產品詳細資料

Protocols 6LoWPAN, MIOTY, Proprietary, TI 15.4, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 143-176, 287-351, 359-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 40 Flash memory (kByte) 352 CPU Arm® Cortex®-M4 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, 8-bit DAC, I2C, I2S Number of GPIOs 30 RX current (lowest) (mA) 5.4 Rating Catalog Operating temperature range (°C) -40 to 105
Protocols 6LoWPAN, MIOTY, Proprietary, TI 15.4, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 143-176, 287-351, 359-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 40 Flash memory (kByte) 352 CPU Arm® Cortex®-M4 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, 8-bit DAC, I2C, I2S Number of GPIOs 30 RX current (lowest) (mA) 5.4 Rating Catalog Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RKP) 40 25 mm² 5 x 5

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.63 mA active mode, CoreMark
    • 55 µA/MHz running CoreMark
    • 0.7 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 5.4 mA RX at 868 MHz
    • 24.9 mA TX at +14 dBm at 868 MHz

Wireless protocol support

High performance radio

  • -121 dBm for 2.5-kbps long-range mode
  • -120 dBm at 4.8 kbps narrowband mode, 433 MHz
  • -118 dBm at 9.6 kbps narrowband mode, 868 MHz
  • -110 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +14 dBm with temperature compensation
  • Down to 4 kHz receiver filter bandwidth

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • 5-mm × 5-mm RKP VQFN40 (22 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.63 mA active mode, CoreMark
    • 55 µA/MHz running CoreMark
    • 0.7 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 5.4 mA RX at 868 MHz
    • 24.9 mA TX at +14 dBm at 868 MHz

Wireless protocol support

High performance radio

  • -121 dBm for 2.5-kbps long-range mode
  • -120 dBm at 4.8 kbps narrowband mode, 433 MHz
  • -118 dBm at 9.6 kbps narrowband mode, 868 MHz
  • -110 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +14 dBm with temperature compensation
  • Down to 4 kHz receiver filter bandwidth

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • 5-mm × 5-mm RKP VQFN40 (22 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC1311R3 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The CC1311R3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC1311R3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143 to 176-MHz, 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. The CC1311R3 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA current consumption. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.

The CC1311R3 has a low sleep current of 0.7 µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1311R3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1311R3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC1311R3 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The CC1311R3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC1311R3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143 to 176-MHz, 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. The CC1311R3 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA current consumption. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.

The CC1311R3 has a low sleep current of 0.7 µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1311R3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1311R3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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技術文件

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類型 標題 日期
* Data sheet CC1311R3 SimpleLink™ High-Performance Sub-1 GHz Wireless MCU datasheet PDF | HTML 2022年 3月 4日
* Errata CC1311R3 Silicon Errata PDF | HTML 2022年 2月 25日
* User guide CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 2022年 5月 11日
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024年 8月 6日
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 2024年 5月 2日
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 2024年 4月 9日
Application note TI 15.4-Stack Software PDF | HTML 2023年 10月 17日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 2022年 2月 7日
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 2021年 6月 4日
Application note RF PCB Simulation Cookbook 2019年 1月 9日
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017年 2月 28日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發套件

LP-CC1311P3 — 適合 SimpleLink™ sub-1-GHz 無線 MCU 的 CC1311P3 LaunchPad™ 開發套件

此 LaunchPad™ 開發套件可用來加快 SimpleLink™ sub-1-GHz 無線 MCU 的開發,並支援 TI 15.4 堆疊與專利 RF 通訊協定。CC13XX-CC26XX 軟體開發套件 (SDK) 提供軟體支援。

TI.com 無法提供
開發套件

LP-CC1312R7 — 適用 SimpleLink™ 多標準無線 MCU 的 CC1312R7 LaunchPad™ 開發套件

此 LaunchPad™ 開發套件可加快 SimpleLink™ Sub-1 GHz CC1312R7 無線 MCU 開發速度。軟體支援由 SIMPLELINK-LOWPOWER-SDK 軟體開發套件提供。

TI.com 無法提供
開發套件

KNGRY-3P-MICROPHONE — 適用於 CC1311 和 CC1312 的廣州晶銳信息技術有限公司無線數位麥克風

WA12XX 系列為 UHF 高性能數位無線麥克風系統、整合無線麥克風、雷射指標、PPT 翻頁器及其它功能。它可以自動搜尋環境中的乾淨頻道以供使用、快速鎖定頻道,並消除干擾。同時,還配有 IR 頻率配對模式,可承受嚴苛的使用環境。此系列產品採用 UHF 頻帶運作,完全避免 Wifi /2.4G/700MHz/5.8G 干擾。

軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-SDK — SimpleLink™ 低功耗軟體開發套件 (SDK)

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx 及 CC26xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件,包括在 SimpleLink CC13xx、CC23xx 和 CC26xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。
IDE、配置、編譯器或偵錯程式

ARM-CGT — Arm® 程式碼產生工具 - 編譯器

TI Arm® 程式碼產生 (編譯器) 工具支援基於 TI Arm 的平台開發應用程式,尤其是採用 TI Arm Cortex-M 和 Cortex-R 系列裝置的平台。

目前的工具 (ARM-CGT-CLANG) 源自於開源 Clang 編譯器及其支援的 LLVM 基礎架構。舊版專有 (ARM-CGT) 工具處於維護狀態,並將視需要提供錯誤修復。請參閱所使用的軟體開發套件 (SDK) 文件,以確認支援哪些編譯器。一般而言,基於 Clang 的編譯器用於新產品。 

Code Composer Studio™ 是適用於 TI 嵌入式裝置的整合式開發環境 (...)

使用指南: PDF | HTML
軟體程式設計工具

UNIFLASH — UniFlash 快閃記憶體編程工具

UniFlash 是一套軟體工具,可在 TI 微控制器和無線連線裝置上編程晶片快閃記憶體,也適用 TI 處理器的板載快閃記憶體。UniFlash 提供圖形和命令列介面。

UniFlash 可從 TI 開發人員區執行雲端,或在下載後於 Windows®、Linux® 及 macOS® 電腦中使用。

支援裝置:CC13xx、CC23xx、CC25xx、CC26xx、CC32xx、C2000™ 微控制器、MSP430™ 微控制器、MSP432™ 微控制器、MSPM0、TM4C、Hercules™ (...)

封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RGZ) 48 Ultra Librarian
VQFN (RKP) 40 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

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若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

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