SoC processor w/ 500 MHz C66x DSP and 2 dual Arm Cortex-M4 for audio amplifier
Product details
Parameters
Features
- Architecture designed for infotainment applications
- Up to 2 C66x floating-point VLIW DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
- Up to 512kB of on-chip L3 RAM
- Level 3 (L3) and Level 4 (L4) interconnects
- Memory Interface (EMIF) module
- Supports DDR3/DDR3L up to DDR-1066
- Supports DDR2 up to DDR-800
- Up to 2GB supported
- Dual Arm® Cortex®-M4 (IPU)
- Vision accelerationPac
- Embedded Vision Engine (EVE)
- Display subsystem
- Display controller with DMA engine
- CVIDEO / SD-DAC TV analog composite output
- On-chip temperature sensor that is capable of generating temperature alerts
- General-Purpose Memory Controller (GPMC)
- Enhanced Direct Memory Access (EDMA) controller
- 3-port (2 external) Gigabit Ethernet (GMAC) switch
- Controller Area Network (DCAN) module
- CAN 2.0B protocol
- Modular Controller Area Network (MCAN) module
- CAN 2.0B protocol
- Eight 32-bit general-purpose timers
- Three configurable UART modules
- Four Multichannel Serial Peripheral Interfaces (McSPI)
- Quad SPI interface
- Two Inter-Integrated Circuit (I2C™) ports
- Three Multichannel Audio Serial Port (McASP) modules
- Secure Digital Input Output Interface (SDIO)
- Up to 126 General-Purpose I/O (GPIO) pins
- Power, reset, and clock management
- On-chip debug with CTools technology
- Automotive AEC-Q100 qualified
- 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
- Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
- 8-channel 10-bit ADC
- PWMSS
- Video and image processing support
- Full-HD video (1920 × 1080p, 60 fps)
- Video input and video output
- GPIOs when not used for video
- Video Input Port (VIP) module
- Support for up to 4 multiplexed input ports
Description
The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.
Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.
The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.
The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.
Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.
The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.
More Information
For more information on the DRA780 Request Now
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The Jacinto™ DRA78x evaluation module (EVM) is an evaluation platform designed to speed up development efforts and reduce time-to-market for Radio Signal Processor (RSP) applications. The EVM is based on the Jacinto DRA78x SoC, which incorporates a heterogeneous, scalable architecture (...)
Features
- Hardware
- DRA78x Processor
- 512MB DDR3L
- LP8733/LP8732 Power Management ICs
- Quad-SPI: 1Gbit
- NOR: 512Mbit
- Software
- Linux
- Android
- StarterWare
- Connectivity
- Gigabit Ethernet
- Micro SD Card
- HDMI
- FPD-Link III, Serializer and De-serializer
- CAN Interface, 2-wire PHY
- CAN-FD Interface, 2-wire PHY
Software development
Processor SDK Linux Automotive is the foundational software development platform for TI's Jacinto™ DRAx family of Infotainment SoCs. The software framework allows users to develop feature-rich Infotainment solutions such as reconfigurable digital instrument (...)
Features
- Open Linux support
- Linux kernel and Bootloaders
- File system
- Qt/Webkit application framework
- 3D graphics support
- 2D graphics support
- Integrated WLAN and Bluetooth® support
- GUI-based application launcher
- Example applications, including:
- ARM benchmarks: Dhrystone, Linpack (...)
Design tools & simulation
- Visualize the device clock tree
- Interact with clock tree elements (...)
Features
- Supports many TI processors including Sitara and Jacinto processors and DSPs
- Search by type of product, TI devices supported, or country
- Links and contacts for quick engagement
- Third-party companies located around the world
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| FCBGA (ABF) | 367 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.