홈 마이크로컨트롤러(MCU) 및 프로세서 Microcontrollers Automotive MCUs Automotive powertrain, zonal & chassis control MCUs
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마이크로컨트롤러(MCU) 및 프로세서
Microcontrollers
Automotive MCUs
Automotive powertrain, zonal & chassis control MCUs
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AM263P2-Q1

활성

실시간 제어 및 확장 가능한 메모리를 갖춘 최대 400MHz의 차량용 듀얼 코어 Arm® Cortex®-R5F MCU

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AM263P2-Q1

활성
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제품 상세 정보

CPU Arm Cortex-R5F Frequency (MHz) 400 RAM (kByte) 3072 ADC type 5 12-bit SAR Total processing (MIPS) 0.0008 Features CAN, CAN FD, EnDat 2.2, Ethernet, External memory interface, Hardware encrpytion (AES/DES/SHA/MD5), I2C, OSPI, QSPI, SD/SDIO, SPI, UART UART 6 CAN (#) 8 (CAN-FD) PWM (Ch) 64 Number of ADC channels 30 SPI 8 Operating temperature range (°C) -40 to 150 Rating Automotive Communication interface CAN, CAN-FD, I2C, OSPI, QSPI, SD/SDIO, SPI, UART Operating system AutoSAR, FreeRTOS, Zephyr RTOS Hardware accelerators Trigonometric math accelerator Number of GPIOs 140 Number of I2Cs 4 Security Cryptographic acceleration, Device lifecycle management, Secure boot, Secure debug, Secure provisioning
CPU Arm Cortex-R5F Frequency (MHz) 400 RAM (kByte) 3072 ADC type 5 12-bit SAR Total processing (MIPS) 0.0008 Features CAN, CAN FD, EnDat 2.2, Ethernet, External memory interface, Hardware encrpytion (AES/DES/SHA/MD5), I2C, OSPI, QSPI, SD/SDIO, SPI, UART UART 6 CAN (#) 8 (CAN-FD) PWM (Ch) 64 Number of ADC channels 30 SPI 8 Operating temperature range (°C) -40 to 150 Rating Automotive Communication interface CAN, CAN-FD, I2C, OSPI, QSPI, SD/SDIO, SPI, UART Operating system AutoSAR, FreeRTOS, Zephyr RTOS Hardware accelerators Trigonometric math accelerator Number of GPIOs 140 Number of I2Cs 4 Security Cryptographic acceleration, Device lifecycle management, Secure boot, Secure debug, Secure provisioning
NFBGA (ZCZ) 324 225 mm² 15 x 15

Processor Cores:

  • Single, dual, and quad-core Arm Cortex-R5F MCU with each core running up to 400MHz
    • 16KB I-cache with 64-bit ECC per CPU core
    • 16KB D-cache with 32-bit ECC per CPU core
    • x256 integrated VIM per CPU Core
    • 256KB Tightly-Coupled Memory (TCM) with 32-bit ECC per CPU core cluster
    • Lockstep or Dual-core capable clusters
  • Trigonometric Math Unit (TMU) for accelerating trigonometric functions
    • Up to 4x, one per R5F MCU core

Memory:

  • 1x Flash Subsystem with OptiFlash memory technology and eXecute In Place (XIP) support
    • 1x Octal Serial Peripheral Interface (OSPI), up to 133MHz SDR and DDR
    • AM263P Flash-in-Package (ZCZ_F) variant includes 8MB OSPI Flash
  • 3MB of On-Chip RAM (OCSRAM)
    • 6 Banks x 512KB
    • ECC error protection
    • Internal DMA engine support
    • Remote L2 Cache for external memory, software programmable up to 128KB per CPU core

System on Chip (SoC) Services and Architecture:

  • 1x EDMA to support data movement functions
    • 2x Transfer Controllers (TPTC)
    • 1x Channel Controller (TPCC)
  • Device Boot supported from the following interfaces:
    • UART (Primary/Backup)
    • QSPI NOR Flash (4S/1S) (Primary)
    • OSPI NOR Flash (8S 50MHz SDR Mode0, 8S 25MHz DDR XSPI) (Primary)
  • Interprocessor communication modules
    • SPINLOCK module for synchronizing processes running on multiple cores
    • MAILBOX functionality implemented through CTRLMMR registers
  • Central Platform Time Sync (CPTS) support with time-sync and compare-event interrupt routers
  • Timer Modules:
    • 4x Windowed Watchdog Timer (WWDT)
    • 8x Real Time Interrupt (RTI) timer

General Connectivity:

  • 6x Universal Asynchronous RX-TX (UART)
  • 8x Serial Peripheral Interface (SPI) controllers
  • 5x Local Interconnect Network (LIN) ports
  • 4x Inter-Integrated Circuit (I2C) ports
  • 8x Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 4x Fast Serial Interface Transmitters (FSITX)
  • 4x Fast Serial Interface Receivers (FSIRX)
  • Up to 139 General-Purpose I/O (GPIO) pins

Sensing & Actuation:

  • Real-time Control Subsystem (CONTROLSS)
  • Flexible Input/Output Crossbars (XBAR)
  • 5x 12-bit Analog-to-Digital Converters (ADC)
    • 6-input SAR ADC up to 4MSPS
      • 6x Single-ended channels OR
      • 3x Differential channels
    • Highly Configurable ADC Digital Logic
      • XBAR Start of Conversion Triggers (SOC)
      • User-defined Sample and Hold (S+H)
      • Flexible Post-processing Blocks (PPB)
  • 1x Resolver subsystem (ZCZ-S and ZCZ-F packages) with:
    • 2x Resolver to Digital Converter (RDC) OR
    • 2x 12-bit ADCs can also be used for general purpose
      • 4-input SAR ADC up to 3MSPS
        • 4x Single-ended channels OR
        • 2x Differential channels
  • 10x Analog Comparators with Type-A programmable DAC reference (CMPSSA)
  • 10x Analog Comparators with Type-B programmable DAC reference (CMPSSB)
  • 1x 12-bit Digital-to-Analog Converter (DAC)
  • 32x Pulse Width Modulation (EPWM) modules
    • Single or Dual PWM channels
    • Advanced PWM Configurations
    • Extended HRPWM time resolution
  • 16x Enhanced Capture (ECAP) modules
  • 3x Enhanced Quadrature Encoder Pulse (EQEP) modules
  • 2x 4-Ch Sigma-Delta Filter Modules (SDFM)
  • Additional Signal-multiplex Crossbars (XBAR)

Industrial Connectivity:

  • Programmable Real-Time Unit - Industrial Communication Subsystem (PRU-ICSS)
    • Dual core Programmable Real-Time Unit Subsystem (PRU0 / PRU1)
      • Deterministic Hardware
      • Dynamic Firmware
    • 20-channel enhanced input (eGPI) per PRU
    • 20-channel enhanced output (eGPO) per PRU
    • Embedded Peripherals and Memory
      • 1x UART, 1x ECAP, 1x MDIO, 1x IEP
      • 1x 32KB Shared General Purpose RAM
      • 2x 8KB Shared Data RAM
      • 1x 16KB IRAM per PRU
      • ScratchPad (SPAD), MAC/CRC
    • Digital encoder and sigma-delta control loops
    • The PRU-ICSS enables advanced industrial protocols including:
      • EtherCAT, Ethernet/IP™,
      • PROFINET, IO-Link for order
    • Dedicated Interrupt Controller (INTC)
    • Dynamic CONTROLSS XBAR Integration

High-Speed Interfaces:

  • Integrated 3-port Gigabit Ethernet switch (CPSW) supporting up to two external ports
    • MII (10/100), RMII (10/100), or RGMII (10/100/1000)
    • IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
    • Clause 45 MDIO PHY management
    • 512x ALE engine-based Packet Classifiers
    • Priority flow control with up to 2KB packet size
    • Four CPU hardware interrupt pacing
    • IP/UDP/TCP checksum offload in hardware

Security:

  • Hardware Security Module (HSM) with support for Auto SHE 1.1/EVITA
    • Arm Cortex-M4F based dedicated security controller
    • Isolated and secured RAMs
    • Peripherals like Timers, WWDT, RTC, Interrupt Controller
    • Safety related peripherals like CRC, ESM, PBIST
  • Secure boot support
    • Device Take Over Protection
    • Hardware-enforced root-of-trust (RoT)
      • Support for two sets of RoT keys
    • Authenticated boot support
      • Encrypted boot support
    • SW Anti-rollback protection
  • Debug security
    • Secure device debug only after cryptographic authentication
    • Support for permanent debug/JTAG disable
  • Device ID and Key Management
    • Unique ID (SoC ID)
    • Support for OTP Memory (FUSEROM)
  • Extensive Firewall Support
    • System Memory Protection Units (MPU) present at various interfaces
  • Cryptographic Acceleration
    • Cryptographic cores with DMA Support
    • AES - 128/192/256-bit key sizes
    • SHA2 - 256/384/512-bit support
    • Deterministic random bit generator (DRBG) with pseudo and true random number generator (TRNG)
    • Public Key Accelerator (PKA) to assist in RSA/Elliptic Curve Cryptography (ECC) processing

Functional Safety:

  • Enables design of systems with functional safety requirements
    • Error Signaling Module (ESM) with designated SAFETY_ERRORn pin
    • ECC or parity on calculation-critical memories
    • 4x Dual Clock Comparators (DCC)
    • 3x Self-Test Controller (STC)
    • Programmable Built-In Self-Test (PBIST) and fault-injection for CPU and on-chip RAM
    • Runtime internal diagnostic modules including voltage, temperature, and clock monitoring, windowed watchdog timers, CRC engines for memory integrity checks
  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation to be made available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL-3 targeted
    • Hardware integrity up to SIL-3 targeted
    • Safety-related certification
      • IEC 61508 planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-D targeted
    • Safety-related certification
      • ISO 26262 planned

Data Storage

  • 1x 4-bit Multi-Media Card/Secure Digital (MMC/SD) interface

Power Management

  • Recommended TPS653860-Q1 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Technology / Package:

  • AEC-Q100 qualified for automotive applications
  • 45nm technology
  • ZCZ Package
    • AM263x Compatible (ZCZ-C)
      • Pin-to-Pin compatible option with AM263x
    • AM263Px Resolver (ZCZ-S)
      • Adds new Resolver Subsystem functionality
    • AM263Px Resolver with Flash-in-Package (ZCZ-F)
      • Includes 1x internally connected Silicon in Package (SIP) 64Mb ISSI IS25LX064-JWLA3 OSPI Flash device; up to 133MHz SDR and DDR
    • 324-pin NFBGA
    • 15.0mm x 15.0mm
    • 0.8mm pitch

Processor Cores:

  • Single, dual, and quad-core Arm Cortex-R5F MCU with each core running up to 400MHz
    • 16KB I-cache with 64-bit ECC per CPU core
    • 16KB D-cache with 32-bit ECC per CPU core
    • x256 integrated VIM per CPU Core
    • 256KB Tightly-Coupled Memory (TCM) with 32-bit ECC per CPU core cluster
    • Lockstep or Dual-core capable clusters
  • Trigonometric Math Unit (TMU) for accelerating trigonometric functions
    • Up to 4x, one per R5F MCU core

Memory:

  • 1x Flash Subsystem with OptiFlash memory technology and eXecute In Place (XIP) support
    • 1x Octal Serial Peripheral Interface (OSPI), up to 133MHz SDR and DDR
    • AM263P Flash-in-Package (ZCZ_F) variant includes 8MB OSPI Flash
  • 3MB of On-Chip RAM (OCSRAM)
    • 6 Banks x 512KB
    • ECC error protection
    • Internal DMA engine support
    • Remote L2 Cache for external memory, software programmable up to 128KB per CPU core

System on Chip (SoC) Services and Architecture:

  • 1x EDMA to support data movement functions
    • 2x Transfer Controllers (TPTC)
    • 1x Channel Controller (TPCC)
  • Device Boot supported from the following interfaces:
    • UART (Primary/Backup)
    • QSPI NOR Flash (4S/1S) (Primary)
    • OSPI NOR Flash (8S 50MHz SDR Mode0, 8S 25MHz DDR XSPI) (Primary)
  • Interprocessor communication modules
    • SPINLOCK module for synchronizing processes running on multiple cores
    • MAILBOX functionality implemented through CTRLMMR registers
  • Central Platform Time Sync (CPTS) support with time-sync and compare-event interrupt routers
  • Timer Modules:
    • 4x Windowed Watchdog Timer (WWDT)
    • 8x Real Time Interrupt (RTI) timer

General Connectivity:

  • 6x Universal Asynchronous RX-TX (UART)
  • 8x Serial Peripheral Interface (SPI) controllers
  • 5x Local Interconnect Network (LIN) ports
  • 4x Inter-Integrated Circuit (I2C) ports
  • 8x Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 4x Fast Serial Interface Transmitters (FSITX)
  • 4x Fast Serial Interface Receivers (FSIRX)
  • Up to 139 General-Purpose I/O (GPIO) pins

Sensing & Actuation:

  • Real-time Control Subsystem (CONTROLSS)
  • Flexible Input/Output Crossbars (XBAR)
  • 5x 12-bit Analog-to-Digital Converters (ADC)
    • 6-input SAR ADC up to 4MSPS
      • 6x Single-ended channels OR
      • 3x Differential channels
    • Highly Configurable ADC Digital Logic
      • XBAR Start of Conversion Triggers (SOC)
      • User-defined Sample and Hold (S+H)
      • Flexible Post-processing Blocks (PPB)
  • 1x Resolver subsystem (ZCZ-S and ZCZ-F packages) with:
    • 2x Resolver to Digital Converter (RDC) OR
    • 2x 12-bit ADCs can also be used for general purpose
      • 4-input SAR ADC up to 3MSPS
        • 4x Single-ended channels OR
        • 2x Differential channels
  • 10x Analog Comparators with Type-A programmable DAC reference (CMPSSA)
  • 10x Analog Comparators with Type-B programmable DAC reference (CMPSSB)
  • 1x 12-bit Digital-to-Analog Converter (DAC)
  • 32x Pulse Width Modulation (EPWM) modules
    • Single or Dual PWM channels
    • Advanced PWM Configurations
    • Extended HRPWM time resolution
  • 16x Enhanced Capture (ECAP) modules
  • 3x Enhanced Quadrature Encoder Pulse (EQEP) modules
  • 2x 4-Ch Sigma-Delta Filter Modules (SDFM)
  • Additional Signal-multiplex Crossbars (XBAR)

Industrial Connectivity:

  • Programmable Real-Time Unit - Industrial Communication Subsystem (PRU-ICSS)
    • Dual core Programmable Real-Time Unit Subsystem (PRU0 / PRU1)
      • Deterministic Hardware
      • Dynamic Firmware
    • 20-channel enhanced input (eGPI) per PRU
    • 20-channel enhanced output (eGPO) per PRU
    • Embedded Peripherals and Memory
      • 1x UART, 1x ECAP, 1x MDIO, 1x IEP
      • 1x 32KB Shared General Purpose RAM
      • 2x 8KB Shared Data RAM
      • 1x 16KB IRAM per PRU
      • ScratchPad (SPAD), MAC/CRC
    • Digital encoder and sigma-delta control loops
    • The PRU-ICSS enables advanced industrial protocols including:
      • EtherCAT, Ethernet/IP™,
      • PROFINET, IO-Link for order
    • Dedicated Interrupt Controller (INTC)
    • Dynamic CONTROLSS XBAR Integration

High-Speed Interfaces:

  • Integrated 3-port Gigabit Ethernet switch (CPSW) supporting up to two external ports
    • MII (10/100), RMII (10/100), or RGMII (10/100/1000)
    • IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
    • Clause 45 MDIO PHY management
    • 512x ALE engine-based Packet Classifiers
    • Priority flow control with up to 2KB packet size
    • Four CPU hardware interrupt pacing
    • IP/UDP/TCP checksum offload in hardware

Security:

  • Hardware Security Module (HSM) with support for Auto SHE 1.1/EVITA
    • Arm Cortex-M4F based dedicated security controller
    • Isolated and secured RAMs
    • Peripherals like Timers, WWDT, RTC, Interrupt Controller
    • Safety related peripherals like CRC, ESM, PBIST
  • Secure boot support
    • Device Take Over Protection
    • Hardware-enforced root-of-trust (RoT)
      • Support for two sets of RoT keys
    • Authenticated boot support
      • Encrypted boot support
    • SW Anti-rollback protection
  • Debug security
    • Secure device debug only after cryptographic authentication
    • Support for permanent debug/JTAG disable
  • Device ID and Key Management
    • Unique ID (SoC ID)
    • Support for OTP Memory (FUSEROM)
  • Extensive Firewall Support
    • System Memory Protection Units (MPU) present at various interfaces
  • Cryptographic Acceleration
    • Cryptographic cores with DMA Support
    • AES - 128/192/256-bit key sizes
    • SHA2 - 256/384/512-bit support
    • Deterministic random bit generator (DRBG) with pseudo and true random number generator (TRNG)
    • Public Key Accelerator (PKA) to assist in RSA/Elliptic Curve Cryptography (ECC) processing

Functional Safety:

  • Enables design of systems with functional safety requirements
    • Error Signaling Module (ESM) with designated SAFETY_ERRORn pin
    • ECC or parity on calculation-critical memories
    • 4x Dual Clock Comparators (DCC)
    • 3x Self-Test Controller (STC)
    • Programmable Built-In Self-Test (PBIST) and fault-injection for CPU and on-chip RAM
    • Runtime internal diagnostic modules including voltage, temperature, and clock monitoring, windowed watchdog timers, CRC engines for memory integrity checks
  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation to be made available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL-3 targeted
    • Hardware integrity up to SIL-3 targeted
    • Safety-related certification
      • IEC 61508 planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-D targeted
    • Safety-related certification
      • ISO 26262 planned

Data Storage

  • 1x 4-bit Multi-Media Card/Secure Digital (MMC/SD) interface

Power Management

  • Recommended TPS653860-Q1 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Technology / Package:

  • AEC-Q100 qualified for automotive applications
  • 45nm technology
  • ZCZ Package
    • AM263x Compatible (ZCZ-C)
      • Pin-to-Pin compatible option with AM263x
    • AM263Px Resolver (ZCZ-S)
      • Adds new Resolver Subsystem functionality
    • AM263Px Resolver with Flash-in-Package (ZCZ-F)
      • Includes 1x internally connected Silicon in Package (SIP) 64Mb ISSI IS25LX064-JWLA3 OSPI Flash device; up to 133MHz SDR and DDR
    • 324-pin NFBGA
    • 15.0mm x 15.0mm
    • 0.8mm pitch

The AM263Px Sitara™ Arm® Microcontrollers are built to meet the complex real-time processing needs of next generation industrial and automotive embedded products. The AM263Px MCU family consists of multiple pin-to-pin compatible devices with up to four 400MHz Arm® Cortex®-R5F cores. As an option, the Arm® R5F subsystem can be programmed to run in lockstep or dual-core mode for multiple functional safety configurations. The industrial communications subsystem (PRU-ICSS) enables integrated industrial Ethernet communication protocols such as PROFINET®, Ethernet/IP®, EtherCAT® (among many others), standard Ethernet connectivity, and even custom I/O interfaces. The family is designed for the future of motor control and digital power applications with advanced analog sensing and digital actuation modules.

The multiple R5F cores are arranged in cluster subsystems with 256KB of shared tightly coupled memory (TCM) along with 3MB of shared SRAM, greatly reducing the need for external memory. Extensive ECC is included for on-chip memories, peripherals, and interconnects for enhanced reliability. Granular firewalls managed by the Hardware Security Manager (HSM) enable developers to implement stringent security-minded system design requirements. Cryptographic acceleration and secure boot are also available on AM263Px devices.

TI provides a complete set of microcontroller software and development tools for the AM263Px family of microcontrollers.

The AM263Px Sitara™ Arm® Microcontrollers are built to meet the complex real-time processing needs of next generation industrial and automotive embedded products. The AM263Px MCU family consists of multiple pin-to-pin compatible devices with up to four 400MHz Arm® Cortex®-R5F cores. As an option, the Arm® R5F subsystem can be programmed to run in lockstep or dual-core mode for multiple functional safety configurations. The industrial communications subsystem (PRU-ICSS) enables integrated industrial Ethernet communication protocols such as PROFINET®, Ethernet/IP®, EtherCAT® (among many others), standard Ethernet connectivity, and even custom I/O interfaces. The family is designed for the future of motor control and digital power applications with advanced analog sensing and digital actuation modules.

The multiple R5F cores are arranged in cluster subsystems with 256KB of shared tightly coupled memory (TCM) along with 3MB of shared SRAM, greatly reducing the need for external memory. Extensive ECC is included for on-chip memories, peripherals, and interconnects for enhanced reliability. Granular firewalls managed by the Hardware Security Manager (HSM) enable developers to implement stringent security-minded system design requirements. Cryptographic acceleration and secure boot are also available on AM263Px devices.

TI provides a complete set of microcontroller software and development tools for the AM263Px family of microcontrollers.

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상위 문서 유형 직함 형식 옵션 날짜
* Data sheet AM263Px Sitara™ Microcontrollers with Optional Flash-in-Package datasheet (Rev. D) PDF | HTML 2025/05/19
* Errata AM263Px Errata Document (Rev. C) PDF | HTML 2025/07/14
* User guide AM263Px Sitara Microcontrollers Technical Reference Manual (Rev. D) PDF | HTML 2025/07/29
* User guide AM263Px Sitara Microcontrollers Register Addendum (Rev. B) 2025/06/02
White paper Integrating EVCC, DCDC, and Host Architecture: TI Automotive MCUs for Next-Generation EV Charging (Rev. A) PDF | HTML 2025/11/13
Product overview AM26xx Family TIFS-SDK Product Brief PDF | HTML 2025/05/29
Functional safety information AM263Px TÜV SÜD Functional Safety Certificate 2025/05/27
Functional safety information AM263Px TÜV SÜD Functional Safety Certificate Report 2025/05/27
Application note AM26x Custom PCB System Getting Started Guide (Rev. A) PDF | HTML 2025/05/13
User guide AM26x Hardware Design Guidelines (Rev. D) PDF | HTML 2025/05/02
User guide AM263Px MCAL user guide 2025/04/28
Application note How to Synchronize the Timing Between Chips With Programmable Real-Time Unit PDF | HTML 2025/03/10
Functional safety information AM263x and AM263Px Software Diagnostics Library TUV SUD Functional Safety Certificate (Rev. A) 2025/02/25
Application note Enabling Trace on AM26x Devices with Lauterbach® PDF | HTML 2024/12/18
Application note AM26x Family Migration Overview (Rev. A) PDF | HTML 2024/11/15
Application brief Achieving Faster Secure Boot Time on AM26x Devices PDF | HTML 2024/11/13
White paper Enhancing System Performance Using Optiflash Memory Technology PDF | HTML 2024/10/14
Application note MCU로의 절연 모듈레이터 디지털 인터페이스를 사용한 클록 에지 지 연 보상 (Rev. A) PDF | HTML 2024/08/21
Technical article 차세대 전기 프로펄션 시스템 개발 PDF | HTML 2024/05/17
User guide AM263P OSPI, QSPI Flash Selection Guide PDF | HTML 2024/04/22
Application note AM263Px Control Card Quick Start Guide PDF | HTML 2024/01/12
Technical article How OptiFlash memory technology leverages external flash to solve challenges in software-defined systems PDF | HTML 2024/01/05
Technical article Three key components needed to boost performance of next generation EV traction inverters PDF | HTML 2024/01/05
Application note OptiFlash Memory Technology (Rev. A) PDF | HTML 2023/11/27
Product overview Functional Safety for AM2x and Hercules™ Microcontrollers PDF | HTML 2023/11/08
EVM User's guide AM263x Sitara Control Card Hardware User's Guide (Rev. D) PDF | HTML 2023/09/14
Application note Sitara MCU Thermal Design PDF | HTML 2023/09/11
Application note Using the Sitara MCU AM263x in an Automotive SiC Traction Inverter PDF | HTML 2023/08/16
Application note Integration of MbedTLS on SITARA MCU Devices PDF | HTML 2023/08/03
White paper Time Sensitive Networking for Industrial Automation (Rev. C) 2023/07/31
Application note Intra Drive Communication Using 8b-10b Line Code With Programmable Real Time Uni PDF | HTML 2023/05/24
Application note Interfacing 5V Sensors and Signals to 3.3V Input SAR ADCs PDF | HTML 2023/02/09
Application note DCC Computation Tool PDF | HTML 2023/02/03
Application note Debugging Sitara AM2x Microcontrollers PDF | HTML 2022/10/24
Technical article What is “real-time control” and why do you need it? PDF | HTML 2022/04/06
Technical article How MCUs can unlock the full potential of electrification designs PDF | HTML 2022/03/21

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평가 보드

DP83TG720-EVM-AM2 — 차량용 이더넷 PHY 애드온 보드용 AM2x 평가 모듈

DP83TG720-EVM-AM2는 AM2x 시리즈 Sitara™ 고성능 마이크로컨트롤러 평가 모듈과 함께 사용되는 차량용 이더넷 PHY 애드온 보드입니다. 이 애드온 보드는 AM2x EVM을 사용한 초기 이더넷 평가 및 프로토타이핑에 이상적입니다. DP83TG720-EVM-AM2에는 RGMII 및 SGMII를 지원하는 TI DP83TG720S-Q1 1000BASE-T1 차량용 이더넷 PHY, MATENet 커넥터가 장착되어 있습니다. DP83TG720-EVM-AM2는 현재 TMDSCNCD263P 및 AM263Px MCU Plus (...)

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평가 보드

LP-AM263P — AM263Px Arm® 기반 MCU 범용 LaunchPad™ 개발 키트

LP-AM263P는 AM263Px 시리즈의 Sitara™ 고성능 마이크로컨트롤러(MCU)용 비용 최적화된 개발 보드입니다. 이 보드는 다음 애플리케이션을 개발할 수 있는 표준화되고 사용하기 쉬운 플랫폼을 제공하므로 초기 평가 및 프로토타이핑을 위해 개발되었습니다.

LP-AM263P에는 Sitara AM263P4 프로세서와 추가 부품이 포함되어 있어, 사용자가 산업용 이더넷(IE), 표준 이더넷, 고속 직렬 인터페이스(FSI) 등을 포함한 다양한 디바이스 인터페이스를 사용하여 프로토타입을 쉽게 제작할 수 있습니다. AM263P4는 (...)

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평가 보드

TMDSCNCD263P — AM263Px 범용 controlCARD™ 개발 키트 Arm® 기반 MCU

TMDSCNCD263P는 AM263x 시리즈 TI Sitara™ 고성능 마이크로컨트롤러용 HSEC180 controlCARD 기반 평가 및 개발 툴입니다. 이 보드는 다음 애플리케이션을 개발할 수 있는 표준화되고 사용하기 쉬운 플랫폼을 제공하므로 초기 평가 및 프로토타이핑에 이상적입니다. AM263P 제어 카드에는 PMIC 기반 전력 솔루션 및 추가 구성품과 함께 Sitara AM263P4 프로세서가 탑재되어 있어 사용자가 산업용 이더넷, 표준 이더넷, FSI(고속 직렬 인터페이스) 등을 포함한 다양한 디바이스 인터페이스를 (...)

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평가 보드

TMDSHSECDOCK-AM263 — GPMC, JTAG/TRACE, MCAN 및 LIN 신호용 AM263x-CC HSEC 도크 및 브레이크아웃 보드.

이 평가 모듈은 TMDSCNCD263(AM263x controlCARD) 및 TMDSCNCD263P(AM263Px controlCARD)용 HSEC(고속 에지 카드) 도크이며 키 I/O 및 하드웨어 주변 장치를 분해합니다. 이 보드에는 평가 및 개발 단계의 고객을 위한 AM263x 및 AM263Px에 대한 MCU+ SDK의 기능이 표시됩니다. TMDSHSECDOCK의 기능 외에도 이 보드에는 CAN/LIN, GPMC(AM263x만 해당), 추적 및 JTAG와 같은 추가 AM263x 및 AM263Px 제품군 기능에 대한 하드웨어 (...)
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도터 카드

TMDSHSECDOCK — HSEC180 controlCARD 베이스보드 도킹 스테이션

TMDSHSECDOCK은 호환 가능한 HSEC180 기반 controlCARD의 주요 신호에 대한 헤더 핀 액세스를 제공하 베이스 보드입니다. 신속한 프로토타이핑을 위해 브레드보드를 사용할 수 있습니다. 보드 전원은 USB 케이블 또는 5V 배럴 공급 장치로 공급할 수 있습니다.

사용 설명서: PDF | HTML
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디버그 프로브

TMDSEMU110-U — XDS110 JTAG 디버그 프로브

텍사스 인스트루먼트 XDS110은 TI 임베디드 프로세서를 위한 새로운 디버그 프로브(에뮬레이터)입니다. XDS110은 XDS100 제품군을 대체하면서 하나의 포드로 더 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을지원합니다. 또한 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)가 포함되어 있는 모든 Arm® 및 DSP 프로세서에서 코어(Core) 및 시스템 트레이스(System Trace)를 지원합니다.  핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

(...)
사용 설명서: PDF
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디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

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디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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디버그 프로브

LB-3P-TRACE32-ARM — Arm® 기반 마이크로컨트롤러 및 프로세서용 Lauterbach TRACE32® 디버그 및 트레이스 시스템

Lauterbach의 TRACE32® 툴은 개발자가 모든 종류의 Arm® 기반 마이크로컨트롤러 및 프로세서를 분석, 최적화 및 인증할 수 있도록 하는 첨단 하드웨어 및 소프트웨어 구성 요소 제품군입니다. 세계적으로 유명한 임베디드 시스템 및 SoC용 디버그 및 트레이스 솔루션은 초기 사전 실리콘 개발부터 현장의 제품 인증 및 문제 해결에 이르기까지 모든 개발 단계를 위한 완벽한 솔루션입니다. Lauterbach 툴의 직관적인 모듈형 설계는 엔지니어에게 현존하는 최고의 성능을 제공하고 요구 사항 변화에 따라 적응하고 성장하는 (...)

발송: Lauterbach GmbH
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디버그 프로브

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

발송: TASKING Germany GmbH
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소프트웨어 개발 키트(SDK)

AM263PX-MCAL-SDK — Microcontroller Abstraction Layer (MCAL) and Complex Device Drivers (CDD) for AM263PX

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
요청
소프트웨어 개발 키트(SDK)

AM263PX-RESTRICTED-SECURITY — AM263Px restricted security content

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
요청
소프트웨어 개발 키트(SDK)

MCU-PLUS-SDK-AM263PX — MCU+ SDK for AM263Px - RTOS, No-RTOS

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
찾아보기 다운로드 옵션
애플리케이션 소프트웨어 및 프레임워크

AM263PX-RESTRICTED-SAFETY — AM263Px restricted functional safety content

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
요청
시작하기

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작하기
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
온라인 교육

AM26X-ACADEMY — AM26x Academy

AM26x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
찾아보기
소프트웨어 프로그래밍 도구

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
지원 소프트웨어

MATHW-3P-AM26X-EC — 텍사스 인스트루먼트 AM26x MCU 임베디드 코더 지원 패지

TI는 다양한 AM26x 장치 및 평가 보드를 위한 모델 기반 설계 워크플로를 제공합니다.

AM26x controlCARD 및 LaunchPad 보드용 Embedded Coder® 지원 패키지를 사용하면 Simulink® 모델을 사용하여 AM26x 장치에서 알고리즘을 자동으로 빌드, 로드 및 실행할 수 있습니다.  Simulink에서 모델을 설계하고, 임베디드 코더를 사용하여 코드를 생성하고, 수동 프로그래밍을 사용하지 않고 실시간 제어 애플리케이션용으로 설계된 AM263x, AM263Px, AM261x 하드웨어 플랫폼에서 실행 (...)
발송: MathWorks, Inc.
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시뮬레이션 모델

AM263Px BSDL Model

SPRM835.ZIP (9 KB) - BSDL Model
다운로드
시뮬레이션 모델

AM263Px IBIS Model

SPRM834.ZIP (4124 KB) - IBIS Model
다운로드
시뮬레이션 모델

AM263Px Thermal Model

SPRM833.ZIP (6 KB) - Thermal Model
다운로드
계산 툴

AM263PX-PWR-EST-CALC — AM263Px power-estimation tool

The power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not ensured within a specified precision.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
레퍼런스 디자인

TIDA-020079 — 구역 레퍼런스 설계

이 레퍼런스 설계는 전력 분배, 부하 작동 및 차량 내 네트워킹을 비롯한 차세대 영역 제어 모듈의 주요 기능을 보여줍니다. 이 설계는 기능 안전 호환 PMIC 및 MCU(마이크로컨트롤러) 설계, 이상적인 다이오드 컨트롤러를 사용한 중복 전원 공급 장치 관리, 안전한 전력 분배를 위한 스마트 eFuse를 강조합니다. 또한 이 설계는 고압측 드라이버, 모터 드라이버, 구성 가능한 드라이버, 클래스 D 오디오 증폭기와 같은 구역 제어 모듈에서 예상되는 부하 작동을 위한 다양한 옵션을 제공합니다. 구역 레퍼런스 설계는 이더넷, CAN (...)
Design guide: PDF
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
NFBGA (ZCZ) 324 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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