Refer to the PDF data sheet for device specific package drawings
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The device package has been specially engineered with a new technology called Via Channel. The Via Channel Array technology allows larger than normal PCB via sizes and reduces PCB signal layers to be used in a PCB design with this 0.65-mm pitch package, and will substantially reduce PCB costs. Via Channel also allows PCB routing in only two signal layers (four layers total) due to the increased layer efficiency of the Via Channel BGA technology.