MSPM0G1106

現行

具有 64KB 快閃記憶體 32KB SRAM 2 個 12 位元 4Msps ADC、運算放大器的 80MHz Arm® Cortex®-M0+ MCU

產品詳細資料

Frequency (MHz) 80 Flash memory (kByte) 64 RAM (kByte) 32 ADC type 12-bit SAR Number of ADC channels 11, 16, 17 Number of GPIOs 28, 44, 60 UART 4 Number of I2Cs 2 SPI 2 Features 5-V-tolerant I/Os, DMA, General purpose, LIN, OpAmp, RTC Operating temperature range (°C) -40 to 105 Rating Catalog
Frequency (MHz) 80 Flash memory (kByte) 64 RAM (kByte) 32 ADC type 12-bit SAR Number of ADC channels 11, 16, 17 Number of GPIOs 28, 44, 60 UART 4 Number of I2Cs 2 SPI 2 Features 5-V-tolerant I/Os, DMA, General purpose, LIN, OpAmp, RTC Operating temperature range (°C) -40 to 105 Rating Catalog
LQFP (PM) 64 144 mm² 12 x 12 LQFP (PT) 48 81 mm² 9 x 9 VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RHB) 32 25 mm² 5 x 5
  • Core
    • Arm 32-bit Cortex-M0+ CPU with memory protection unit, frequency up to 80 MHz
  • Operating characteristics
    • Extended temperature: –40°C up to 105°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 128KB of flash memory with built-in error correction code (ECC)
    • Up to 32KB of SRAM with hardware parity
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 17 external channels
      • 14-bit effective resolution at 250-ksps with hardware averaging
    • One general-purpose amplifier (GPAMP)
    • Configurable 1.4-V or 2.5-V internal shared voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 96 µA/MHz (CoreMark)
    • SLEEP: 467 µA at 4 MHz
    • STOP: 46 µA at 32 kHz
    • STANDBY: 1.5 µA with RTC and SRAM retention
    • SHUTDOWN: 80 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • Two 16-bit advanced control timers support dead band insertion and fault handling
    • Seven timers supporting up to 22 PWM channels
      • One 16-bit general purpose timer
      • One 16-bit general purpose timer supports QEI
      • Two 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband
    • Two window-watchdog timers
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Four UART interfaces; one supports LIN, IrDA, DALI, Smart Card, Manchester, and three support low-power operation in STANDBY mode
    • Two I 2C interfaces supporting up to FM+ (1 Mbit/s), SMBus, PMBus, and wakeup from STOP mode
    • Two SPIs, one SPI supports up to 32 Mbits/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with up to ±3% accuracy (SYSOSC) across temperature
    • Phase-locked loop (PLL) up to 80 MHz
    • Internal 32-kHz oscillator (LFOSC)
    • External 4- to 48-MHz crystal oscillator (HFXT)
    • External 32-kHz crystal oscillator(LFXT)
    • External clock input
  • Data integrity and encryption
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 60 GPIOs
      • Two 5-V tolerant IOs
      • Two high-drive IOs with 20-mA drive strength
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 64-pin LQFP
    • 48-pin LQFP , VQFN
    • 32-pin VQFN
    • 28-pin VSSOP
    • 24-pin VQFN
  • Family members (also see Device Comparison)
    • MSPM0G1105: 32KB flash, 16KB RAM
    • MSPM0G1106: 64KB flash, 32KB RAM
    • MSPM0G1107: 128KB flash, 32KB RAM
  • Development kits and software (also see Tools and Software)
  • Core
    • Arm 32-bit Cortex-M0+ CPU with memory protection unit, frequency up to 80 MHz
  • Operating characteristics
    • Extended temperature: –40°C up to 105°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 128KB of flash memory with built-in error correction code (ECC)
    • Up to 32KB of SRAM with hardware parity
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 17 external channels
      • 14-bit effective resolution at 250-ksps with hardware averaging
    • One general-purpose amplifier (GPAMP)
    • Configurable 1.4-V or 2.5-V internal shared voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 96 µA/MHz (CoreMark)
    • SLEEP: 467 µA at 4 MHz
    • STOP: 46 µA at 32 kHz
    • STANDBY: 1.5 µA with RTC and SRAM retention
    • SHUTDOWN: 80 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • Two 16-bit advanced control timers support dead band insertion and fault handling
    • Seven timers supporting up to 22 PWM channels
      • One 16-bit general purpose timer
      • One 16-bit general purpose timer supports QEI
      • Two 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband
    • Two window-watchdog timers
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Four UART interfaces; one supports LIN, IrDA, DALI, Smart Card, Manchester, and three support low-power operation in STANDBY mode
    • Two I 2C interfaces supporting up to FM+ (1 Mbit/s), SMBus, PMBus, and wakeup from STOP mode
    • Two SPIs, one SPI supports up to 32 Mbits/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with up to ±3% accuracy (SYSOSC) across temperature
    • Phase-locked loop (PLL) up to 80 MHz
    • Internal 32-kHz oscillator (LFOSC)
    • External 4- to 48-MHz crystal oscillator (HFXT)
    • External 32-kHz crystal oscillator(LFXT)
    • External clock input
  • Data integrity and encryption
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 60 GPIOs
      • Two 5-V tolerant IOs
      • Two high-drive IOs with 20-mA drive strength
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 64-pin LQFP
    • 48-pin LQFP , VQFN
    • 32-pin VQFN
    • 28-pin VSSOP
    • 24-pin VQFN
  • Family members (also see Device Comparison)
    • MSPM0G1105: 32KB flash, 16KB RAM
    • MSPM0G1106: 64KB flash, 32KB RAM
    • MSPM0G1107: 128KB flash, 32KB RAM
  • Development kits and software (also see Tools and Software)

MSPM0G110x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 105°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0G110x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. The devices also incorporate a memory protection unit, 7-channel DMA, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar mode. These devices provide data integrity and encryption peripherals (CRC) and enhanced communication interfaces (four UART, two I2C, two SPI).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.

MSPM0G110x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 105°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0G110x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. The devices also incorporate a memory protection unit, 7-channel DMA, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar mode. These devices provide data integrity and encryption peripherals (CRC) and enhanced communication interfaces (four UART, two I2C, two SPI).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.

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MSPM0G1107 現行 具有 128KB 快閃記憶體 32KB SRAM 2 個 12 位元 4Msps ADC、運算放大器的 80MHz Arm® Cortex®-M0+ MCU With 128-KB flash memory

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類型 標題 日期
* Data sheet MSPM0G110xMixed-Signal Microcontrollers datasheet (Rev. C) PDF | HTML 2023年 10月 9日
* Errata MSPM0G350x, MSPM0G150x Mixed-Signal Microcontrollers Errata (Rev. A) PDF | HTML 2023年 10月 9日
* User guide MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual (Rev. B) PDF | HTML 2024年 11月 12日
Application note MSPM0G3507 Low Power Test and Guidance PDF | HTML 2024年 10月 18日
Application note MSPM0 ADC Noise Analysis and Application PDF | HTML 2024年 10月 15日
Application note Understanding the MSPM0 Debug Subsystem PDF | HTML 2024年 9月 23日
Application note MSPM0 Bootloader (BSL) Implementation (Rev. C) 2024年 9月 10日
Subsystem design DMA Ping Pong With ADC (Rev. A) 2024年 9月 6日
Subsystem design Data Sensor Aggregator Subsystem Design PDF | HTML 2024年 1月 5日
Subsystem design ADC to I2C PDF | HTML 2023年 12月 22日
Subsystem design ADC to SPI PDF | HTML 2023年 12月 22日
Subsystem design ADC to UART PDF | HTML 2023年 12月 22日
Application note Migration Guide From STM8 to MSPM0 PDF | HTML 2023年 12月 6日
Application note Operating Time of MSPM0 Powered by a Capacitor PDF | HTML 2023年 10月 3日
Application brief Build Scalability in Cordless Power and Garden Tools Using Low-Cost MSPM0 MCUs (Rev. A) PDF | HTML 2023年 9月 27日
Application brief Designing Single- and Three-Axis Selfie Sticks With MSPM0 MCUs (Rev. A) PDF | HTML 2023年 9月 21日
Application brief BLDC and PMSM Control Using Sensorless FOC Algorithm Based on MSPM0 MCUs (Rev. A) PDF | HTML 2023年 9月 14日
Application brief Using MSPM0 MCUs to Design Trapezoidal-Based BLDC Motor Controllers (Rev. A) PDF | HTML 2023年 9月 14日
Application note MSPM0 G 系列 MCU 硬體開發指南 (Rev. B) PDF | HTML 2023年 6月 28日
Application note EEPROM Emulation Type A Solution PDF | HTML 2023年 4月 18日
Application note 從 STM32 到 Arm 架構的 MSPM0 移轉指南 (Rev. A) PDF | HTML 2023年 4月 12日
Application note EEPROM Emulation Type B Design PDF | HTML 2023年 4月 11日
Application note MSPM0 MCU 快速參考指南 (Rev. A) PDF | HTML 2023年 4月 11日
Application brief Designing Single- and Three-Axis Selfie Sticks With MSPM0 MCUs PDF | HTML 2023年 3月 2日
Application brief Increasing Flexibility in Your Battery Management Designs With a Low-Cost MSPM0 PDF | HTML 2023年 3月 2日
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A) PDF | HTML 2023年 3月 2日
Application brief Optimizing Field Sensor and Transmitter Applications With MSPM0 MCUs PDF | HTML 2023年 3月 2日
Application brief Simplifying Pulse Oximeter Designs With Low-Cost Highly Integrated MSPM0 MCUs PDF | HTML 2023年 3月 2日
Subsystem design 5-V Interface PDF | HTML 2023年 3月 1日
Subsystem design Common Amplifier Topologies: PGA PDF | HTML 2023年 3月 1日
Subsystem design LED Driver With PWM PDF | HTML 2023年 3月 1日
Subsystem design Thermistor Temperature Sensing PDF | HTML 2023年 2月 28日
Subsystem design Transimpedance Amplifier PDF | HTML 2023年 2月 28日
Application note Cybersecurity Enablers in MSPM0 MCUs PDF | HTML 2023年 2月 22日
Application note MSPM0 G-Series MCUs Power Optimization Guide PDF | HTML 2023年 2月 22日
White paper MSPM0: Idea to Product With Easy-to-Use Tools, Software, and Academy PDF | HTML 2023年 2月 22日
Application note Make System Design Easy With MSPM0 Precision Analog PDF | HTML 2023年 2月 22日
Product overview MSPM0 MCU:更多選項,無限可能 PDF | HTML 2023年 1月 24日
Application note MSPM0L or MSPM0G: How to Pick the Right MSP Microcontroller for Your Application PDF | HTML 2022年 12月 13日
Subsystem design MCU Design Techniques: ADC to PWM PDF | HTML 2022年 10月 12日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-MSPM0G3507 — 適用於 80-MHz Arm® Cortex®-M0+ MCU 的 MSPM0G3507 LaunchPad™ 開發套件

LP-MSPM0G3507 LaunchPad™ 開發套件是基於 MSPM0G3507 的易用型評估模組 (EVM)。其包含開始在 MSPM0G3507 M0+ MCU 平台上開發所需的一切,包括用於編程、偵錯和能源量測的板載偵錯探測器。電路板包含三個按鈕、兩個 LED (一個是 RGB LED) 和一個類比溫度感測器和光感測器。此外也具備外部緩衝器,可在 4 MSPS 顯示高速 ADC 性能。

使用指南: PDF | HTML
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開發板

BRDWY-3P-BA620XX — 適用按摩椅應用的 Broadway Technology Jiangsu BA620XX 控制板

Broadway Technology (Jiangsu) BA620XX 按摩椅控制電路板以 MSPM0G1106 裝置作為核心 MCU,控制 DRV8251 及其他馬達驅動裝置,並為 2D 與 3D 按摩椅提供核心電子控制系統。

BA62038 支援 5 向馬達、氣泵、加熱裝置控制、10 向氣閥控制及透過序列通訊的多通道控制電路板。

BA62042 支援 8 向馬達、氣泵、加熱裝置控制、8 向氣閥控制及透過序列通訊的多通道控制電路板。

偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別,適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列,可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。此外,所有 XDS 偵錯探測器均支援具嵌入式追踪緩衝區 (ETB) 的 Arm® 與 DSP 處理器中的核心和系統追蹤功能。透過針腳進行核心追蹤則需要 XDS560v2 PRO TRACE

德州儀器 XDS110 透過 TI 20 針腳連接器 (配備適用 TI 14 針腳、Arm 10 針腳和 Arm 20 針腳的多重轉接器) (...)

使用指南: PDF
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硬體程式設計工具

MSP-GANG — MSP-GANG 生產程式設計工具

MSP Gang 程式設計工具 (MSP-GANG) 是 MSPM0/MSP430™/MSP432™ 裝置的程式設計工具,可同時編程多達八個相同 MSPM0/MSP430/MSP432 快閃記憶體或 FRAM 裝置。它使用標準 RS-232 或 USB 連線連接到主機 PC,並提供靈活的程式設計選項,可讓使用者完全自訂過程。

使用指南: PDF | HTML
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驅動程式或資料庫

MSPM0-DIAGNOSTIC-LIB — 適合功能安全應用的 MSPM0 診斷資料庫

MSPM0 診斷資料庫軟體開發套件 (SDK) 是一系列功能安全軟體,可協助客戶滿足功能安全診斷需求。
使用指南: PDF | HTML
使用指南: PDF | HTML
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ 整合式開發環境 (IDE)

Code Composer Studio 是適用於 TI 微控制器與處理器的整合式開發環境 (IDE)。其包含一組用於開發及偵錯嵌入式應用程式的工具。 Code Composer Studio 可於 Windows®、Linux® 和 macOS® 桌上型電腦下載。您也可造訪 TI 開發人員專區以在雲端使用此工具。

Code Composer Studio 包含最佳化 C/C++編譯器、原始碼編輯器、專案建立環境、偵錯器、性能評測工具及許多其他功能。直覺式 IDE 可帶領您完成應用程式開發流程的每個步驟。熟悉的工具和介面讓您更容易上手。

Code Composer Studio 結合 (...)

使用指南: PDF | HTML
軟體程式設計工具

UNIFLASH — UniFlash 快閃記憶體編程工具

UniFlash 是一套軟體工具,可在 TI 微控制器和無線連線裝置上編程晶片快閃記憶體,也適用 TI 處理器的板載快閃記憶體。UniFlash 提供圖形和命令列介面。

UniFlash 可從 TI 開發人員區執行雲端,或在下載後於 Windows®、Linux® 及 macOS® 電腦中使用。

支援裝置:CC13xx、CC23xx、CC25xx、CC26xx、CC32xx、C2000™ 微控制器、MSP430™ 微控制器、MSP432™ 微控制器、MSPM0、TM4C、Hercules™ (...)

設計工具

MSP-3P-SEARCH — MSP 第三方搜尋工具

TI has partnered with multiple companies to offer a wide range of solutions and services for TI MSP devices. These companies can accelerate your path to production using MSP devices. Download this search tool to quickly browse third-party details and find the right third-party to meet your needs.

(...)

參考設計

TIDA-010944 — 單相與分相分流能源量測參考設計

此參考設計使用一個含兩個分流的隔離式與非隔離式獨立多通道類比轉數位轉換器 (ADC),實作具有中性或分相能源量測子系統的單相。分流感測器與低功率線性 3D 霍爾效應感測器 (TMAG5273) 的組合,可提供安全防護和偵測磁性篡改攻擊。此參考設計可在 4000:1 輸入範圍 (25mA 至 100A) 中達到 0.2 S 級準確度,且取樣率為 4kHz,並使用 TI Arm® Cortex®-M0+ 主機微控制器來計算量測參數。必要的軟體功能實作於 MSPM0-SDK 版本:2.01.00.03 中,並且可透過 Code Composer Studio™ 編譯。
Design guide: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
LQFP (PM) 64 Ultra Librarian
LQFP (PT) 48 Ultra Librarian
VQFN (RGZ) 48 Ultra Librarian
VQFN (RHB) 32 Ultra Librarian

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  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
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