SPRUJ55D September 2023 – July 2025 AM263P2 , AM263P2-Q1 , AM263P4 , AM263P4-Q1
This section describes the Thermal Manager (TM) module in the device.
The TM module on the device enables thermal management of the device by providing control of on-chip temperature sensors.
The device has two temperature sensors (TSENSE0 and TSENSE1), each located near critical hotspots in the device die. There are two additional temperature sensors (TSENSE2, TSENSE3) at other locations in the device die.
Active temperature monitoring is available for two temperature sensors (TSENSE0 and TSENSE1) near the hotspots. The other two temperature sensors (TSENSE2, TSENSE3) are only for temperature readout.