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微控制器 (MCU) 與處理器
微處理器和 DSP
汽車駕駛輔助 SoC

TDA2E

現行

適用 ADAS 應用且具圖形與視訊加速的 SoC 處理器 (23mm 封裝)

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勘誤表

TDA2E

現行
產品規格表

產品詳細資料

Operating temperature range (°C) to
Operating temperature range (°C) to
  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR® SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports, one internal
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI™)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 Port with integrated PHY
    • One 2-lane gen2-compliant port
    • or Two 1-lane gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Real-Time Clock subsystem (RTCSS)
  • Device Security Features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)
  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR® SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports, one internal
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI™)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 Port with integrated PHY
    • One 2-lane gen2-compliant port
    • or Two 1-lane gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Real-Time Clock subsystem (RTCSS)
  • Device Security Features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm® Cortex®-A15 MPCore™ and dual-Arm® Cortex®-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm® and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm® Cortex®-A15 MPCore™ and dual-Arm® Cortex®-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm® and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.
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此產品系列適用於大量汽車製造商。如需詳細資訊，請與 TI 銷售代表聯繫。

進一步了解先進駕駛輔助系統 (ADAS) 的 TDA2E SoC。

技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) 23mm Package (ABC Package) Silicon Revision 2.0 and 2.1 datasheet (Rev. H) PDF | HTML 2019年 7月 24日
* Errata TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) Silicon Errata (Rev. E) PDF | HTML 2024年 9月 8日
White paper Paving the way to self-driving cars with ADAS (Rev. A) 2020年 7月 24日
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 2020年 7月 24日
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 2020年 1月 6日
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019年 6月 10日
User guide TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) TRM (Rev. D) 2019年 5月 21日
Application note The Implementation of YUV422 Output for SRV 2018年 8月 2日
Application note MMC DLL Tuning (Rev. B) 2018年 7月 31日
Application note Integrating AUTOSAR on TI SoC: Fundamentals 2018年 6月 18日
Application note ECC/EDC on TDAxx (Rev. B) 2018年 6月 13日
User guide TPS65917-Q1 User’s Guide to Power DRA7xx and TDA2x/TDA2Ex (Rev. F) 2018年 5月 7日
User guide TPS65919-Q1 and TPS65917-Q1 User's Guide to Power DRA71x, DRA79x, and TDA2E-17 (Rev. E) 2018年 5月 7日
Application note Sharing VPE Between VISIONSDK and PSDKLA 2018年 5月 4日
Application note TMS320C66x XMC Memory Protection 2018年 1月 31日
Application note DSS Bit Exact Output (Rev. A) 2018年 1月 12日
Application note Flashing Utility - mflash 2018年 1月 9日
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 2017年 11月 7日
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 2017年 11月 3日
Application note DSS BT656 Workaround for TDA2x (Rev. A) 2017年 11月 3日
Functional safety information Safety Features on VisionSDK 2017年 10月 26日
Application note Optimization of GPU-Based Surround View on TI’s TDA2x SoC 2017年 9月 12日
White paper Step into next-gen architectures for multi-camera operations in automobiles 2017年 6月 16日
White paper Making Cars Safer Through Technology Innovation (Rev. A) 2017年 6月 7日
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 2016年 12月 15日
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 2016年 8月 23日
Application note ADAS Power Management 2016年 3月 7日
White paper Multicore SoCs stay a step ahead of SoC FPGAs 2016年 2月 23日
User guide Vision Application Board User's Guide 2016年 2月 9日
Technical article If seeing is believing… Surround Viewing is experiencing! PDF | HTML 2015年 10月 26日
White paper Surround view camera systems for ADAS (Rev. A) 2015年 10月 20日
Product overview TDA2Eco ADAS System-on-chip Family 2015年 10月 12日
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 2014年 8月 13日
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 2014年 4月 14日
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 2013年 10月 16日

設計與開發

電源供應解決方案

為 TDA2E 尋找可用的電源供應解決方案。TI 提供適用於 TI 與非 TI 之系統單晶片 (SoC)、處理器、微控制器、感測器或現場可編程邏輯閘陣列 (FPGA) 的電源供應解決方案。

檢視解決方案
開發套件

D3-3P-RVP-TDA2X — 適用於 TDA2 處理器的 D3 Embedded DesignCore® RVP-TDA2x 開發套件

RVP-TDA2x 是用於高階 ADAS 系統的多攝影機平台。它包括兩個 ARM A15 應用處理器、最多四個視覺加速 Pac (EVE) 協同處理器和一個硬體加速的 H.264 編碼器。開發套件支援八個攝影機輸入，但可以視需求自訂。套件購買包括軟體分發和一次性授權。

從：D3 Embedded
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軟體開發套件 (SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

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程式碼範例或展示

D3-3P-DEV — 適用於 AI 相機、硬體、驅動程式與韌體的 D3 Embedded 支援

D3 Embedded 是一家總部位於美國的公司，專注於為高效能應用方式提供整合視覺和毫米波雷達感應、連結、嵌入式處理和人工智慧的端到端解決方案。D3 Embedded 擁有超過 25 年的開發經驗，提供客製化軟體和硬體的開發服務、ISP 架構影像調整、AI 和演算法以及複雜的 DSP 處理鏈開發服務。他們的專業雷達和 DSP 團隊專注於為德州儀器的應用特定處理器提供客製化軟體，其中包括功能強大的全新 C7x DSP。
從：D3 Embedded
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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)

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IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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作業系統 (OS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
從：Green Hills Software
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模擬型號

TDA2Ex BSDL

SPRM686.ZIP (13 KB) - BSDL Model
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模擬型號

TDA2Ex IBIS

SPRM685.ZIP (12620 KB) - IBIS Model
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模擬型號

TDA2Ex Thermal Model

SPRM682.ZIP (1 KB) - Thermal Model
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模擬型號

TDA2Ex-17 BSDL Model (Rev. A)

SPRM698A.ZIP (15 KB) - BSDL Model
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模擬型號

TDA2Ex-17 IBIS Model

SPRM700.ZIP (9618 KB) - IBIS Model
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模擬型號

TDA2Ex-17 Thermal Model

SPRM699.ZIP (2 KB) - Thermal Model
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計算工具

CLOCKTREETOOL — 適用於 Sitara、車用、視覺分析和數位訊號處理器的時脈樹工具

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
使用指南: PDF
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