產品詳細資料

Protocols 6LoWPAN, IEEE 802.15.4, MIOTY, Wi-SUN, Wi-SUN NWP, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, OOK Frequency bands 861-1054 Type Wireless module TX power (max) (dBm) 14, 20 RAM (kByte) 88 Flash memory (kByte) 352 CPU Arm Cortex-M4F Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 8-bit DAC, I2C, I2S, Real-time clock (RTC) Number of GPIOs 30 RX current (lowest) (mA) 5.8 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled No
Protocols 6LoWPAN, IEEE 802.15.4, MIOTY, Wi-SUN, Wi-SUN NWP, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, OOK Frequency bands 861-1054 Type Wireless module TX power (max) (dBm) 14, 20 RAM (kByte) 88 Flash memory (kByte) 352 CPU Arm Cortex-M4F Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 8-bit DAC, I2C, I2S, Real-time clock (RTC) Number of GPIOs 30 RX current (lowest) (mA) 5.8 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled No
QFM (MOT) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.9 mA active mode, CoreMark
    • 60 µA/MHz running CoreMark®
    • 0.9 µA standby mode, RTC, 80KB SRAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 5.8 mA RX at 868 MHz
    • 28.7 mA TX at +14 dBm at 868 MHz
    • 62 mA TX at +19 dBm at 915 MHz
    • 86 mA TX at +20 dBm at 915 MHz

Wireless protocol support

High-performance radio

  • –119 dBm for 2.5 kbps long-range mode
  • –108 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +20 dBm with temperature and voltage compensation

Regulatory compliance

  • Certified module for:
    • FCC CFR47 Part 15
    • ISED Certified (Canada)

  • Suitable for systems targeting compliance with:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to 30 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC, two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • 1.8 V to 3.8 V single supply voltage
  • –40 to +105°C (+14 dBm PA)
  • –40 to +95°C (+20 dBm PA)

All necessary components integrated

  • 48-MHz crystal: RF accuracy ±10 ppm initial and over temperature
  • 32-kHz crystal: RTC accuracy ±50 ppm initial and over temperature
  • DC/DC converter components and decoupling
  • Single-RF pin for RX/TX with 50 Ohm impedance.

Package

  • 7-mm × 7-mm MOT (30 GPIOs)
  • Pin-to-pin compatible with CC2652RSIP and CC2652PSIP
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.9 mA active mode, CoreMark
    • 60 µA/MHz running CoreMark®
    • 0.9 µA standby mode, RTC, 80KB SRAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 5.8 mA RX at 868 MHz
    • 28.7 mA TX at +14 dBm at 868 MHz
    • 62 mA TX at +19 dBm at 915 MHz
    • 86 mA TX at +20 dBm at 915 MHz

Wireless protocol support

High-performance radio

  • –119 dBm for 2.5 kbps long-range mode
  • –108 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +20 dBm with temperature and voltage compensation

Regulatory compliance

  • Certified module for:
    • FCC CFR47 Part 15
    • ISED Certified (Canada)

  • Suitable for systems targeting compliance with:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to 30 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC, two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • 1.8 V to 3.8 V single supply voltage
  • –40 to +105°C (+14 dBm PA)
  • –40 to +95°C (+20 dBm PA)

All necessary components integrated

  • 48-MHz crystal: RF accuracy ±10 ppm initial and over temperature
  • 32-kHz crystal: RTC accuracy ±50 ppm initial and over temperature
  • DC/DC converter components and decoupling
  • Single-RF pin for RX/TX with 50 Ohm impedance.

Package

  • 7-mm × 7-mm MOT (30 GPIOs)
  • Pin-to-pin compatible with CC2652RSIP and CC2652PSIP
  • RoHS-compliant package

The SimpleLink™CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless module supporting Wi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm Cortex M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation and medical applications.

The CC1312PSIP has a low sleep current of 0.9 µA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-µA system current.

The CC1312PSIP has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP.

The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product to multiple communication standards. The common SimpleLink Low Power F2 SDK and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless module supporting Wi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm Cortex M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation and medical applications.

The CC1312PSIP has a low sleep current of 0.9 µA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-µA system current.

The CC1312PSIP has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP.

The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product to multiple communication standards. The common SimpleLink Low Power F2 SDK and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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CC2652PSIP 現行 具有整合式功率放大器的 SimpleLink™ 多協定 2.4-GHz 無線統級封裝模組 Pin-compatible RF module with 2.4-GHz support instead of Sub-1 GHz support
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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet CC1312PSIP SimpleLink™ Sub-1-GHz Wireless System-in-Package datasheet PDF | HTML 2023年 11月 29日
* Errata CC1312PSIP SimpleLink™ Wireless MCU Device PDF | HTML 2023年 6月 7日
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 2024年 6月 27日
Product overview TI Wi-SUN® FAN Stack - Software Overview (Rev. B) PDF | HTML 2025年 6月 9日
Application note Design Considerations for CC1312PSIP FCC and IC Certified RF Module PDF | HTML 2024年 9月 11日
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024年 8月 6日
Certificate LP-EM-CC1312PSIP EU Declaration of Conformity (DoC) 2023年 12月 1日
Application note TI 15.4-Stack Software PDF | HTML 2023年 10月 17日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021年 12月 20日
More literature Webinar: Wireless mesh networking 2021年 3月 4日
Application note Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 2020年 9月 14日
Application note CC13xx IQ Samples (Rev. B) PDF | HTML 2020年 8月 24日
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 2020年 1月 28日
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 2020年 1月 27日
Application note Debugging Communication Range (Rev. A) PDF | HTML 2019年 5月 23日
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 2019年 4月 15日
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 2019年 1月 10日
Product overview Meet the SimpleLink™ Sensor Controller 2019年 1月 4日
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 2018年 11月 5日
Application note Low-Power ADC Solution for CC13x2 and CC26x2 2018年 3月 2日
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs 2018年 2月 27日
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 2018年 2月 27日
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 2017年 3月 5日
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017年 2月 28日
Application note AN058 -- Antenna Selection Guide (Rev. B) 2010年 10月 6日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-EM-CC1312PSIP — 適用 SimpleLink™ Sub-1 GHz 無線 MCU 的 CC1312PSIP LaunchPad™ 開發套件

此 LaunchPad ™ 開發套件適用於 CC1312PSIP RF 系統級封裝 (SIP) 模組。RF 模組具備整合式功率放大器,可實現高達 +20dBm 的 Sub-1GHz 運作。支援的通訊協定包括 mioty、Wi-SUN®、TI 15.4 堆疊,以及 SimpleLink™ 低功耗 F2 軟體開發套件提供的 Sub-1GHz 專利 RF 通訊協定。這是一款分離式 LaunchPad 開發套件,因此不包含 XDS 偵錯器。建議的偵錯器爲 LP-XDS110 或 LP-XDS110ET。
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開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件,也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F2-SDK SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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軟體開發套件 (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

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快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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線上培訓

SIMPLELINK-ACADEMY-CC13XX-CC26XX SimpleLink™ CC13xx and CC26xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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計算工具

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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Gerber 檔案

CC1312PSIP LaunchPad Development Kit

SWRR186.ZIP (4451 KB)
封裝 針腳 CAD 符號、佔位空間與 3D 模型
QFM (MOT) 48 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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