TDA2E SoC Processors with Graphics and Video Acceleration for ADAS Applications (23mm Package) |

This product has been released to the market and is available for purchase. For some products, newer alternatives may be available.
SoC Processors with Graphics and Video Acceleration for ADAS Applications (23mm Package)


More Information

This product family is available for high volume automotive manufacturers. Please contact your TI sales representative for more details.

Learn more about the TDA2E SoC for advanced driver assistance systems (ADAS).


TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.


  • Architecture Designed for ADAS Applications
  • Video, Image, and Graphics Processing Support
    • Full-HD Video (1920 × 1080p, 60 fps)
    • Multiple Video Input and Video Output
  • Arm® Cortex®-A15 Microprocessor Subsystem
  • C66x Floating-Point VLIW DSP
    • Fully Object-Code Compatible With C67x and C64x+
    • Up to Thirty-two 16 × 16-Bit Fixed-Point Multiplies per Cycle
  • Up to 512KB of On-Chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) Interconnects
  • DDR3/DDR3L Memory Interface (EMIF) Module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB Across Single Chip Select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD Subsystem
  • Display Subsystem
    • Display Controller With DMA Engine and up to Three Pipelines
    • HDMI™ Encoder: HDMI 1.4a and DVI 1.0 Compliant
  • Single-Core PowerVR® SGX544 3D GPU
  • 2D-Graphics Accelerator (BB2D) Subsystem
    • Vivante® GC320 Core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) Module
    • Support for up to Four Multiplexed Input Ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) Controller
  • 2-Port Gigabit Ethernet (GMAC)
    • Up to Two External Ports, One Internal
  • Sixteen 32-Bit General-Purpose Timers
  • 32-Bit MPU Watchdog Timer
  • Six High-Speed Inter-Integrated Circuit (I2C) Ports
  • Ten Configurable UART/IrDA/CIR Modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI Interface (QSPI)
  • SATA Interface
  • Eight Multichannel Audio Serial Port (McASP) Modules
  • SuperSpeed USB 3.0 Dual-Role Device
  • High-Speed USB 2.0 Dual-Role Device
  • High-Speed USB 2.0 On-The-Go
  • Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
  • PCI Express® 3.0 Port With Integrated PHY
    • One 2-lane Gen2-Compliant Port
    • or Two 1-lane Gen2-Compliant Ports
  • Dual Controller Area Network (DCAN) Modules
    • CAN 2.0B Protocol
  • MIPI® CSI-2 Camera Serial Interface
  • Up to 215 General-Purpose I/O (GPIO) Pins
  • Real-Time Clock Subsystem (RTCSS)
  • Device Security Features
    • Hardware Crypto Accelerators and DMA
    • Firewalls
    • JTAG Lock
    • Secure Keys
    • Secure ROM and Boot
  • Power, Reset, and Clock Management
  • On-Chip Debug With CTools Technology
  • 28-nm CMOS Technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)

All trademarks are the property of their respective owners.


Compare all products in TDAx ADAS SoCs Email Download to Excel
Part number Order Arm CPU Arm MHz (Max.) DSP DSP MHz (Max) Graphics processing unit (GPU) GPU frequency (Max) (MHz) Hardware accelerators Co-processor(s) Features Security Other on-chip memory EMIF DRAM Storage interface SPI CSI-2 Display Parallel video input ports Ethernet MAC PCIe Serial I/O Rating McASP
TDA2E Order now 1 ARM Cortex-A15     800
1 C66x     750
1 GC320 2D
1 SGX544 3D    
1 Image Video Accelerator     4 ARM Cortex-M4     ASIL-B     Cryptographic acceleration
Debug security
Device identity
Isolation firewalls
Secure boot & storage & programming
Software IP protection    
512 KB     1 32-bit     DDR3-1333
1 eMMC
2 SDIO    
4 McSPI    
3 LCD OUT    
4     2-port 1Gb switch     2 PCIe Gen3     I2C
Automotive     8