Product details


DSP 2 C66x DSP MHz (Max) 1000, 500 Operating system Linux, Android, RTOS Security Debug security, Device identity, Isolation firewalls, Secure boot & storage & programming, Software IP protection Ethernet MAC 2-port 1Gb switch TI functional safety category Functional Safety-Compliant Rating Automotive Operating temperature range (C) -40 to 125 open-in-new Find other Digital signal processors (DSPs)


  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
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TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

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Technical documentation

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Type Title Date
* Data sheet TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) Feb. 04, 2020
* Errata TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) Oct. 01, 2019
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) Jul. 24, 2020
User guide TDA3x Technical Reference Manual (Rev. D) Jul. 29, 2019
Application note TDA2x/TDA2E Performance (Rev. A) Jun. 10, 2019
Technical article Bringing the next evolution of machine learning to the edge Nov. 27, 2018
Technical article Industry 4.0 spelled backward makes no sense – and neither does the fact that you haven’t heard of TI’s newest processor yet Oct. 30, 2018
Application note TDA3xx Tester On Chip (TESOC) (Rev. A) Oct. 19, 2018
Technical article How quality assurance on the Processor SDK can improve software scalability Aug. 22, 2018
Application note ECC/EDC on TDAxx (Rev. B) Jun. 13, 2018
Application note TMS320C66x XMC Memory Protection Jan. 31, 2018
Application note DSS Bit Exact Output (Rev. A) Jan. 12, 2018
Application note Flashing Utility - mflash Jan. 09, 2018
White paper Embedded low-power deep learning with TIDL Dec. 08, 2017
Application note Dynamic Backup Lines Nov. 14, 2017
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) Nov. 07, 2017
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) Nov. 03, 2017
Application note DSS BT656 Workaround for TDA2x (Rev. A) Nov. 03, 2017
Application note Safety Features on VisionSDK Oct. 26, 2017
Application note IISS Image Pipe for Alternate CFA Formats Aug. 16, 2017
User guide Safety Manual for TDA3x Automotive Vision Safety Critical Applications Processor Jul. 18, 2017
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) Dec. 15, 2016
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) Aug. 23, 2016
Technical article Clove: Low-Power video solutions based on Sitara™ AM57x processors Jul. 21, 2016
Application note ADC as Voltage Monitoring in TDA3x Jun. 20, 2016
Application note TDA3xx ISS Tuning and Debug Infrastructure Jun. 02, 2016
Application note ADAS Power Management Mar. 07, 2016
White paper Multicore SoCs stay a step ahead of SoC FPGAs Feb. 23, 2016
Application note TDA3x Error Signaling Module (ESM) Jan. 26, 2016
White paper Surround view camera systems for ADAS (Rev. A) Oct. 20, 2015
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device Aug. 13, 2014
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems Apr. 14, 2014
White paper TI Gives Sight to Vision-Enabled Automotive Technologies Oct. 16, 2013

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

D3 ADAS Development Kit
Provided by D3 Engineering
This fully functioning evaluation system speeds on-vehicle testing and development of multi-camera, real-time vision applications requiring intensive video analytics. It shortens development time of vision-based systems for automotive, transportation, and materials handling applications.The ADAS (...)
TDA3X Evaluation Module
document-generic User guide

The TDA3x evaluation module (EVM) is an evaluation platform designed to speed up development efforts and reduce time-to-market for ADAS applications. The EVM is based on the TDA3x SoC, which incorporates a heterogeneous, scalable architecture that includes a mixture of the following:

  • TI’s fixed (...)
  • Hardware
    • TDA3x Processor
    • 4GB DDR3L
    • 1GB QSPI, 512MB NOR
    • 256KB I2C EEPROM
    • SD/MMC Socket
    • LP8733 & LP8732 PMICs
  • Software
    • Vision SDK
    • StarterWare
  • Connectivity
    • Gigabit Ethernet (2)
    • Std CAN & CAN-FD interfaces
    • FPD-Link III Ser & Des
    • HDMI Ser & Des
    • NTSC/PAL composite video
    • Camera sensor support
    • External Display support
    • RS-232 (...)
D3 DesignCore TDA3x Automotive Starter Kit
Provided by D3 Engineering
This benchtop starter kit lets you evaluate embedded ADAS technology on an electronic platform designed with production in mind. Based on the Texas Instruments TDA3x advanced vision processor, it enables synchronous acquisition of four FPD-Link III HD data streams (video, radar, lidar, etc.) for (...)
D3 Engineering RVP-TDAx development kits
Provided by D3 Engineering
These rugged development kits are in a finalized product form-factor that lets you evaluate TI ADAS technology under realistic on-vehicle conditions. Accelerate development of autonomous vision-based navigation systems for automotive, transportation and materials handling applications. The (...)

Software development

Processor SDK for TDAx ADAS SoCs - Linux and TI-RTOS Support
PROCESSOR-SDK-TDAX Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video pre-processing (...)

RTOS SDK Key Features:

  • SYS-BIOS based SW stack for A15, IPU, C66x and EVE
  • SYS-BIOS based Device Drivers, Power management, Inter-processor communication (IPC), Networking Stack and Filesystem
  • TI Deep Learning library
  • Radar applets and kernels
  • EVE and DSP SW library and demo algorithms
  • More than 10 use (...)
QNX Neutrino RTOS
Provided by QNX Software Systems — The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
StradVision SVNet - TDAx-based deep learning and camera based perception software
Provided by Stradvision — StradVision enables deep learning-based embedded perception algorithms on TDAx for Advanced Driver Assistance Systems (ADAS) and automated driving features. SVNet's lean and light characteristics enable more headroom for mutiple simultaneous functions, swift development and optimization, and (...)

Design tools & simulation

Clock Tree Tool for Sitara, Automotive, Vision Analytics, & Digital Signal Processors
CLOCKTREETOOL The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree elements (...)
document-generic User guide
Pin mux tool
PINMUXTOOL The PinMux Utility is a software tool which provides a Graphical User Interface for configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs. Results are output as C header/code files that can be imported into software development kits (SDKs) or (...)
Arm-based MPU, arm-based MCU and DSP third-party search tool
PROCESSORS-3P-SEARCH TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
  • Supports many TI processors including Sitara and Jacinto processors and DSPs
  • Search by type of product, TI devices supported, or country
  • Links and contacts for quick engagement
  • Third-party companies located around the world

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Ordering & quality

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  • Ongoing reliability monitoring

Support & training

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