首頁 微控制器 (MCU) 與處理器 微處理器和 DSP 音訊與雷達 DSP SoC
首頁
微控制器 (MCU) 與處理器
微處理器和 DSP
音訊與雷達 DSP SoC

AM2732

現行

雙核心 Arm® Cortex-R5F 架構 MCU，具有 C66x DSP、乙太網路和最高達 400 MHz 的安全性

立即訂購
產品規格表
使用指南
勘誤表

AM2732

現行
產品規格表 立即訂購

產品詳細資料

CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP, Radar Hardware Accelerator, Radar hardware accelerator Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive, Catalog Operating temperature range (°C) -40 to 105 Ethernet MAC only
CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP, Radar Hardware Accelerator, Radar hardware accelerator Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive, Catalog Operating temperature range (°C) -40 to 105 Ethernet MAC only
NFBGA (ZCE) 285 169 mm² 13 x 13

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.
filter 尋找其它 音訊與雷達 DSP SoC
下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
引腳對引腳且具備與所比較裝置相同的功能
AM2732-Q1 現行 最高達 400 MHz 的車用雙核心 Arm® Cortex-R5F 架構 MCU，具有 C66x DSP、乙太網路、安全和安全性 Automotive qualified version of AM2732

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 14
重要文件 類型 標題 格式選項 日期
* Data sheet AM273x Sitara™ Microcontrollers datasheet (Rev. C) PDF | HTML 2025年 6月 6日
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 (Rev. C) PDF | HTML 2025年 5月 14日
* User guide AM273x Technical Reference Manual (Rev. E) 2025年 4月 10日
Application brief AM273x QSPI Flash Selection Guide (Rev. A) PDF | HTML 2025年 4月 7日
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 2025年 1月 28日
Application note AM273x Hardware Design Guide (Rev. A) PDF | HTML 2023年 11月 27日
Product overview Functional Safety for AM2x and Hercules™ Microcontrollers PDF | HTML 2023年 11月 8日
Application note Sitara MCU Thermal Design PDF | HTML 2023年 9月 11日
Application note Integration of MbedTLS on SITARA MCU Devices PDF | HTML 2023年 8月 3日
User guide 10-kW, Three-Phase, Three-Level (T-Type) Inverter Using AM263 PDF | HTML 2023年 7月 11日
Application note Debugging Sitara AM2x Microcontrollers PDF | HTML 2022年 10月 24日
Application note Optimized Trigonometric Functions on TI Arm Cores (Rev. A) PDF | HTML 2022年 8月 8日
More literature New Product Update: AM2732 2022年 3月 17日
Application note Power Estimation Tool PDF | HTML 2021年 12月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

AWR2243BOOST — AWR2243 第二代 76-GHz 至 81-GHz 高效能車用 MMIC 評估模組

AWR2243 BoosterPack™ 外掛模組是一款易於使用的評估電路板，適用於單晶片 AWR2243 mmWave 感測裝置。

AWR2243BOOST 包含開始使用 MMWAVE-STUDIO 環境和 DCA1000 即時資料擷取轉接器進行開發所需的一切。

標準 20 針腳 BoosterPack 外掛模組接頭讓評估電路板相容於各種 MCU LaunchPad 開發套件，並可輕鬆進行原型設計。

使用指南: PDF | HTML
TI.com 無法提供
開發板

TMDS273EVM — 適用於 Arm 架構 MCU 的 AM273x 評估模組

AM273x 評估模組(EVM) 是獨立的測試、、開發與評估平台，可供開發人員評估 AM273x 功能性，並為各種應用開發原型。

TMDS273EVM 配備了 Sitara™ AM2732 微控制器以及其他零組件，可讓使用者使用各種裝置介面，其中包括 CSI-2 RX、乙太網路、雙 CAN-FD 及其他功能來輕鬆建立原型。板載電流測量功能可用於監控節能應用的功耗。供應的 USB 傳輸線配對嵌入式模擬邏輯，允許使用標準開發工具如 Code Composer Studio (CCSTUDIO) 來進行模擬與偵錯。

請注意 TMDS273EVM 是 TMS273GPEVM (...)

使用指南: PDF | HTML
TI.com 無法提供
偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

使用指南: PDF
TI.com 無法提供
偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

TI.com 無法提供
偵錯探測器

LB-3P-TRACE32-ARM — 適用於 Arm® 架構微控制器和處理器的 Lauterbach TRACE32® 偵錯和追蹤系統

Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件，可讓開發人員分析、最佳化及認證各種 Arm® 架構微控制器和處理器。全球知名的嵌入式系統和 SoC 偵錯和追蹤解決方案是完美的解決方案，適用於從早期的矽前 (pre-silicon) 開發，到產品認證和現場故障排除等所有開發階段。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能，以及可隨需求變化而調整和成長的系統。藉由 TRACE32® 偵錯器，開發人員也可透過單一偵錯介面，同時偵錯和控制 SoC 中的任何 C28x/C29x/C6x/C7x DSP 核心及所有其他 Arm (...)

從：Lauterbach GmbH
View Options
偵錯探測器

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

從：TASKING Germany GmbH
View Options
Third-party accessory

VCTR-3P-VX1000 — VX1000 量測與校準介面硬體

VX1000 硬體能讓 CANape 等量測與校準工具以高效能且對執行階段影響極小的方式存取 ECU。此硬體專為車用設計，但亦可應用於測試平台與實驗室環境。憑藉其高度擴展性與廣泛的產品組合，VX1000 硬體能為各種應用場景提供合適的解決方案。
該系統由兩大主要元件組成：基礎模組與插接裝置。VX1000 系列支援多種控制器，包括 Sitara 系列（AM263、AM263P、AM275）、Jacinto 系列 (TDA4)、AWR1843、AWR2944、MSPM0x 及 TM4C129。JTAG、SWD、Aurora 與 Nexus-Aux 是 VX1000 可直接支援的主流控制器介面。

從：Vector Informatik GmbH
造訪合作夥伴網站
軟體開發套件 (SDK)

EP-DSP-TPR12-SECURITY — Preliminary software & documents for early engagement customers

The MCU+ SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demos.  This software accelerates application development schedules by eliminating the need to create basic system (...)

支援產品和硬體

支援產品和硬體
要求
軟體開發套件 (SDK)

MCU-PLUS-SDK-AM273X — MCU+ SDK for AM273x – RTOS, No-RTOS

The MCU+ SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demos.  This software accelerates application development schedules by eliminating the need to create basic system (...)

支援產品和硬體

支援產品和硬體
瀏覽 下載選項
軟體開發套件 (SDK)

MMWAVE-MCUPLUS-SDK — mmWave SDK for AWR2944 and AM2732

The mmWave microcontroller (MCU) plus software development kit (SDK) is a collection of software packages that enable application evaluation and development on TI mmWave sensors. This tool includes the MMWAVE-MCUPLUS-SDK and companion packages to support your design needs.

MMWAVE-MCUPLUS-SDK is a (...)

支援產品和硬體

支援產品和硬體
下載選項
快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
支援產品和硬體

支援產品和硬體
開始使用
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
線上培訓

AM27X-ACADEMY — AM27x Academy

AM27x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
支援產品和硬體

支援產品和硬體
瀏覽
作業系統 (OS)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

The µ-velOSity™ Safety RTOS is the smallest of Green Hills Software's real-time operating systems and was designed especially for microcontrollers. It supports a wide range of TI processor families using the Arm® Cortex-M or Cortex-R cores as a main CPU or as a co-processors (...)
從：Green Hills Software
造訪合作夥伴網站
軟體程式設計工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
模擬型號

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
下載
模擬型號

AM273x IBIS Model

SPRM789.ZIP (2167 KB) - IBIS Model
下載
模擬型號

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
下載
計算工具

SPRM803 — AM273x Power Estimation Tool

支援產品和硬體

支援產品和硬體
下載
封裝 針腳 CAD 符號、佔位空間與 3D 模型
NFBGA (ZCE) 285 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片