首頁 微控制器 (MCU) 與處理器 微處理器和 DSP 汽車駕駛輔助 SoC
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微控制器 (MCU) 與處理器
微處理器和 DSP
汽車駕駛輔助 SoC

TDA3LA

現行

適用於 ADAS 應用且具有視覺加速功能的低功率 SoC

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產品規格表
勘誤表

TDA3LA

現行
產品規格表 立即訂購

產品詳細資料

Coprocessors 2 Arm Cortex-M4 Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE) Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
Coprocessors 2 Arm Cortex-M4 Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE) Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
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此產品系列適用於大量汽車製造商。如需詳細資訊，請與 TI 銷售代表聯繫。

技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) PDF | HTML 2020年 2月 4日
* Errata TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) 2019年 10月 1日
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 2020年 7月 24日
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 2020年 1月 6日
User guide TDA3x Technical Reference Manual (Rev. D) 2019年 7月 29日
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019年 6月 10日
Application note TDA3xx Tester On Chip (TESOC) (Rev. A) 2018年 10月 19日
Application note ECC/EDC on TDAxx (Rev. B) 2018年 6月 13日
Application note TMS320C66x XMC Memory Protection 2018年 1月 31日
Application note DSS Bit Exact Output (Rev. A) 2018年 1月 12日
Application note Flashing Utility - mflash 2018年 1月 9日
White paper Embedded low-power deep learning with TIDL 2017年 12月 8日
Application note Dynamic Backup Lines PDF | HTML 2017年 11月 14日
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 2017年 11月 7日
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 2017年 11月 3日
Application note DSS BT656 Workaround for TDA2x (Rev. A) 2017年 11月 3日
Functional safety information Safety Features on VisionSDK 2017年 10月 26日
Application note IISS Image Pipe for Alternate CFA Formats 2017年 8月 16日
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 2016年 12月 15日
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 2016年 8月 23日
Application note ADC as Voltage Monitoring in TDA3x 2016年 6月 20日
Application note TDA3xx ISS Tuning and Debug Infrastructure 2016年 6月 2日
Application note ADAS Power Management 2016年 3月 7日
White paper Multicore SoCs stay a step ahead of SoC FPGAs 2016年 2月 23日
Application note TDA3x Error Signaling Module (ESM) 2016年 1月 26日
White paper Surround view camera systems for ADAS (Rev. A) 2015年 10月 20日
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 2014年 8月 13日
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 2014年 4月 14日
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 2013年 10月 16日
White paper Empowering Automotive Vision with TI’s Vision AccelerationPac 2013年 10月 13日

設計與開發

電源供應解決方案

為 TDA3LA 尋找可用的電源供應解決方案。TI 提供適用於 TI 與非 TI 之系統單晶片 (SoC)、處理器、微控制器、感測器或現場可編程邏輯閘陣列 (FPGA) 的電源供應解決方案。

檢視解決方案
開發板

D3-3P-RVP-TDA3X — 適用於 TDA3 處理器的 D3 Embedded RVP-TDA3x 開發套件

RVP-TDA3x 是適用於低成本先進駕駛輔助系統 (ADAS) 的多攝影機平台。其包括視覺加速 Pac (EVE)，並且具備板載 ISP (影像訊號處理器)。其不包含 ARM 核心或編解碼器。開發套件支援四個攝影機輸入，但可以視需求自訂。套件購買包括軟體分發和一次性授權。應用包括前置或後置攝影機、2D/3D 環景、雷達、駕駛監控、攝影機監控系統 (CMS)/後視鏡取代方案。

從：D3 Embedded
造訪合作夥伴網站
開發板

TDA3XEVM — TDA3X 評估模組

The TDA3x evaluation module (EVM) is an evaluation platform designed to speed up development efforts and reduce time-to-market for ADAS applications. The EVM is based on the TDA3x SoC, which incorporates a heterogeneous, scalable architecture that includes a mixture of the following:

  • TI’s (...)
從：SVTRONICS INC
使用指南: PDF
View Options
偵錯探測器

LB-3P-TRACE32-DSP — 適用於數位訊號處理器 (DSP) 的 Lauterbach TRACE32 偵錯和追蹤系統

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)

從：Lauterbach GmbH
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開發套件

D3-3P-TDA3X-SK — 適用於 TDA3 處理器的 D3 Embedded DesignCore® TDA3x 汽車入門套件

桌上型入門套件可讓您在以生產為設計考量的電子平台上，評估嵌入式 ADAS 技術。其以德州儀器 TDA3x 先進視覺處理器為基礎，可同步擷取四個 FPD-Link III HD 資料串流 (視訊、雷達、光達等)，以進行即時視覺處理與分析。購買套件時會包含 TI 視覺 SDK 與 D3 Embedded 進階視覺軟體架構的軟體分發及單一使用授權。

從：D3 Embedded
造訪合作夥伴網站
軟體開發套件 (SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

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支援產品和硬體
下載選項
軟體開發套件 (SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

支援產品和硬體

支援產品和硬體
下載選項
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
作業系統 (OS)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

QNX Neutrino® 即時作業系統 (RTOS) 是一款功能完整且穩固的 RTOS，專為實現適用於汽車、醫療、運輸、軍事和工業嵌入式系統的新一代產品而設計。微核心設計與模組化架構，能讓客戶以低整體擁有成本打造高度最佳化且可靠的系統。
從：QNX Software Systems
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模擬型號

TDA3x BSDL Model

SPRM714.ZIP (9 KB) - BSDL Model
下載
模擬型號

TDA3x IBIS Model

SPRM702.ZIP (10940 KB) - IBIS Model
下載
模擬型號

TDA3x Thermal Model

SPRM701.ZIP (1 KB) - Thermal Model
下載
計算工具

CLOCKTREETOOL — 適用於 Sitara、車用、視覺分析和數位訊號處理器的時脈樹工具

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
使用指南: PDF
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCBGA (ABF) 367 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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