產品詳細資料

CPU 2 Arm Cortex-A53, 4 Arm Cortex-A53 Frequency (MHz) 1400 Coprocessors 1 Arm Cortex-R5F Graphics acceleration 1 3D Display type 1 DSI, MIPI DPI, OLDI Protocols Ethernet, TSN Hardware accelerators CPU only, Video decode accelerator, Video encode accelerator Features General purpose Operating system Android, Linux Security Secure boot TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution TPS65224-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled Yes
CPU 2 Arm Cortex-A53, 4 Arm Cortex-A53 Frequency (MHz) 1400 Coprocessors 1 Arm Cortex-R5F Graphics acceleration 1 3D Display type 1 DSI, MIPI DPI, OLDI Protocols Ethernet, TSN Hardware accelerators CPU only, Video decode accelerator, Video encode accelerator Features General purpose Operating system Android, Linux Security Secure boot TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution TPS65224-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled Yes
FCBGA (AMH) 466 289 mm² 17 x 17

Processor Cores:

  • Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
    • 512KB SRAM with SECDED ECC
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories

Multimedia:

  • Display subsystem
    • Triple display support over OLDI (LVDS) (1x OLDI-DL, 1x or 2x OLDI-SL), DSI or DPI
      • OLDI-SL (Single Link): up to 1920 x 1080 at 60fps (165MHZ Pixel Clock)
      • OLDI-DL (Dual Link): up to 3840 x 1080 at 60fps (150MHz Pixel Clock)
      • MIPI DSI: with 4 Lane MIPI® D-PHY supports up to 3840 x 1080 at 60fps (300MHz Pixel Clock)
      • DPI (24-bit RGB parallel interface): up to 1920 x 1080 at 60fps (165MHz pixel clock)
    • Four display pipelines with hardware overlay support. A maximum of two display pipelines may be used per display.
    • Supports safety features such as freeze frame detection and data correctness check
  • 3D Graphics Processing Unit
    • IMG BXS-4-64 with 256KB cache
    • Up to 50GFLOPS
    • Single shader core
    • OpenGL ES3.2 and Vulkan 1.2 API support
  • One Camera Serial Interface (CSI-2) Receiver with 4 Lane D-PHY
    • MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 2.5Gbps per lane
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA
  • Video Encoder/Decoder
    • Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
    • Support for H.264 BaseLine/Main/High Profiles at Level 5.2
    • Support for up to 4K UHD resolution (3840 × 2160)
      • Up to 300MPixels/s operation, with reduced clocking options available for lower power applications with lower performance needs

Memory Subsystem:

  • Up to 1.09MB of On-chip RAM
    • 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device Manager Subsystem
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4 memory type
    • 32-bit data bus with inline ECC
    • Supports speeds up to 3733MT/s
    • Max size of 8GB

Functional Safety:

  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation will be available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL 3 targeted
    • Hardware Integrity up to SIL 2 targeted
    • Safety-related certification
      • IEC 61508 by TÜV SÜD planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TÜV SÜD planned
  • AEC - Q100 qualified [Automotive]

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time Sensitive Networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 4x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN-FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interfaces
    • 1x 8-bit eMMC interface up to:
      • HS200 for non-Q1 devices
      • HS400 for Q1 devices
    • 2x 4-bit SD/SDIO interfaces up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH code to support 4-, 8-, or 16-bit ECC
    • Uses Hamming code to support 1-bit ECC
    • Error Locator Module (ELM)
      • Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
      • Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR Flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low-power modes supported by Device Manager:
    • Partial IO support for CAN/GPIO/UART wakeup
    • I/O Only + DDR in Self Refresh for Suspend to RAM
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling

Optimal Power Management Solution:

  • Recommended TI Power Management ICs (PMIC)
    • Supports up to Automotive ASIL-B functional safety when powering the AEC – Q100 qualified AM62P-Q1 device
    • Supports up to SIL-2 functional safety industrial applications when powering the AM62P device
    • Companion PMIC is specially designed to meet power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass storage
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16nm FinFET technology
  • 17mm x 17mm, 0.65/0.8mm pitch with VCA, 466-pin FCBGA

Processor Cores:

  • Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
    • 512KB SRAM with SECDED ECC
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories

Multimedia:

  • Display subsystem
    • Triple display support over OLDI (LVDS) (1x OLDI-DL, 1x or 2x OLDI-SL), DSI or DPI
      • OLDI-SL (Single Link): up to 1920 x 1080 at 60fps (165MHZ Pixel Clock)
      • OLDI-DL (Dual Link): up to 3840 x 1080 at 60fps (150MHz Pixel Clock)
      • MIPI DSI: with 4 Lane MIPI® D-PHY supports up to 3840 x 1080 at 60fps (300MHz Pixel Clock)
      • DPI (24-bit RGB parallel interface): up to 1920 x 1080 at 60fps (165MHz pixel clock)
    • Four display pipelines with hardware overlay support. A maximum of two display pipelines may be used per display.
    • Supports safety features such as freeze frame detection and data correctness check
  • 3D Graphics Processing Unit
    • IMG BXS-4-64 with 256KB cache
    • Up to 50GFLOPS
    • Single shader core
    • OpenGL ES3.2 and Vulkan 1.2 API support
  • One Camera Serial Interface (CSI-2) Receiver with 4 Lane D-PHY
    • MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 2.5Gbps per lane
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA
  • Video Encoder/Decoder
    • Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
    • Support for H.264 BaseLine/Main/High Profiles at Level 5.2
    • Support for up to 4K UHD resolution (3840 × 2160)
      • Up to 300MPixels/s operation, with reduced clocking options available for lower power applications with lower performance needs

Memory Subsystem:

  • Up to 1.09MB of On-chip RAM
    • 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device Manager Subsystem
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4 memory type
    • 32-bit data bus with inline ECC
    • Supports speeds up to 3733MT/s
    • Max size of 8GB

Functional Safety:

  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation will be available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL 3 targeted
    • Hardware Integrity up to SIL 2 targeted
    • Safety-related certification
      • IEC 61508 by TÜV SÜD planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TÜV SÜD planned
  • AEC - Q100 qualified [Automotive]

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time Sensitive Networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 4x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN-FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interfaces
    • 1x 8-bit eMMC interface up to:
      • HS200 for non-Q1 devices
      • HS400 for Q1 devices
    • 2x 4-bit SD/SDIO interfaces up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH code to support 4-, 8-, or 16-bit ECC
    • Uses Hamming code to support 1-bit ECC
    • Error Locator Module (ELM)
      • Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
      • Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR Flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low-power modes supported by Device Manager:
    • Partial IO support for CAN/GPIO/UART wakeup
    • I/O Only + DDR in Self Refresh for Suspend to RAM
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling

Optimal Power Management Solution:

  • Recommended TI Power Management ICs (PMIC)
    • Supports up to Automotive ASIL-B functional safety when powering the AEC – Q100 qualified AM62P-Q1 device
    • Supports up to SIL-2 functional safety industrial applications when powering the AM62P device
    • Companion PMIC is specially designed to meet power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass storage
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16nm FinFET technology
  • 17mm x 17mm, 0.65/0.8mm pitch with VCA, 466-pin FCBGA

The AM62Px (P = Plus) is an extension of the existing Sitara™ AM62x low-cost family of application processors built for high-performance embedded 3D display applications. Scalable Arm® Cortex®-A53 performance and embedded features, such as: multi-screen high-definition display support, 3D-graphics acceleration, 4K video acceleration, and extensive peripherals make the AM62Px well-suited for a broad range of automotive and industrial applications, including automotive digital instrumentation, automotive displays, industrial HMI, and more.

Key features and benefits:

  • Focus on innovation and fast development with Linux and Android™ SDKs accompanied with real-time functional safety and security SDKs.
  • Address next wave of HMI designs with new generation of 3D GPU and 4K video acceleration.
  • Enhance your design connectivity with an extensive set of automotive and high-speed IOs, including: 4x CAN-FD, 3-port Gigabit Ethernet switch (two external ports) with TSN support, and two USB2.0 ports.
  • Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
  • Provides intelligent features, such as: facial recognition and touchless HMI with Arm® Cortex®-A53 CPUs and open-source AI software and tools

The AM62Px processors comply with the AEC - Q100 automotive standard and support industrial-grade. ASIL-B and SIL-2 functional safety requirements can be addressed using an integrated Arm Cortex-R5F core and dedicated peripherals, which can all be isolated from the rest of the processor.

Products in the AM62Px processor family:

AM62P-Q1 – Automotive digital instrumentation SoC with scalable Arm Cortex-A53 performance, multi high-definition display support, 3D GPU and 4K video acceleration.

Featured design resources:

  • Hardware Evaluation Module (EVM) - SK-AM62P-LP
  • Software Development Kit (SDK) - PROCESSOR-SDK-AM62P
  • Linux Academy

The AM62Px (P = Plus) is an extension of the existing Sitara™ AM62x low-cost family of application processors built for high-performance embedded 3D display applications. Scalable Arm® Cortex®-A53 performance and embedded features, such as: multi-screen high-definition display support, 3D-graphics acceleration, 4K video acceleration, and extensive peripherals make the AM62Px well-suited for a broad range of automotive and industrial applications, including automotive digital instrumentation, automotive displays, industrial HMI, and more.

Key features and benefits:

  • Focus on innovation and fast development with Linux and Android™ SDKs accompanied with real-time functional safety and security SDKs.
  • Address next wave of HMI designs with new generation of 3D GPU and 4K video acceleration.
  • Enhance your design connectivity with an extensive set of automotive and high-speed IOs, including: 4x CAN-FD, 3-port Gigabit Ethernet switch (two external ports) with TSN support, and two USB2.0 ports.
  • Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
  • Provides intelligent features, such as: facial recognition and touchless HMI with Arm® Cortex®-A53 CPUs and open-source AI software and tools

The AM62Px processors comply with the AEC - Q100 automotive standard and support industrial-grade. ASIL-B and SIL-2 functional safety requirements can be addressed using an integrated Arm Cortex-R5F core and dedicated peripherals, which can all be isolated from the rest of the processor.

Products in the AM62Px processor family:

AM62P-Q1 – Automotive digital instrumentation SoC with scalable Arm Cortex-A53 performance, multi high-definition display support, 3D GPU and 4K video acceleration.

Featured design resources:

  • Hardware Evaluation Module (EVM) - SK-AM62P-LP
  • Software Development Kit (SDK) - PROCESSOR-SDK-AM62P
  • Linux Academy

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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet AM62Px Sitara™ Processors datasheet (Rev. C) PDF | HTML 2025年 10月 24日
* Errata AM62Px Sitara™ Processors Silicon Errata (Rev. B) PDF | HTML 2025年 10月 31日
* User guide AM62Px Sitara™ Processors Technical Reference Manual (Rev. D) 2026年 2月 5日
Application note AM62Px eMMC Board Design and Layout Guidelines PDF | HTML 2026年 1月 27日
Application note Linux Audio on Sitara Socs PDF | HTML 2025年 12月 12日
User guide Hardware Design Considerations for Custom Board Using AM62P, AM62P-Q1 Family of Processors (Rev. C) PDF | HTML 2025年 10月 24日
Application note Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. H) PDF | HTML 2025年 10月 17日
User guide AM62P, AM62P-Q1 Processor Family Schematic, Design Guidelines and Review Checklist (Rev. B) PDF | HTML 2025年 9月 17日
User guide AM62x, AM62Ax, AM62D-Q1 and AM62Px Processor Family Schematic, Design Guidelines and Review Checklist (Rev. I) PDF | HTML 2025年 9月 17日
Application note AM62x, AM62Ax, AM62Px, AM62Lx Spread-Spectrum Clocking PDF | HTML 2025年 9月 8日
Application note Custom Board Design and Simulation Guidelines for Processor High Speed Parallel Interfaces (Rev. A) PDF | HTML 2025年 9月 5日
Functional safety information AM6x, AM24x Software Diagnostics Library TÜV SÜD Functional Safety Certificate for 9.2.0 SDK (Rev. A) 2025年 7月 17日
Application note MCAN Debug Guide PDF | HTML 2025年 2月 18日
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 2025年 1月 28日
Application note AM62Ax, AM62Px LPDDR4 Board Design and Layout Guidelines (Rev. B) PDF | HTML 2024年 12月 17日
User guide AM62P Power Estimation Tool User's Guide PDF | HTML 2024年 9月 24日
Application note Minimal Platform Development on AM62x Devices (Rev. A) PDF | HTML 2024年 9月 24日
Application note Sitara AM62P Benchmarks (Rev. A) PDF | HTML 2024年 8月 13日
Product overview PMIC for Powering AM62Px Devices PDF | HTML 2024年 3月 14日
Application note Developing Multiple-Camera Applications on AM6x (Rev. A) PDF | HTML 2024年 2月 14日
Application note AM62Px Escape Guidelines (Rev. B) PDF | HTML 2024年 1月 11日
Application note Multimedia Applications on AM62A PDF | HTML 2023年 11月 29日
Application note Using TSN Ethernet Features to Improve Timing in Industrial Ethernet Controllers PDF | HTML 2023年 11月 15日
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023年 2月 24日

設計與開發

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開發板

SK-AM62P-LP — AM62P 入門套件評估模組

SK-AM62P-LP 入門套件 (SK) 評估模組 (EVM) 是完全依照我們的 AM62P 顯示處理器打造,其中包含可擴充的 Arm® Cortex®-A53 性能與嵌入式功能,例如三重高解析度顯示支援、高性能 3D-GPU、4K 視訊加速及廣泛的延伸周邊設備。SK-AM62P-LP 適用於尋求開發汽車與工業應用,包含車用數位儀器、車用顯示器、工業 HMI 等。

SK-AM62P-LP 包含多個支援多達 3 個螢幕的顯示器連接器、一個移動工業處理器介面 (MIPI®) CSI-2 攝影機連接器、一個用於 WiFi 或藍牙模組的 M.2 連接器、2 個千兆位乙太網路連接埠、用於偵錯輸出的 (...)

使用指南: PDF | HTML
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偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別,適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列,可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時,所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤,則需要 XDS560v2 PRO TRACE

德州儀器 XDS110 透過 TI 20 針腳連接器(具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器)連接到目標電路板,並透過 USB2.0 (...)

使用指南: PDF
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偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器(模擬器)。對於大多數裝置,建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

XDS200 透過 TI 20 接腳連接器(配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器)連接到目標電路板,並透過 USB2.0 高速 (...)

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偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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偵錯探測器

LB-3P-TRACE32-ARM — 適用於 Arm® 架構微控制器和處理器的 Lauterbach TRACE32® 偵錯和追蹤系統

Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件,可讓開發人員分析、最佳化及認證各種 Arm® 架構微控制器和處理器。全球知名的嵌入式系統和 SoC 偵錯和追蹤解決方案是完美的解決方案,適用於從早期的矽前 (pre-silicon) 開發,到產品認證和現場故障排除等所有開發階段。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能,以及可隨需求變化而調整和成長的系統。藉由 TRACE32® 偵錯器,開發人員也可透過單一偵錯介面,同時偵錯和控制 SoC 中的任何 C28x/C29x/C6x/C7x DSP 核心及所有其他 Arm (...)

偵錯探測器

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

軟體開發套件 (SDK)

MCU-PLUS-SDK-AM62P MCU+ SDK for AM62P – RTOS, No-RTOS

The AM62P processor Linux®, Android™ and TI MCU+ software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across our broad portfolio for which (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-ANDROID-AM62P Processor SDK Android for AM62P

The AM62P processor Linux®, Android™ and TI MCU+ software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across our broad portfolio for which (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-AM62P Processor SDK Linux for AM62P

The AM62P processor Linux®, Android™ and TI MCU+ software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across our broad portfolio for which (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-RT-AM62P Processor SDK Linux RT for AM62P

The AM62P processor Linux®, Android™ and TI MCU+ software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across our broad portfolio for which (...)

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應用軟體及架構

CANDERA-3P-CGI-STUDIO — 適用於 AM62x Sitara 處理器的 Candera CGI Studio HMI 開發軟體

Candera CGI Studio is a powerful design tool for creating dynamic HMIs across diverse industries. It provides an intuitive workflow with state-of-the-art 2D/3D graphics, scalable architecture, and full multi-language support. Designed for efficiency and flexibility, it enables seamless (...)
從:Candera GmbH
應用軟體及架構

EB-3P-TRESOS — Elektrobit EB tresos Classis AUTOSAR 軟體

Elektrobit 在基本軟體領域擁有數十年經驗,其 EB tresos 產品線和自訂 Classic AUTOSAR 解決方案,可提供最先進的軟體,協助滿足各個汽車製造商的特定需求。Elektrobit 可對每個專案提供符合汽車 AUTOSAR 需求的適當解決方案,從符合 OSEK/VDX 規範的基本軟體,到以 Classic AUTOSAR 為基礎的多核心與功能安全系統,都包含在內。
從:Elektrobit
韌體

DDR-MARGIN-FW Firmware and scripts to measure system DDR margin

The DDR margin firmware and supporting scripts allow visualization and measurement of system margin in the DDR interface on board. These tools enable probe-less measurement of critical data signals to understand the integrity and robustness of the interface.
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快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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IDE、配置、編譯器或偵錯程式

DDR-CONFIG-AM62P DDR Configuration Tool

This SysConfig based tool simplifies the process of configuring the DDR Subsystem Controller and PHY to interface to SDRAM devices. Based on the memory device, board design, and topology the tool outputs files to initialize and train the selected memory.
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IDE、配置、編譯器或偵錯程式

K3-RESOURCE-CONFIGURATION Resource partitioning tool for multi core SOCs

Also known as the k3-respart-tool, the Resource Configuration tool allows for configuration of various system level parameters and generate the necessary data to be fed into software components
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IDE、配置、編譯器或偵錯程式

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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線上培訓

AM62P-ACADEMY AM62P Academy

AM62P Academy is designed to simplify and accelerate custom AM62Px development.
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作業系統 (OS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
作業系統 (OS)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

The µ-velOSity™ Safety RTOS is the smallest of Green Hills Software's real-time operating systems and was designed especially for microcontrollers. It supports a wide range of TI processor families using the Arm® Cortex-M or Cortex-R cores as a main CPU or as a co-processors (...)
作業系統 (OS)

WHIS-3P-SAFERTOS — WITTENSTEIN SAFERTOS 預先認證的安全 RTOS

SAFERTOS® 是專為嵌入式處理器設計的獨特即時作業系統。經 TÜV SÜD 預先認證,符合 IEC 61508 SIL3 與 ISO 26262 ASILD 標準。SAFERTOS® 是由 WHIS 專家團隊專為安全而打造,適用於全球重要安全應用。WHIS 與德州儀器的合作已經超過十年。在此期間,WHIS 已將 SAFERTOS® 移植至各種 TI 處理器,支援所有熱門核心,並可依要求提供其他架構。SAFERTOS® 專為您的特定處理器/編譯器組合量身打造,隨附完整的原始程式碼與設計保證包,可完全一目了然整個設計生命週期。許多 WHIS 客戶開始使用 FreeRTOS (...)
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PROCESSOR-SDK-QNX-AM62P Processor SDK QNX for AM62P

The AM62P processor Linux®, Android™ and TI MCU+ software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across our broad portfolio for which (...)

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支援軟體

VCTR-3P-MICROSAR — 適用於微控制器和高性能電腦 (HPC) 的 Vector MICROSAR AUTOSAR 軟體

MICROSAR 與 DaVinci 產品系列透過適用於微控制器與 HPC 的精密嵌入式軟體和強大開發工具,簡化 ECU 開發。有了先進的基礎架構軟體,您即可為 ECU 建立最佳基礎,並利用相關工具簡化所有相關開發作業。MICROSAR 嵌入式軟體是根據 AUTOSAR 經典和適應性等相關標準所開發。軟體也適合符合最高 ASIL D 之 ISO 26262 標準的安全相關應用。此外,智慧網路安全功能可保護控制單元免受未經授權的存取和竄改。Vector 涵蓋所有汽車與其他工業應用的使用案例。對於配備高性能電腦的軟體定義車輛 (SDV),其可提供現代車輛作業系統,以做為開放式模組化軟體生態系統。
模擬型號

AM62P and AM62P-Q1 Sitara™ BSDL Model (Rev. A)

SPRM827A.ZIP (10 KB) - BSDL Model
模擬型號

AM62Px Sitara™ AMI Model

SPRM826.ZIP (61927 KB) - IBIS-AMI Model
模擬型號

AM62Px Sitara™ IBIS Model (Rev. C)

SPRM825C.ZIP (3296 KB) - IBIS Model
模擬型號

AM62Px Sitara™ Thermal Model

SPRM828.ZIP (1 KB) - Thermal Model
模擬工具

AM62P-EMMC-BIT-PATTERN-SIM-TOOL AM62P EVM eMMC HS400 SI Simulation bit pattern text file

This text file patterns are designed to exercise the system to real, but worst-case conditions in SI Simulation
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCBGA (AMH) 466 Ultra Librarian

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  • 認證摘要
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