CC1354P10

現行

支援 EdgeAI,具有 1MB + 296KB、+20dBm 的 SimpleLink™ Arm® Cortex®-M33 多頻段無線 MCU

產品詳細資料

Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 Security Arm® TrustZone® technology, Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure provisioning, Secure storage, Software IP protection Cryptographic accelerators AES, ECC, PKA, SHA-2, TRNG CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 Security Arm® TrustZone® technology, Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure provisioning, Secure storage, Software IP protection Cryptographic accelerators AES, ECC, PKA, SHA-2, TRNG CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RSK) 64 64 mm² 8 x 8

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU datasheet (Rev. B) 2023年 12月 14日
* Errata CC1354P10 SimpleLink Wireless MCU Device Revision B (Rev. B) PDF | HTML 2023年 11月 30日
* User guide CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 2023年 3月 23日
Application note How to Modify TX and RX Commands Imported/Exported from SysConfig or SmartRF™ Studio PDF | HTML 2026年 4月 30日
Application note TI Wi-SUN® Network Performance PDF | HTML 2025年 8月 1日
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024年 8月 6日
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2024年 5月 2日
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 2024年 5月 2日
Certificate LP-EM-CC1354P10-6 EU Declaration of Conformity (DoC) 2024年 4月 23日
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 2024年 4月 9日
Certificate LP-EM-CC1354P10-1 EU Declaration of Conformity (DoC) (Rev. A) 2023年 10月 25日
Application note TI 15.4-Stack Software PDF | HTML 2023年 10月 17日
Application brief Wireless MCUs Designed to Meet Complex IoT Requirements PDF | HTML 2023年 7月 12日
Application note 2.4-GHz, 10-dBm PA IPC for CC26x2P and CC1352P PDF | HTML 2022年 4月 5日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022年 2月 25日
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 2022年 2月 7日
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021年 12月 20日
Application note TI Bluetooth® Mesh Software Product Brief PDF | HTML 2021年 12月 17日
Technical article 4 questions to ask before choosing a Wi-SUN stack PDF | HTML 2021年 8月 13日
White paper Dynamic Multi-Protocol (DMM) Performance 2021年 4月 21日
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 2021年 4月 12日
Technical article How Wi-SUN® FAN improves connected infrastructures PDF | HTML 2020年 11月 19日
Technical article How TI helps expand connectivity beyond the front door with Amazon Sidewalk PDF | HTML 2020年 9月 21日
Application note Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 2020年 9月 14日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 2020年 3月 31日
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 2020年 1月 28日
Technical article Designing a building security system with the Sub-1 GHz Linux Gateway Software Dev PDF | HTML 2019年 9月 25日
More literature Understanding security features for SimpleLink™ Sub-1 GHz CC13x2 MCUs 2019年 6月 17日
More literature Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles 2019年 6月 17日
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 2019年 5月 29日
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 2019年 4月 15日
Technical article The “key” to security: Zigbee 3.0’s security features PDF | HTML 2019年 2月 5日
Product overview Out-of-box star-network solution: TI 15.4-Stack 2019年 1月 14日
Application note RF PCB Simulation Cookbook 2019年 1月 9日
Product overview Time Multiplexing: Concurrent Multi-standard Operation 2019年 1月 3日
White paper Migrating your proprietary solution to the SimpleLink™ WMCU 2018年 11月 7日
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 2018年 11月 5日
Technical article Unlock every door with the SimpleLink™ platform PDF | HTML 2018年 9月 19日
Application note Low-Power ADC Solution for CC13x2 and CC26x2 2018年 3月 2日
White paper Thread and Zigbee for home and building automation 2018年 3月 1日
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs 2018年 2月 27日
Application note Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 2018年 2月 27日
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 2017年 3月 5日
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017年 2月 28日

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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