지 자동차 액세스 위성 노드 레퍼런스 설계

이 레퍼런스 설계는 BLE(Bluetooth® 저에너지) 기술을 활용하여 리모콘의 위치를 결정하는 패시브 탑승 패시브 시동(PEPS) 자동차 액세스 시스템용으로 설계되었습니다. 이 디자인은 BLE 신호의 AoA(도래각)를 계산하고 단일 BLE 무선 마이크로컨트롤러 및 LIN 트랜시버와 함께 LIN(Local Interconnect Network)을 통해 AoA 데이터를 전송하는 데 차량 BLE 위성 노드를 구현하는 방법을 보여줍니다. 또한 이 디자인은 정확한 AoA 정보를 두 개의 다이폴 안테나를 사용하여 계산할 수 있어 (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

CC2650EM-MURBAL-RD — CC2650EM-MurBal 레퍼런스 디자인

The CC2650EM-MurBal reference design contains schematics and layout files for the CC2650 evauation module with the 5x5 mm package and integrated 0603 balun from Murata. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the reference (...)
레퍼런스 디자인

CC2650EM-7ID-RD — CC2650EM-7ID 레퍼런스 디자인

The CC2650EM-7ID reference design contains schematics and layout files for the CC2650 evauation module with the 7x7 mm package and differential RF output. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the reference design, both (...)
레퍼런스 디자인

CC2650EM-5XD-RD — CC2650EM-5XD 레퍼런스 디자인

The CC2650EM-5XD reference design contains schematics and layout files for the CC2650 evauation module with the 5x5 mm package and differential RF output with external biasing. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the (...)
레퍼런스 디자인

CC2650EM-4XS-RD — CC2650EM-4XS 레퍼런스 디자인

The CC2650EM-4XS reference design contains schematics and layout files for the CC2650 Evauation Module with the 4x4 mm package and single-ended RF output with external biasing. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the (...)
레퍼런스 디자인

CC2650EM-4XD-RD — CC2650EM-4XD 레퍼런스 디자인

The CC2650EM-4XD reference design contains schematics and layout files for the CC2650 evauation module with the 4x4 mm package and differential RF output with external biasing. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the (...)
레퍼런스 디자인

CC2650EM-4XS-EXT-REG-RD — CC2650EM-4XS-EXT-REG 레퍼런스 디자인

The CC2650EM-4XS_Ext_Reg reference design contains schematics and layout files for the CC2650 configured for external regulator operation using the TPS62740 DCDC converter. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the (...)
패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RGZ) 48 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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